Intel E5310 Data Sheet - Page 108
Boxed Processor Cooling Requirements
UPC - 735858190800
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Boxed Processor Specifications The fan power header on the baseboard must be positioned to allow the fan heat sink power cable to reach it. The fan power header identification and location must be documented in the suppliers platform documentation, or on the baseboard itself. The baseboard fan power header should be positioned within 177.8 mm [7 in.] from the center of the processor socket. Table 8-1. PWM Fan Frequency Specifications for 4-Pin Active CEK Thermal Solution Description PWM Control Frequency Range Min Frequency 21,000 Nominal Frequency 25,000 Max Frequency 28,000 Unit Hz Table 8-2. Fan Specifications for 4-Pin Active CEK Thermal Solution Description1 +12 V: 12 volt fan power supply IC: Fan Current Draw Min 10.8 N/A Typ Steady 12 1 Max Steady 12 1.25 Max Startup 13.2 1.5 SENSE: SENSE frequency 2 2 2 2 Unit V A Pulses per fan revolution Note: 1. System board should pull this pin up to Vcc with a resistor Figure 8-11. Fan Cable Connector Pin Out for 4-Pin Active CEK Thermal Solution Table 8-3. Fan Cable Connector Pin Out for 4-Pin Active CEK Thermal Solution Pin Number 1 2 3 4 Signal Ground Power: (+12 V) Sense: 2 pulses per revolution Control: 21 KHz-28 KHz Color Black Yellow Green Blue Note: System board should provide an open drain / open collector for pin 4. Fan will pull this pin up to a specific voltage (5.25V max). 8.3.2 Boxed Processor Cooling Requirements As previously stated the boxed processor will be available in two product configurations. Each configuration will require unique design considerations. Meeting the processor's temperature specifications is also the function of the thermal design of the entire system, and ultimately the responsibility of the system integrator. The processor temperature specifications are found in Section 6 of this document. 108 Quad-Core Intel® Xeon® Processor 5300 Series Datasheet