Intel E5310 Data Sheet - Page 107

Quad-Core Intel® Xeon® Processor 5300 Series Datasheet

107

Boxed Processor Specifications

8.2.2

Boxed Processor Heat Sink Weight

8.2.2.1

Thermal Solution Weight

The 1U passive/3U+ active combination heat sink solution and the 2U passive heat sink

solution will not exceed a mass of 1050 grams. Note that this is per processor, a dual

processor system will have up to 2100 grams total mass in the heat sinks. This large

mass will require a minimum chassis stiffness to be met in order to withstand force

during shock and vibration.

See

Section 3

for details on the processor weight.

8.2.3

Boxed Processor Retention Mechanism and Heat Sink

Support (CEK)

Baseboards and chassis designed for use by a system integrator should include holes

that are in proper alignment with each other to support the boxed processor. Refer to

the Server System Infrastructure Specification (SSI-EEB 3.6, TEB 2.1 or CEB 1.1).

These specification can be found at: http://www.ssiforum.org.

Figure 8-3

illustrates the Common Enabling Kit (CEK) retention solution. The CEK is

designed to extend air-cooling capability through the use of larger heat sinks with

minimal airflow blockage and bypass. CEK retention mechanisms can allow the use of

much heavier heat sink masses compared to legacy limits by using a load path directly

attached to the chassis pan. The CEK spring on the secondary side of the baseboard

provides the necessary compressive load for the thermal interface material. The

baseboard is intended to be isolated such that the dynamic loads from the heat sink are

transferred to the chassis pan via the stiff screws and standoffs. The retention scheme

reduces the risk of package pullout and solder joint failures.

All components of the CEK heat sink solution will be captive to the heat sink and will

only require a Phillips screwdriver to attach to the chassis pan. When installing the

CEK, the CEK screws should be tightened until they will no longer turn easily. This

should represent approximately 6-8 inch-pounds of torque. More than that may

damage the retention mechanism components.

8.3

Electrical Requirements

8.3.1

Fan Power Supply (Active CEK)

The 4-pin PWM controlled active thermal solution is being offered to help provide better

control over pedestal chassis acoustics. This is achieved though more accurate

measurement of processor die temperature through the processor’s Digital Thermal

Sensors. Fan RPM is modulated through the use of an ASIC located on the baseboard,

that sends out a PWM control signal to the 4th pin of the connector labeled as Control.

This thermal solution requires a constant +12 V supplied to pin 2 of the active thermal

solution and does not support variable voltage control or 3-pin PWM control. See

Table 8-2

for details on the 4-pin active heat sink solution connectors.

If the 4-pin active fan heat sink solution is connected to an older 3-pin baseboard CPU

fan header it will default back to a thermistor controlled mode, allowing compatibility

with legacy 3-wire designs. When operating in thermistor controlled mode, fan RPM is

automatically varied based on the TINLET temperature measured by a thermistor

located at the fan inlet of the heat sink solution.

Section	Page
1 Introduction	9
1.1 Terminology	11
1.2 State of Data	13
1.3 References	13
2 Electrical Specifications	15
2.1 Front Side Bus and GTLREF	15
2.2 Power and Ground Lands	16
2.3 Decoupling Guidelines	16
2.3.1 VCC Decoupling	16
2.3.2 VTT Decoupling	16
2.3.3 Front Side Bus AGTL+ Decoupling	17
2.4 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking	17
2.4.1 Front Side Bus Frequency Select Signals (BSEL[2:0])	18
2.4.2 PLL Power Supply	19
2.5 Voltage Identification (VID)	19
2.6 Reserved, Unused, or Test Signals	21
2.7 Front Side Bus Signal Groups	22
2.8 CMOS Asynchronous and Open Drain Asynchronous Signals	24
2.9 Test Access Port (TAP) Connection	24
2.10 Platform Environmental Control Interface (PECI) DC Specifications	24
2.10.1 DC Characteristics	24
2.10.2 Input Device Hysteresis	25
2.11 Mixing Processors	26
2.12 Absolute Maximum and Minimum Ratings	26
2.13 Processor DC Specifications	27
2.13.1 Flexible Motherboard Guidelines (FMB)	27
2.13.2 VCC Overshoot Specification	33
2.13.3 Die Voltage Validation	34
2.14 AGTL+ FSB Specifications	34
3 Mechanical Specifications	39
3.1 Package Mechanical Drawings	39
3.2 Processor Component Keepout Zones	43
3.3 Package Loading Specifications	43
3.4 Package Handling Guidelines	44
3.5 Package Insertion Specifications	44
3.6 Processor Mass Specifications	44
3.7 Processor Materials	44
3.8 Processor Markings	45
3.9 Processor Land Coordinates	45
4 Land Listing	49
4.1 Quad-Core Intel® Xeon® Processor 5300 Series Pin Assignments	49
4.1.1 Land Listing by Land Name	49
4.1.2 Land Listing by Land Number	60
5 Signal Definitions	71
5.1 Signal Definitions	71
6 Thermal Specifications	79
6.1 Package Thermal Specifications	79
6.1.1 Thermal Specifications	79
6.1.2 Thermal Metrology	83
6.2 Processor Thermal Features	84
6.2.1 Thermal Monitor Features	84
6.2.2 Thermal Monitor (TM1)	84
6.2.3 Thermal Monitor 2	85
6.2.4 On-Demand Mode	86
6.2.5 PROCHOT# Signal	87
6.2.6 FORCEPR# Signal	87
6.2.7 THERMTRIP# Signal	88
6.3 Platform Environment Control Interface (PECI)	88
6.3.1 Introduction	88
6.3.2 PECI Specifications	89
7 Features	91
7.1 Power-On Configuration Options	91
7.2 Clock Control and Low Power States	91
7.2.1 Normal State	92
7.2.2 HALT or Extended HALT State	92
7.2.3 Stop-Grant State	94
7.2.4 Extended HALT Snoop or HALT Snoop State, Stop Grant Snoop State	94
7.3 Enhanced Intel SpeedStep® Technology	95
8 Boxed Processor Specifications	97
8.1 Introduction	97
8.2 Mechanical Specifications	99
8.2.1 Boxed Processor Heat Sink Dimensions (CEK)	99
8.2.2 Boxed Processor Heat Sink Weight	107
8.2.3 Boxed Processor Retention Mechanism and Heat Sink Support (CEK)	107
8.3 Electrical Requirements	107
8.3.1 Fan Power Supply (Active CEK)	107
8.3.2 Boxed Processor Cooling Requirements	108
8.4 Boxed Processor Contents	109
9 Debug Tools Specifications	111
9.1 Debug Port System Requirements	111
9.2 Target System Implementation	111
9.2.1 System Implementation	111
9.3 Logic Analyzer Interface (LAI)	111
9.3.1 Mechanical Considerations	112

Intel E5310 Data Sheet - Page 107

Boxed Processor Heat Sink Weight - cpu

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