Intel E5310 Data Sheet - Page 39
Mechanical Specifications, 3.1 Package Mechanical Drawings
UPC - 735858190800
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Mechanical Specifications 3 Mechanical Specifications The Quad-Core Intel® Xeon® Processor 5300 Series are packaged in a Flip Chip Land Grid Array (FC-LGA6) package that interfaces to the baseboard via a LGA771 socket. The package consists of two processor dies mounted on a pinless substrate with 771 lands. An integrated heat spreader (IHS) is attached to the package substrate and core and serves as the interface for processor component thermal solutions such as a heatsink. Figure 3-1 shows a sketch of the processor package components and how they are assembled together. Refer to the LGA771 Socket Design Guidelines for complete details on the LGA771 socket. The package components shown in Figure 3-1 include the following: • Integrated Heat Spreader (IHS) • Thermal Interface Material (TIM) • Processor Die • Package Substrate • Landside capacitors • Package Lands Figure 3-1. Processor Package Assembly Sketch 3.1 Note: IHS Core (die) TIM Substrate Package Lands System Board Note: This drawing is not to scale and is for reference only. Capacitors LGA771 Socket Package Mechanical Drawings The package mechanical drawings are shown in Figure 3-2 through Figure 3-4. The drawings include dimensions necessary to design a thermal solution for the processor including: • Package reference and tolerance dimensions (total height, length, width, and so forth) • IHS parallelism and tilt • Land dimensions • Top-side and back-side component keepout dimensions • Reference datums All drawing dimensions are in mm [in.]. Quad-Core Intel® Xeon® Processor 5300 Series Datasheet 39