IBM 8872 Service Guide - Page 140

reinstalling - form instructions

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Note: The thermal adhesive material securing the heat sink to the microprocessor might have formed a strong bond. Gently rotate the heat sink back and forth to help break this bond. When the heat sink moves back and forth easily, the bond is broken. 12. Open the microprocessor-release lever and remove the microprocessor from the microprocessor socket. 13. If you are instructed to return the microprocessor tray and microprocessor, follow all packaging instructions, and use any packaging materials for shipping that are supplied to you. To install the replacement microprocessor tray and microprocessor, complete the following steps: 1. Lift the microprocessor-release lever to the fully open position (approximately 135° angle). Lever closed Lever fully open Attention: To avoid bending the pins on the microprocessor, do not use excessive force when pressing it into the socket. 2. Position the microprocessor over the microprocessor socket as shown in the following illustration. Carefully press the microprocessor into the socket. Microprocessor Microprocessor orientation indicator Microprocessor connector Microprocessorrelease lever 3. Close the microprocessor-release lever to secure the microprocessor. 4. Make sure that the heat-sink retaining clip is open. 5. If you are installing a new heat sink, remove the cover from the bottom of the heat sink. If you are reinstalling a heat sink that was previously removed, go to "Thermal grease" on page 125 for instructions on replacing the contaminated or missing thermal grease; then, return here and continue step 6. 6. If necessary, remove the cover from the bottom of the heat sink. 7. Position the heat sink above the microprocessor, making sure that the word "Front" is closest to the front of the server; then, press the heat sink into place and close the heat-sink release lever. 124 IBM xSeries 460 Type 8872 and xSeries MXE 460 Type 8874: Problem Determination and Service Guide

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Note:
The
thermal
adhesive
material
securing
the
heat
sink
to
the
microprocessor
might
have
formed
a
strong
bond.
Gently
rotate
the
heat
sink
back
and
forth
to
help
break
this
bond.
When
the
heat
sink
moves
back
and
forth
easily,
the
bond
is
broken.
12.
Open
the
microprocessor-release
lever
and
remove
the
microprocessor
from
the
microprocessor
socket.
13.
If
you
are
instructed
to
return
the
microprocessor
tray
and
microprocessor,
follow
all
packaging
instructions,
and
use
any
packaging
materials
for
shipping
that
are
supplied
to
you.
To
install
the
replacement
microprocessor
tray
and
microprocessor,
complete
the
following
steps:
1.
Lift
the
microprocessor-release
lever
to
the
fully
open
position
(approximately
135°
angle).
Lever closed
Lever fully
open
Attention:
To
avoid
bending
the
pins
on
the
microprocessor,
do
not
use
excessive
force
when
pressing
it
into
the
socket.
2.
Position
the
microprocessor
over
the
microprocessor
socket
as
shown
in
the
following
illustration.
Carefully
press
the
microprocessor
into
the
socket.
Microprocessor
orientation indicator
Microprocessor-
release lever
Microprocessor
connector
Microprocessor
3.
Close
the
microprocessor-release
lever
to
secure
the
microprocessor.
4.
Make
sure
that
the
heat-sink
retaining
clip
is
open.
5.
If
you
are
installing
a
new
heat
sink,
remove
the
cover
from
the
bottom
of
the
heat
sink.
If
you
are
reinstalling
a
heat
sink
that
was
previously
removed,
go
to
“Thermal
grease”
on
page
125
for
instructions
on
replacing
the
contaminated
or
missing
thermal
grease;
then,
return
here
and
continue
step
6.
6.
If
necessary,
remove
the
cover
from
the
bottom
of
the
heat
sink.
7.
Position
the
heat
sink
above
the
microprocessor,
making
sure
that
the
word
“Front”
is
closest
to
the
front
of
the
server;
then,
press
the
heat
sink
into
place
and
close
the
heat-sink
release
lever.
124
IBM
xSeries
460
Type
8872
and
xSeries
MXE
460
Type
8874:
Problem
Determination
and
Service
Guide