Intel Q9400S Design Guidelines - Page 53
Reference Attach Mechanism
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Intel® Thermal/Mechanical Reference Design Information 5.7 Reference Attach Mechanism 5.7.1 Structural Design Strategy Structural design strategy for the reference design is to minimize upward board deflection during shock to help protect the LGA775 socket. The reference design uses a high clip stiffness that resists local board curvature under the heatsink, and minimizes, in particular, upward board deflection (Figure 15). In addition, a moderate preload provides initial downward deflection. Figure 15. Upward Board Deflection During Shock Shock Load Less curvature in region under stiff clip The target metal clip nominal stiffness is 540 N/mm [3100 lb/in]. The combined target for reference clip and fasteners nominal stiffness is 380 N/mm [2180 lb/in]. The nominal preload provided by the reference design is 191.3 N ± 44.5 N [43 lb ± 10 lb]. Note: Intel reserves the right to make changes and modifications to the design as necessary to the reference design, in particular the clip and fastener. Thermal and Mechanical Design Guidelines 53