Intel Q9400S Design Guidelines - Page 5

Appendix C Appendix D Appendix E B.2 Test Preparation 69 B.2.1 Heatsink Preparation 69 B.2.2 Typical Test Equipment 72 B.3 Test Procedure Examples 72 B.3.1 Time-Zero, Room Temperature Preload Measurement 73 B.3.2 Preload Degradation under Bake Conditions 73 Thermal Interface Management 75 C.1 Bond Line Management 75 C.2 Interface Material Area 75 C.3 Interface Material Performance 75 Case Temperature Reference Metrology 77 D.1 Objective and Scope 77 D.2 Supporting Test Equipment 77 D.3 Thermal calibration and controls 78 D.4 IHS Groove 79 D.5 Thermocouple Attach Procedure 84 D.5.1 D.5.2 D.5.3 D.5.4 Thermocouple Conditioning and Preparation 84 Thermocouple Attachment to the IHS 85 Solder Process 90 Cleaning and Completion of Thermocouple Installation 93 D.6 Thermocouple Wire Management 96 Balanced Technology Extended (BTX) System Thermal Considerations 99 Appendix F Mechanical Drawings 103 Appendix G Intel® Enabled Reference Solution Information 123 Thermal and Mechanical Design Guidelines 5