HP DL760 ProLiant DL760 Generation 2 Server Maintenance and Service Guide - Page 26
Preparation Procedures, Table 2-1, Module and Bay Components and Access
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Service Preparation Table 2-1: Module and Bay Components and Access describes the contents of the modules and how to access the components. Table 2-1: Module and Bay Components and Access Module I/O module with system fans Processor and memory module Media module Contents PCI Hot Plug expansion slots Configuration switches Fans 1 and 2 Processor (CPU) sockets Memory (DIMMs) CD-ROM/ Diskette/IMD Hot-plug hard drives Access Method Slide the I/O lid toward the front of the server. Slide the I/O lid toward the front of the server. Slide the I/O lid toward the front of the server. Remove the Processor and Memory Module and the processor board. Remove the memory cartridge. Access directly at the front of the server. Access directly at the front of the server. Preparation Procedures To access some components and perform certain service procedures, you must do one or more of the following: • Extend the server from the rack. If you are performing service procedures in an HP rack or third-party rack cabinet, you can user the locking feature of the rack rails to support the server and gain access to internal components. • Power down the server. If you must remove a server from a rack or a non-hot-plug component from a server, power down the server. • Remove the server from the rack. If the rack environment, cabling configuration, or the server location in the rack creates awkward conditions, remove the server from the rack. To service the ProLiant DL760 G2 server, you might need the following: • Flat-blade screwdriver (4 millimeter) • Torx T-15 screwdriver • Phillips screwdriver • HP SmartStart CD: HP ProLiant DL760 Generation 2 Server Maintenance and Service Guide 2-7 HP CONFIDENTIAL Codename: Jed Part Number: 201262-003 Last Saved On: 2/10/04 4:04 PM