Sub power supply fan failure detection
............................................................
148
ETB fan failure detection
..................................................................................
148
Low-voltage power supply
................................................................................................
148
Fuser control circuit
..........................................................................................
149
Low-voltage power supply circuit
.....................................................................
151
Protective functions
.........................................................................
152
Safety
..............................................................................................
152
Sleep mode
.....................................................................................
152
Power supply recognition
................................................................
152
Heater temperature control
...............................................................................................
152
Initial rotation temperature control
...................................................................
153
Start-up temperature control
............................................................................
153
Print temperature control
.................................................................................
154
Between-sheets temperature control
...............................................................
154
Temperature protective function
.......................................................................................
154
Protective function by the CPU
........................................................................
154
Protective function by the fuser heater safety circuit
.......................................
154
Protective function by the thermoswitch
..........................................................
155
Temperature failure detection
...........................................................................................
155
Start-up failure (warm-up failure)
.....................................................................
155
Abnormal low temperature of main thermistor (no conduction)
.......................
155
Abnormal high temperature of main thermistor
...............................................
155
Abnormal low temperature of sub thermistor (no conduction)
.........................
155
Abnormal high temperature of sub thermistor
.................................................
156
Drive circuit abnormality
...................................................................................
156
High-voltage power supply
...............................................................................................
156
Generation of biases
........................................................................................
157
Sub power supply assembly
.............................................................................................
159
Video interface control
......................................................................................................
159
Laser/scanner system
.......................................................................................................................
161
Laser control
.....................................................................................................................
162
Scanner control
.................................................................................................................
163
Image formation system
....................................................................................................................
165
Image formation process
..................................................................................................
166
Electrostatic latent image formation block
........................................................................
168
Step 1: Pre-exposure
.......................................................................................
168
Step 2: Primary charging
.................................................................................
169
Step 3: Laser beam exposure
..........................................................................
169
Development block
...........................................................................................................
169
Step 4: Development
........................................................................................
169
Transfer block
...................................................................................................................
170
Step 5: Attraction
..............................................................................................
170
Step 6: Transfer
...............................................................................................
170
Step 7: Separation
...........................................................................................
171
Fusing block
......................................................................................................................
171
Step 8: Fusing
..................................................................................................
171
Cleaning block
..................................................................................................................
172
Step 9: Drum cleaning
......................................................................................
172
Print cartridges
..................................................................................................................
172
Memory tag
......................................................................................................
174
viii
ENWW