Intel E5310 Data Sheet - Page 4

Extended HALT Snoop or HALT Snoop State, Stop Grant, Boxed Processor Retention Mechanism and Heat Sink - cores

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Page 4 highlights

6.2.1 Thermal Monitor Features 84 6.2.2 Thermal Monitor (TM1 84 6.2.3 Thermal Monitor 2 85 6.2.4 On-Demand Mode 86 6.2.5 PROCHOT# Signal 87 6.2.6 FORCEPR# Signal 87 6.2.7 THERMTRIP# Signal 88 6.3 Platform Environment Control Interface (PECI 88 6.3.1 Introduction 88 6.3.2 PECI Specifications 89 7 Features ...91 7.1 Power-On Configuration Options 91 7.2 Clock Control and Low Power States 91 7.2.1 Normal State 92 7.2.2 HALT or Extended HALT State 92 7.2.3 Stop-Grant State 94 7.2.4 Extended HALT Snoop or HALT Snoop State, Stop Grant Snoop State 94 7.3 Enhanced Intel SpeedStep® Technology 95 8 Boxed Processor Specifications 97 8.1 Introduction ...97 8.2 Mechanical Specifications 99 8.2.1 Boxed Processor Heat Sink Dimensions (CEK 99 8.2.2 Boxed Processor Heat Sink Weight 107 8.2.3 Boxed Processor Retention Mechanism and Heat Sink Support (CEK 107 8.3 Electrical Requirements 107 8.3.1 Fan Power Supply (Active CEK 107 8.3.2 Boxed Processor Cooling Requirements 108 8.4 Boxed Processor Contents 109 9 Debug Tools Specifications 111 9.1 Debug Port System Requirements 111 9.2 Target System Implementation 111 9.2.1 System Implementation 111 9.3 Logic Analyzer Interface (LAI 111 9.3.1 Mechanical Considerations 112 9.3.2 Electrical Considerations 112 4 Quad-Core Intel® Xeon® Processor 5300 Series Datasheet

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4
Quad-Core Intel® Xeon® Processor 5300 Series Datasheet
6.2.1
Thermal Monitor Features
........................................................................
84
6.2.2
Thermal Monitor (TM1)
............................................................................
84
6.2.3
Thermal Monitor 2
..................................................................................
85
6.2.4
On-Demand Mode
...................................................................................
86
6.2.5
PROCHOT# Signal
..................................................................................
87
6.2.6
FORCEPR# Signal
...................................................................................
87
6.2.7
THERMTRIP# Signal
................................................................................
88
6.3
Platform Environment Control Interface (PECI)
......................................................
88
6.3.1
Introduction
...........................................................................................
88
6.3.2
PECI Specifications
.................................................................................
89
7
Features
....................................................................................................................
91
7.1
Power-On Configuration Options
..........................................................................
91
7.2
Clock Control and Low Power States
.....................................................................
91
7.2.1
Normal State
.........................................................................................
92
7.2.2
HALT or Extended HALT State
...................................................................
92
7.2.3
Stop-Grant State
....................................................................................
94
7.2.4
Extended HALT Snoop or HALT Snoop State, Stop Grant
Snoop State
...........................................................................................
94
7.3
Enhanced Intel SpeedStep® Technology
...............................................................
95
8
Boxed Processor Specifications
.....................................................................................
97
8.1
Introduction
......................................................................................................
97
8.2
Mechanical Specifications
....................................................................................
99
8.2.1
Boxed Processor Heat Sink Dimensions (CEK)
.............................................
99
8.2.2
Boxed Processor Heat Sink Weight
..........................................................
107
8.2.3
Boxed Processor Retention Mechanism and Heat Sink
Support (CEK)
......................................................................................
107
8.3
Electrical Requirements
....................................................................................
107
8.3.1
Fan Power Supply (Active CEK)
...............................................................
107
8.3.2
Boxed Processor Cooling Requirements
....................................................
108
8.4
Boxed Processor Contents
.................................................................................
109
9
Debug Tools Specifications
.........................................................................................
111
9.1
Debug Port System Requirements
......................................................................
111
9.2
Target System Implementation
..........................................................................
111
9.2.1
System Implementation
.........................................................................
111
9.3
Logic Analyzer Interface (LAI)
...........................................................................
111
9.3.1
Mechanical Considerations
.....................................................................
112
9.3.2
Electrical Considerations
........................................................................
112