Intel E5310 Data Sheet - Page 97

Quad-Core Intel® Xeon® Processor 5300 Series Datasheet

97

Boxed Processor Specifications

8

Boxed Processor Specifications

8.1

Introduction

Intel boxed processors are intended for system integrators who build systems from

components available through distribution channels. The Quad-Core Intel® Xeon®

Processor 5300 Series will be offered as an Intel boxed processor.

Intel will offer the Quad-Core Intel® Xeon® Processor 5300 Series boxed processor

with two heat sink configurations available for each processor frequency: 1U passive/

3U+ active combination solution and a 2U passive only solution. The 1U passive/3U+

active combination solution is based on a 1U passive heat sink with a removable fan

that will be pre-attached at shipping. This heat sink solution is intended to be used as

either a 1U passive heat sink, or a 3U+ active heat sink. Although the active

combination solution with removable fan mechanically fits into a 2U keepout, its use is

not recommended in that configuration.

The 1U passive/3U+ active combination solution in the active fan configuration is

primarily designed to be used in a pedestal chassis where sufficient air inlet space is

present and strong side directional airflow is not an issue. The 1U passive/3U+ active

combination solution with the fan removed and the 2U passive thermal solution require

the use of chassis ducting and are targeted for use in rack mount or pedestal servers.

The retention solution used for these products is called the Common Enabling Kit, or

CEK. The CEK base is compatible with both thermal solutions and uses the same hole

locations as the Dual-Core Intel® Xeon® processor 5100 series.

The 1U passive/3U+ active combination solution will utilize a removable fan capable of

4-pin pulse width modulated (PWM) control. Use of a 4-pin PWM controlled active

thermal solution helps customers meet acoustic targets in pedestal platforms through

the motherboards’s ability to directly control the RPM of the processor heat sink fan.

See

Section 8.3

for more details on fan speed control, and see

Section 6.3

for more on

the PWM and PECI interface along with Digital Thermal Sensors (DTS).

Figure 8-1

through

Figure 8-3

are representations of the two heat sink solutions.

Figure 8-1.

Boxed Quad-Core Intel® Xeon® Processor 5300 Series 1U Passive/3U+

Active Combination Heat Sink (With Removable Fan)

Section	Page
1 Introduction	9
1.1 Terminology	11
1.2 State of Data	13
1.3 References	13
2 Electrical Specifications	15
2.1 Front Side Bus and GTLREF	15
2.2 Power and Ground Lands	16
2.3 Decoupling Guidelines	16
2.3.1 VCC Decoupling	16
2.3.2 VTT Decoupling	16
2.3.3 Front Side Bus AGTL+ Decoupling	17
2.4 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking	17
2.4.1 Front Side Bus Frequency Select Signals (BSEL[2:0])	18
2.4.2 PLL Power Supply	19
2.5 Voltage Identification (VID)	19
2.6 Reserved, Unused, or Test Signals	21
2.7 Front Side Bus Signal Groups	22
2.8 CMOS Asynchronous and Open Drain Asynchronous Signals	24
2.9 Test Access Port (TAP) Connection	24
2.10 Platform Environmental Control Interface (PECI) DC Specifications	24
2.10.1 DC Characteristics	24
2.10.2 Input Device Hysteresis	25
2.11 Mixing Processors	26
2.12 Absolute Maximum and Minimum Ratings	26
2.13 Processor DC Specifications	27
2.13.1 Flexible Motherboard Guidelines (FMB)	27
2.13.2 VCC Overshoot Specification	33
2.13.3 Die Voltage Validation	34
2.14 AGTL+ FSB Specifications	34
3 Mechanical Specifications	39
3.1 Package Mechanical Drawings	39
3.2 Processor Component Keepout Zones	43
3.3 Package Loading Specifications	43
3.4 Package Handling Guidelines	44
3.5 Package Insertion Specifications	44
3.6 Processor Mass Specifications	44
3.7 Processor Materials	44
3.8 Processor Markings	45
3.9 Processor Land Coordinates	45
4 Land Listing	49
4.1 Quad-Core Intel® Xeon® Processor 5300 Series Pin Assignments	49
4.1.1 Land Listing by Land Name	49
4.1.2 Land Listing by Land Number	60
5 Signal Definitions	71
5.1 Signal Definitions	71
6 Thermal Specifications	79
6.1 Package Thermal Specifications	79
6.1.1 Thermal Specifications	79
6.1.2 Thermal Metrology	83
6.2 Processor Thermal Features	84
6.2.1 Thermal Monitor Features	84
6.2.2 Thermal Monitor (TM1)	84
6.2.3 Thermal Monitor 2	85
6.2.4 On-Demand Mode	86
6.2.5 PROCHOT# Signal	87
6.2.6 FORCEPR# Signal	87
6.2.7 THERMTRIP# Signal	88
6.3 Platform Environment Control Interface (PECI)	88
6.3.1 Introduction	88
6.3.2 PECI Specifications	89
7 Features	91
7.1 Power-On Configuration Options	91
7.2 Clock Control and Low Power States	91
7.2.1 Normal State	92
7.2.2 HALT or Extended HALT State	92
7.2.3 Stop-Grant State	94
7.2.4 Extended HALT Snoop or HALT Snoop State, Stop Grant Snoop State	94
7.3 Enhanced Intel SpeedStep® Technology	95
8 Boxed Processor Specifications	97
8.1 Introduction	97
8.2 Mechanical Specifications	99
8.2.1 Boxed Processor Heat Sink Dimensions (CEK)	99
8.2.2 Boxed Processor Heat Sink Weight	107
8.2.3 Boxed Processor Retention Mechanism and Heat Sink Support (CEK)	107
8.3 Electrical Requirements	107
8.3.1 Fan Power Supply (Active CEK)	107
8.3.2 Boxed Processor Cooling Requirements	108
8.4 Boxed Processor Contents	109
9 Debug Tools Specifications	111
9.1 Debug Port System Requirements	111
9.2 Target System Implementation	111
9.2.1 System Implementation	111
9.3 Logic Analyzer Interface (LAI)	111
9.3.1 Mechanical Considerations	112

Intel E5310 Data Sheet - Page 97

Boxed Processor Specifications, 8.1 Introduction

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