Intel E5310 Data Sheet - Page 112
Mechanical Considerations, or additional hardware to mount the existing cooling solution.
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Debug Tools Specifications 9.3.1 9.3.2 Mechanical Considerations The LAI is installed between the processor socket and the processor. The LAI plugs into the socket, while the processor plugs into a socket on the LAI. Cabling that is part of the LAI egresses the system to allow an electrical connection between the processor and a logic analyzer. The maximum volume occupied by the LAI, known as the keepout volume, as well as the cable egress restrictions, should be obtained from the logic analyzer vendor. System designers must make sure that the keepout volume remains unobstructed inside the system. In some cases, it is known that some of the electrolytic capacitors fall inside of the keepout volume for the LAI. In this case, it is necessary to move these capacitors to the backside of the board before using the LAI. Additionally, note that it is possible that the keepout volume reserved for the LAI may include different requirements from the space normally occupied by the heatsink. If this is the case, the logic analyzer vendor will provide either a cooling solution as part of the LAI or additional hardware to mount the existing cooling solution. Electrical Considerations The LAI will also affect the electrical performance of the FSB, therefore it is critical to obtain electrical load models from each of the logic analyzer vendors to be able to run system level simulations to prove that their tool will work in the system. Contact the logic analyzer vendor for electrical specifications and load models for the LAI solution they provide. § 112 Quad-Core Intel® Xeon® Processor 5300 Series Datasheet