Intel E5310 Data Sheet - Page 82

Thermal Specifications

82

Quad-Core Intel® Xeon® Processor 5300 Series Datasheet

Notes:

1.

These values are specified at V

CC_MAX

for all processor frequencies. Systems must be designed to ensure

the processor is not to be subjected to any static V

CC

and I

CC

combination wherein V

CC

exceeds V

CC_MAX

at

specified I

CC

. Please refer to the loadline specifications in

Section 2

.

2.

Maximum Power is the highest power the processor will dissipate, regardless of its VID. Maximum Power is

measured at maximum T

CASE

.

3.

Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the

maximum power that the processor can dissipate. TDP is measured at maximum T

CASE

.

4.

These specifications are based on initial silicon characterization. These specifications may be further

updated as more characterization data becomes available.

5.

Power specifications are defined at all VIDs found in

Table 2-3

. The Quad-Core Intel® Xeon® Processor

X5300 Series may be shipped under multiple VIDs for each frequency.

6.

FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor

frequency requirements.

Notes:

1.

Quad-Core Intel® Xeon® Processor X5300 Series Thermal Profile A is representative of a volumetrically

unconstrained platform. Please refer to

Table 6-4

for discrete points that constitute the thermal profile.

2.

Implementation of Quad-Core Intel® Xeon® Processor X5300 Series Thermal Profile A should result in

virtually no TCC activation. Furthermore, utilization of thermal solutions that do not meet processor

Quad-Core Intel® Xeon® Processor X5300 Series Thermal Profile A will result in increased probability of

TCC activation and may incur measurable performance loss. (See

Section 6.2

for details on TCC activation).

3.

Quad-Core Intel® Xeon® Processor X5300 Series Thermal Profile B is representative of a volumetrically

constrained platform. Please refer to

Table 6-5

for discrete points that constitute the thermal profile.

4.

Implementation of Thermal Profile B will result in increased probability of TCC activation and measurable

performance loss. Furthermore, utilization of thermal solutions that do not meet Thermal Profile B do not

meet the processor's thermal specifications and may result in permanent damage to the processor.

5.

Refer to the

Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines

for

system and environmental implementation details.

Table 6-3.

Quad-Core Intel® Xeon® Processor X5300 Series Thermal Specifications

Core

Frequency

Thermal Design

Power

(W)

Minimum

T

CASE

(°C)

Maximum

T

CASE

(°C)

Notes

Launch to FMB

120

5

See

Figure 6-2

;

Table 6-4

;

Table 6-5

1, 2, 3, 4, 5, 6

Figure 6-2.Quad-Core Intel® Xeon® Processor X5300 Series Thermal Profiles

40

45

50

55

60

65

70

75

0

10

20

30

40

50

60

70

80

90

100

110

120

Power [W]

Tcase [C]

Thermal Profile B

Y = 0.224*x + 43.1

Thermal Profile A

Y = 0.171*x + 42.5

TCASE_MAX is a thermal solution design point.

In actuality, units will not significantly exceed

TCASE_MAX_A due to TCC activation.

Section	Page
1 Introduction	9
1.1 Terminology	11
1.2 State of Data	13
1.3 References	13
2 Electrical Specifications	15
2.1 Front Side Bus and GTLREF	15
2.2 Power and Ground Lands	16
2.3 Decoupling Guidelines	16
2.3.1 VCC Decoupling	16
2.3.2 VTT Decoupling	16
2.3.3 Front Side Bus AGTL+ Decoupling	17
2.4 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking	17
2.4.1 Front Side Bus Frequency Select Signals (BSEL[2:0])	18
2.4.2 PLL Power Supply	19
2.5 Voltage Identification (VID)	19
2.6 Reserved, Unused, or Test Signals	21
2.7 Front Side Bus Signal Groups	22
2.8 CMOS Asynchronous and Open Drain Asynchronous Signals	24
2.9 Test Access Port (TAP) Connection	24
2.10 Platform Environmental Control Interface (PECI) DC Specifications	24
2.10.1 DC Characteristics	24
2.10.2 Input Device Hysteresis	25
2.11 Mixing Processors	26
2.12 Absolute Maximum and Minimum Ratings	26
2.13 Processor DC Specifications	27
2.13.1 Flexible Motherboard Guidelines (FMB)	27
2.13.2 VCC Overshoot Specification	33
2.13.3 Die Voltage Validation	34
2.14 AGTL+ FSB Specifications	34
3 Mechanical Specifications	39
3.1 Package Mechanical Drawings	39
3.2 Processor Component Keepout Zones	43
3.3 Package Loading Specifications	43
3.4 Package Handling Guidelines	44
3.5 Package Insertion Specifications	44
3.6 Processor Mass Specifications	44
3.7 Processor Materials	44
3.8 Processor Markings	45
3.9 Processor Land Coordinates	45
4 Land Listing	49
4.1 Quad-Core Intel® Xeon® Processor 5300 Series Pin Assignments	49
4.1.1 Land Listing by Land Name	49
4.1.2 Land Listing by Land Number	60
5 Signal Definitions	71
5.1 Signal Definitions	71
6 Thermal Specifications	79
6.1 Package Thermal Specifications	79
6.1.1 Thermal Specifications	79
6.1.2 Thermal Metrology	83
6.2 Processor Thermal Features	84
6.2.1 Thermal Monitor Features	84
6.2.2 Thermal Monitor (TM1)	84
6.2.3 Thermal Monitor 2	85
6.2.4 On-Demand Mode	86
6.2.5 PROCHOT# Signal	87
6.2.6 FORCEPR# Signal	87
6.2.7 THERMTRIP# Signal	88
6.3 Platform Environment Control Interface (PECI)	88
6.3.1 Introduction	88
6.3.2 PECI Specifications	89
7 Features	91
7.1 Power-On Configuration Options	91
7.2 Clock Control and Low Power States	91
7.2.1 Normal State	92
7.2.2 HALT or Extended HALT State	92
7.2.3 Stop-Grant State	94
7.2.4 Extended HALT Snoop or HALT Snoop State, Stop Grant Snoop State	94
7.3 Enhanced Intel SpeedStep® Technology	95
8 Boxed Processor Specifications	97
8.1 Introduction	97
8.2 Mechanical Specifications	99
8.2.1 Boxed Processor Heat Sink Dimensions (CEK)	99
8.2.2 Boxed Processor Heat Sink Weight	107
8.2.3 Boxed Processor Retention Mechanism and Heat Sink Support (CEK)	107
8.3 Electrical Requirements	107
8.3.1 Fan Power Supply (Active CEK)	107
8.3.2 Boxed Processor Cooling Requirements	108
8.4 Boxed Processor Contents	109
9 Debug Tools Specifications	111
9.1 Debug Port System Requirements	111
9.2 Target System Implementation	111
9.2.1 System Implementation	111
9.3 Logic Analyzer Interface (LAI)	111
9.3.1 Mechanical Considerations	112

Intel E5310 Data Sheet - Page 82

Table 6-3., Quad-Core Intel® Xeon® Processor X5300 Series Thermal Specifications, Thermal Profile B

Page 82 highlights