Intel Q9400S Design Guidelines - Page 65
A.2.3, Board Deflection Limits
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LGA775 Socket Heatsink Loading Figure 24. Board Deflection Definition d1 d'1 d2 d'2 A.2.3 Board Deflection Limits Deflection limits for the ATX/µATX form factor are: d_BOL - d_ref ≥ 0.09 mm and d_EOL - d_ref ≥ 0.15 mm And d'_BOL - d'_ref ≥ 0.09 mm and d_EOL' - d_ref' ≥ 0.15 mm NOTES: 1. The heatsink preload must remain within the static load limits defined in the processor datasheet at all times. 2. Board deflection should not exceed motherboard manufacturer specifications. Thermal and Mechanical Design Guidelines 65
LGA775 Socket Heatsink Loading
Thermal and Mechanical Design Guidelines
65
Figure 24. Board Deflection Definition
d1
d2
d’1
d’2
A.2.3
Board Deflection Limits
Deflection limits for the ATX/μATX form factor are:
d_BOL - d_ref
≥
0.09 mm
and
d_EOL - d_ref
≥
0.15 mm
And
d’_BOL – d’_ref
≥
0.09 mm
and
d_EOL’ – d_ref’
≥
0.15 mm
NOTES:
1.
The heatsink preload must remain within the static load limits defined in the processor
datasheet at all times.
2.
Board deflection should not exceed motherboard manufacturer specifications.