Dell PowerEdge R840 EMC Installation and Service Manual - Page 164

Particulate and gaseous contamination specifications

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Table 42. Configuration-based ambient temperature restrictions with PCIe (continued) TDP(W) R840 • 8 x 2.5 inch SAS/SATA • 2 x CPU • 6 x PCIe R840 • 8 x 2.5 inch SAS/SATA • 4 x CPU • 6 x PCIe R840 • 24 x 2.5 inch SAS/SATA • 2 x CPU • 6 x PCIe R840 • 24 x 2.5 inch SAS/SATA • 4 x CPU • 6 x PCIe C40E 35 30 C40E 35 30 C40E 35 30 C40E 35 30 45 45 45 45 105 Y Y Y Y YY Y Y Y Y Y Y 100 Y Y Y Y YY Y Y Y Y Y Y 85 Y Y Y Y YY Y Y Y Y Y Y 70 Y Y Y Y YY Y Y Y Y Y Y R840 • 24 x 2.5 inch NVMe • 4 x CPU • 6 x PCIe C40 35 30 E45 N Y Y N Y Y N Y Y N Y Y N=Not Supported Y=Supported NOTE: C40E45 = Continuous operating temperature at 40°C, and Excursion temperature at 45°C. Particulate and gaseous contamination specifications The following table defines the limitations that help avoid any damages to the IT equipment and/or, or both failure from particulates and gaseous contamination. If the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer. Table 43. Particulate contamination specifications Particulate contamination Air Filtration Specifications Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit. NOTE: This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. NOTE: Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust Air must be free of conductive dust, zinc whiskers, or other conductive particles. NOTE: This condition applies to data center and nondata center environments. Corrosive dust • Air must be free of corrosive dust. • Residual dust present in the air must have a deliquescent point less than 60% relative humidity. NOTE: This condition applies to data center and nondata center environments. Table 44. Gaseous contamination specifications Gaseous contamination Copper Coupon Corrosion Silver Coupon Corrosion Specifications

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Table 42. Configuration-based ambient temperature restrictions with PCIe (continued)
TDP(W)
R840
•
8 x 2.5 inch
SAS/SATA
•
2 x CPU
•
6 x PCIe
R840
•
8 x 2.5 inch
SAS/SATA
•
4 x CPU
•
6 x PCIe
R840
•
24 x 2.5 inch
SAS/SATA
•
2 x CPU
•
6 x PCIe
R840
•
24 x 2.5 inch
SAS/SATA
•
4 x CPU
•
6 x PCIe
R840
•
24 x 2.5 inch
NVMe
•
4 x CPU
•
6 x PCIe
C40E
45
35
30
C40E
45
35
30
C40E
45
35
30
C40E
45
35
30
C40
E45
35
30
105
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
N
Y
Y
100
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
N
Y
Y
85
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
N
Y
Y
70
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
N
Y
Y
N=Not Supported
Y=Supported
NOTE:
C40E45 = Continuous operating temperature at 40°C, and Excursion temperature at 45°C.
Particulate and gaseous contamination specifications
The following table defines the limitations that help avoid any damages to the IT equipment and/or, or both failure from particulates and
gaseous contamination. If the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage or
failure, you must rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.
Table 43. Particulate contamination specifications
Particulate contamination
Specifications
Air Filtration
Data center air filtration as defined by ISO Class 8 per ISO 14644-1
with a 95% upper confidence limit.
NOTE:
This condition applies to data center
environments only. Air filtration requirements do not
apply to IT equipment designed to be used outside a data
center, in environments such as an office or factory
floor.
NOTE:
Air entering the data center must have MERV11
or MERV13 filtration.
Conductive dust
Air must be free of conductive dust, zinc whiskers, or other
conductive particles.
NOTE:
This condition applies to data center and non-
data center environments.
Corrosive dust
•
Air must be free of corrosive dust.
•
Residual dust present in the air must have a deliquescent point
less than 60% relative humidity.
NOTE:
This condition applies to data center and non-
data center environments.
Table 44. Gaseous contamination specifications
Gaseous contamination
Specifications
Copper Coupon Corrosion
<300 Å/month per Class G1 as defined by ANSI/ISA71.04-1985.
Silver Coupon Corrosion
<200 Å/month as defined by AHSRAE TC9.9.
164
Technical specifications