Intel Q9400S Design Guidelines - Page 3

Contents 1 Introduction 11 1.1 Document Goals and Scope 11 1.1.1 1.1.2 1.1.3 Importance of Thermal Management 11 Document Goals 11 Document Scope 12 1.2 References 13 1.3 Definition of Terms 14 2 Processor Thermal/Mechanical Information 17 2.1 Mechanical Requirements 17 2.1.1 Processor Package 17 2.1.2 Heatsink Attach 19 2.1.2.1 General Guidelines 19 2.1.2.2 Heatsink Clip Load Requirement 19 2.1.2.3 Additional Guidelines 20 2.2 Thermal Requirements 20 2.2.1 Processor Case Temperature 20 2.2.2 Thermal Profile 21 2.2.3 TCONTROL 23 2.3 Heatsink Design Considerations 24 2.3.1 Heatsink Size 25 2.3.2 Heatsink Mass 25 2.3.3 Package IHS Flatness 26 2.3.4 Thermal Interface Material 26 2.4 System Thermal Solution Considerations 27 2.4.1 Chassis Thermal Design Capabilities 27 2.4.2 Improving Chassis Thermal Performance 27 2.4.3 Summary 28 2.5 System Integration Considerations 28 3 Thermal Metrology 29 3.1 Characterizing Cooling Performance Requirements 29 3.1.1 Example 31 3.2 Processor Thermal Solution Performance Assessment 31 3.3 Local Ambient Temperature Measurement Guidelines 32 3.4 Processor Case Temperature Measurement Guidelines 34 4 Thermal Management Logic and Thermal Monitor Feature 35 4.1 Processor Power Dissipation 35 4.2 Thermal Monitor Implementation 35 4.2.1 4.2.2 4.2.3 4.2.4 PROCHOT# Signal 36 Thermal Control Circuit 36 4.2.2.1 Thermal Monitor 36 4.2.2.2 Thermal Monitor 2 (TM2 37 Operation and Configuration 38 On-Demand Mode 39 Thermal and Mechanical Design Guidelines 3