Intel Q9400S Design Guidelines - Page 6

Intel Q9400S - Core 2 Quad 2.66GHz 6M L2 Cache 1333MHz LGA775 Low Power Processor Manual

Page 6 highlights

Figures Figure 1. Package IHS Load Areas 17 Figure 2. Processor Case Temperature Measurement Location 21 Figure 3. Example Thermal Profile 23 Figure 4. Processor Thermal Characterization Parameter Relationships 30 Figure 5. Locations for Measuring Local Ambient Temperature, Active Heatsink ........33 Figure 6. Locations for Measuring Local Ambient Temperature, Passive Heatsink ......33 Figure 7. Thermal Monitor Control 37 Figure 8. Thermal Monitor 2 Frequency and Voltage Ordering 38 Figure 9. TCONTROL for Digital Thermometer 41 Figure 10. Intel® RCFH-4 Reference Design - Exploded View 43 Figure 11. Intel D60188-001 Reference Design ─ Exploded View 44 Figure 12. Bottom View of Copper Core Applied by TC-1996 Grease 45 Figure 13. Random Vibration PSD 49 Figure 14. Shock Acceleration Curve 50 Figure 15. Upward Board Deflection During Shock 53 Figure 16. Reference Clip/Heatsink Assembly 54 Figure 17. Critical Parameters for Interfacing to Reference Clip 55 Figure 18. Critical Core Dimension 55 Figure 19. Intel® Quiet System Technology Overview 58 Figure 20. PID Controller Fundamentals 59 Figure 21. Intel® Quiet System Technology Platform Requirements 60 Figure 22. Example Acoustic Fan Speed Control Implementation 61 Figure 23. Digital Thermal Sensor and Thermistor 62 Figure 24. Board Deflection Definition 65 Figure 25. Example: Defining Heatsink Preload Meeting Board Deflection Limit ........67 Figure 26. Load Cell Installation in Machined Heatsink Base Pocket (Bottom View) ...70 Figure 27. Load Cell Installation in Machined Heatsink Base Pocket (Side View)........71 Figure 28. Preload Test Configuration 71 Figure 29. Omega Thermocouple 78 Figure 30. 775-LAND LGA Package Reference Groove Drawing at 6 o'clock Exit ........ 80 Figure 31. 775-LAND LGA Package Reference Groove Drawing at 3 o'clock Exit (Old Drawing 81 Figure 32. IHS Groove at 6 o'clock Exit on the 775-LAND LGA Package 83 Figure 33. IHS Groove Orientation at 6 o'clock Exit Relative to the LGA775 Socket ...83 Figure 34. Inspection of Insulation on Thermocouple 84 Figure 35. Bending the Tip of the Thermocouple 85 Figure 36. Securing Thermocouple Wires with Kapton* Tape Prior to Attach 85 Figure 37. Thermocouple Bead Placement 86 Figure 38. Position Bead on the Groove Step 87 Figure 39. Detailed Thermocouple Bead Placement 87 Figure 40. Third Tape Installation 88 Figure 41. Measuring Resistance between Thermocouple and IHS 88 Figure 42. Applying Flux to the Thermocouple Bead 89 Figure 43. Cutting Solder 89 Figure 44. Positioning Solder on IHS 90 Figure 45. Solder Station Setup 91 Figure 46. View Through Lens at Solder Station 92 Figure 47. Moving Solder back onto Thermocouple Bead 92 Figure 48. Removing Excess Solder 93 Figure 49. Thermocouple Placed into Groove 94 Figure 50. Removing Excess Solder 94 Figure 51. Filling Groove with Adhesive 95 6 Thermal and Mechanical Design Guidelines

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6
Thermal and Mechanical Design Guidelines
Figures
Figure 1. Package IHS Load Areas
.....................................................................
17
Figure 2. Processor Case Temperature Measurement Location
...............................
21
Figure 3. Example Thermal Profile
.....................................................................
23
Figure 4. Processor Thermal Characterization Parameter Relationships
....................
30
Figure 5. Locations for Measuring Local Ambient Temperature, Active Heatsink
........
33
Figure 6. Locations for Measuring Local Ambient Temperature, Passive Heatsink
......
33
Figure 7. Thermal Monitor Control
.....................................................................
37
Figure 8. Thermal Monitor 2 Frequency and Voltage Ordering
................................
38
Figure 9. T
CONTROL
for Digital Thermometer
..........................................................
41
Figure 10. Intel
®
RCFH-4 Reference Design - Exploded View
.................................
43
Figure 11. Intel D60188-001 Reference Design
Exploded View
............................
44
Figure 12. Bottom View of Copper Core Applied by TC-1996 Grease
.......................
45
Figure 13. Random Vibration PSD
......................................................................
49
Figure 14. Shock Acceleration Curve
..................................................................
50
Figure 15. Upward Board Deflection During Shock
...............................................
53
Figure 16. Reference Clip/Heatsink Assembly
......................................................
54
Figure 17. Critical Parameters for Interfacing to Reference Clip
..............................
55
Figure 18. Critical Core Dimension
.....................................................................
55
Figure 19. Intel
®
Quiet System Technology Overview
...........................................
58
Figure 20. PID Controller Fundamentals
.............................................................
59
Figure 21. Intel
®
Quiet System Technology Platform Requirements
........................
60
Figure 22. Example Acoustic Fan Speed Control Implementation
............................
61
Figure 23. Digital Thermal Sensor and Thermistor
................................................
62
Figure 24. Board Deflection Definition
................................................................
65
Figure 25. Example: Defining Heatsink Preload Meeting Board Deflection Limit
........
67
Figure 26. Load Cell Installation in Machined Heatsink Base Pocket (Bottom View) ...70
Figure 27. Load Cell Installation in Machined Heatsink Base Pocket (Side View)
........
71
Figure 28. Preload Test Configuration
.................................................................
71
Figure 29. Omega Thermocouple
.......................................................................
78
Figure 30. 775-LAND LGA Package Reference Groove Drawing at 6 o’clock Exit
........
80
Figure 31. 775-LAND LGA Package Reference Groove Drawing at 3 o’clock Exit
(Old Drawing)
..................................................................................
81
Figure 32. IHS Groove at 6 o’clock Exit on the 775-LAND LGA Package
...................
83
Figure 33. IHS Groove Orientation at 6 o’clock Exit Relative to the LGA775 Socket ...83
Figure 34. Inspection of Insulation on Thermocouple
............................................
84
Figure 35. Bending the Tip of the Thermocouple
..................................................
85
Figure 36. Securing Thermocouple Wires with Kapton* Tape Prior to Attach
............
85
Figure 37. Thermocouple Bead Placement
...........................................................
86
Figure 38. Position Bead on the Groove Step
.......................................................
87
Figure 39. Detailed Thermocouple Bead Placement
..............................................
87
Figure 40. Third Tape Installation
......................................................................
88
Figure 41. Measuring Resistance between Thermocouple and IHS
..........................
88
Figure 42. Applying Flux to the Thermocouple Bead
.............................................
89
Figure 43. Cutting Solder
.................................................................................
89
Figure 44. Positioning Solder on IHS
..................................................................
90
Figure 45. Solder Station Setup
........................................................................
91
Figure 46. View Through Lens at Solder Station
...................................................
92
Figure 47. Moving Solder back onto Thermocouple Bead
.......................................
92
Figure 48. Removing Excess Solder
...................................................................
93
Figure 49. Thermocouple Placed into Groove
.......................................................
94
Figure 50. Removing Excess Solder
...................................................................
94
Figure 51. Filling Groove with Adhesive
..............................................................
95