Dell PowerEdge R7525 EMC Installation and Service Manual - Page 189

Table 80. Thermal restriction matrix continued, Table 81. GPU/FPGA thermal restriction matrix

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Table 80. Thermal restriction matrix (continued) Configuration 8 x 2.5inch NVMe 16 x 2.5inch SAS 16 x 2.5inch NVMe 16 x 2.5inch SAS + 8 x 2.5inch NVMe 24 x 2.5inch NVMe Rear storage No Rear No Rear No Rear No Rear No Rear Drives Drives Drives Drives Drives 8 x 3.5inch No Rear Drives 12 x 3.5-inch No Rear Drives 2 x Rear 2.5-inch No Rear Fan Ambient temperatu re " and 24x2.5 " chassi s have 30°C limitat ion. NOTE: Three fan modules are required for single processor, and six fan modules are required for dual processor system. NOTE: If the DIMM is 128 GB and above in a12 x 3.5-inch chassis with CPU TDP/cTDP is greater than 200 W or 12 x 3.5" + x2 rear-drive chassis with CPU TDP/cTDP greater than 170 W. Table 81. GPU/FPGA thermal restriction matrix Configura tion (Front storage) Fan type Max CPU TDP/cTDP GPU/FPGA ( Ambient temperature ) T4 V100 (16 GB) V100S M10 Snow white RTX 6000 RTX8000 No Backpane HPR 280 W 30°C 35°C 30°C 35°C 35°C 35°C 35°C 8 x 2.5- inch HPR NVMe 280 W 30°C 35°C 30°C 35°C 35°C 35°C 35°C 16 x 2.5inch SAS HPR 280 W 30°C 35°C 30°C 35°C 35°C 35°C 35°C 16 x 2.5- inch VHP NVMe 280 W 30°C 35°C 30°C 35°C 35°C 35°C 35°C 16 x 2.5inch SAS + 8 x 2.5- VHP inch NVMe 280 W 30°C 35°C 30°C 35°C 35°C 35°C 35°C 8 x 3.5inch SAS HPR 280 W 30°C 35°C 30°C 35°C 35°C 35°C 35°C NOTE: GPU is not supported in 12 x 3.5-inch hard drive and 24 x 2.5-inch NVMe configuration systems. NOTE: Low Profile and Full Height T4 cards are installed in order to support maximun 6 pcs T4 in x 16 slots. Table 82. Processor and heat sink matrix Heat sink STD HSK Processor TDP < 180 W Technical specifications 189

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Table 80. Thermal restriction matrix (continued)
Configuration
8 x 2.5-
inch
NVMe
16 x 2.5-
inch
SAS
16 x 2.5-
inch
NVMe
16 x 2.5-
inch
SAS + 8
x 2.5-
inch
NVMe
24 x 2.5-
inch
NVMe
8 x 3.5-
inch
12 x 3.5-inch
Ambient
temperatu
re
Rear storage
No Rear
Drives
No Rear
Drives
No Rear
Drives
No Rear
Drives
No Rear
Drives
No Rear
Drives
No Rear
Drives
2 x Rear
2.5-inch
No Rear
Fan
" and
24x2.5
"
chassi
s have
30°C
limitat
ion.
NOTE:
Three fan modules are required for single processor, and six fan modules are required for dual processor system.
NOTE:
If the DIMM is 128 GB and above in a12 x 3.5-inch chassis with CPU TDP/cTDP is greater than 200 W or 12 x 3.5"
+ x2 rear-drive chassis with CPU TDP/cTDP greater than 170 W.
Table 81. GPU/FPGA thermal restriction matrix
Configura
tion
(Front
storage)
Fan type
Max CPU
TDP/cTDP
GPU/FPGA ( Ambient temperature )
T4
V100 (16
GB)
V100S
M10
Snow
white
RTX 6000
RTX8000
No
Backpane
HPR
280 W
30°C
35°C
30°C
35°C
35°C
35°C
35°C
8 x 2.5-
inch
NVMe
HPR
280 W
30°C
35°C
30°C
35°C
35°C
35°C
35°C
16 x 2.5-
inch SAS
HPR
280 W
30°C
35°C
30°C
35°C
35°C
35°C
35°C
16 x 2.5-
inch
NVMe
VHP
280 W
30°C
35°C
30°C
35°C
35°C
35°C
35°C
16 x 2.5-
inch SAS
+ 8 x 2.5-
inch
NVMe
VHP
280 W
30°C
35°C
30°C
35°C
35°C
35°C
35°C
8 x 3.5-
inch SAS
HPR
280 W
30°C
35°C
30°C
35°C
35°C
35°C
35°C
NOTE:
GPU is not supported in 12 x 3.5-inch hard drive and 24 x 2.5-inch NVMe configuration systems.
NOTE:
Low Profile and Full Height T4 cards are installed in order to support maximun 6 pcs T4 in x 16 slots.
Table 82. Processor and heat sink matrix
Heat sink
Processor TDP
STD HSK
< 180 W
Technical specifications
189