Intel Q9400S Design Guidelines - Page 62

Intel® Quiet System Technology (Intel® QST)

62

Thermal and Mechanical Design Guidelines

6.3

Intel

®

QST Configuration and Tuning

Initial configuration of the Intel QST is the responsibility of the board manufacturer.

The SPI flash should be programmed with the hardware configuration of the

motherboard and initial settings for fan control, fan monitoring, voltage and thermal

monitoring. This initial data is generated using the Intel provided Configuration Tool

At the system integrator the Configuration Tool can be used again but this time to

tune the Intel QST subsystem to reflect the shipping system configuration. In the

tuning process the Intel QST can be modified to have the proper relationships between

the installed fans and sensors in the shipping system. A Weighting Matrix Utility and

Intel QST Log program are planned to assist in optimizing the fan management and

achieve acoustic goal.

See your Intel field sales representative for availability of these tools.

6.4

Fan Hub Thermistor and Intel

®

QST

There is no closed loop control between Intel QST and the thermistor, but they can

work in tandem to provide the maximum fan speed reduction. The BTX reference

design includes a thermistor on the fan hub. This Variable Speed Fan curve will

determine the maximum fan speed as a function of the inlet ambient temperature and

by design provides a



CA

sufficient to meet the thermal profile of the processor. Intel

QST, by measuring the processor digital thermal sensor will command the fan to

reduce speed below the VSF curve in response to processor workload. Conversely if

the processor workload increases the FSC will command the fan via the PWM duty

cycle to accelerate the fan up to the limit imposed by the VSF curve. Care needs to be

taken in BTX designs to ensure the fan speed at the minimum operating speed that

sufficient air flow is being provided to support the other system components.

Figure 23. Digital Thermal Sensor and Thermistor

Fan Speed

(RPM)

Inlet Temperature (°C)

Full

Speed

30

38

Min.

Operating

Variable Speed Fan

(VSF) Curve

Fan Speed

Operating Range

with FSC

34

Min %

Fan Speed

(% PWM Duty Cycle)

100 %

Fan Speed

(RPM)

Inlet Temperature (°C)

Full

Speed

30

38

Min.

Operating

Variable Speed Fan

(VSF) Curve

Fan Speed

Operating Range

with FSC

34

Min %

Fan Speed

(% PWM Duty Cycle)

100 %

§

Section	Page
1 Introduction	11
1.1 Document Goals and Scope	11
1.1.1 Importance of Thermal Management	11
1.1.2 Document Goals	11
1.1.3 Document Scope	12
1.2 References	13
1.3 Definition of Terms	14
2 Processor Thermal/Mechanical Information	17
2.1 Mechanical Requirements	17
2.1.1 Processor Package	17
2.1.2 Heatsink Attach	19
2.1.2.1 General Guidelines	19
2.1.2.2 Heatsink Clip Load Requirement	19
2.1.2.3 Additional Guidelines	20
2.2 Thermal Requirements	20
2.2.1 Processor Case Temperature	20
2.2.2 Thermal Profile	21
2.2.3 TCONTROL	23
2.3 Heatsink Design Considerations	24
2.3.1 Heatsink Size	25
2.3.2 Heatsink Mass	25
2.3.3 Package IHS Flatness	26
2.3.4 Thermal Interface Material	26
2.4 System Thermal Solution Considerations	27
2.4.1 Chassis Thermal Design Capabilities	27
2.4.2 Improving Chassis Thermal Performance	27
2.4.3 Summary	28
2.5 System Integration Considerations	28
3 Thermal Metrology	29
3.1 Characterizing Cooling Performance Requirements	29
3.1.1 Example	31
3.2 Processor Thermal Solution Performance Assessment	31
3.3 Local Ambient Temperature Measurement Guidelines	32
3.4 Processor Case Temperature Measurement Guidelines	34
4 Thermal Management Logic and Thermal Monitor Feature	35
4.1 Processor Power Dissipation	35
4.2 Thermal Monitor Implementation	35
4.2.1 PROCHOT# Signal	36
4.2.2 Thermal Control Circuit	36
4.2.2.1 Thermal Monitor	36
4.2.2.2 Thermal Monitor 2 (TM2)	37
4.2.3 Operation and Configuration	38
4.2.4 On-Demand Mode	39
4.2.5 System Considerations	39
4.2.6 Operating System and Application Software Considerations	40
4.2.7 THERMTRIP# Signal	40
4.2.8 Cooling System Failure Warning	40
4.2.9 Digital Thermal Sensor	41
4.2.10 Platform Environmental Control Interface (PECI)	42
5 Intel® Thermal/Mechanical Reference Design Information	43
5.1 ATX Reference Design Requirements	43
5.2 Validation Results for Reference Design	45
5.2.1 Heatsink Performance	45
5.2.2 Acoustics	46
5.2.3 Altitude	47
5.2.4 Reference Heatsink Thermal Validation	47
5.2.5 Fan Performance for Active Heatsink Thermal Solution	48
5.3 Environmental Reliability Testing	49
5.3.1 Structural Reliability Testing	49
5.3.1.1 Random Vibration Test Procedure	49
5.3.1.2 Shock Test Procedure	49
5.3.2 Power Cycling	51
5.3.3 Recommended BIOS/Processor/Memory Test Procedures	51
5.4 Material and Recycling Requirements	51
5.5 Safety Requirements	52
5.6 Geometric Envelope for Intel® Reference ATX Thermal Mechanical Design	52
5.7 Reference Attach Mechanism	53
5.7.1 Structural Design Strategy	53
5.7.2 Mechanical Interface to the Reference Attach Mechanism	54
6 Intel® Quiet System Technology (Intel® QST)	57
6.1 Intel® Quiet System Technology Algorithm	57
6.1.1 Output Weighting Matrix	58
6.1.2 Proportional-Integral-Derivative (PID)	58
6.2 Board and System Implementation of Intel® Quiet System Technology	60
6.3 Intel® QST Configuration and Tuning	62

Intel Q9400S Design Guidelines - Page 62

Intel, QST Configuration and Tuning, Fan Hub Thermistor and Intel

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