Intel E5310 Data Sheet - Page 12

Introduction • Dual Independent Bus (DIB) - A front side bus architecture with one processor on each bus, rather than a FSB shared between two processor agents. The DIB architecture provides improved performance by allowing increased FSB speeds and bandwidth. • Flexible Motherboard Guidelines (FMB) - Are estimates of the maximum values the Quad-Core Intel® Xeon® Processor 5300 Series will have over certain time periods. The values are only estimates and actual specifications for future processors may differ. • Functional Operation - Refers to the normal operating conditions in which all processor specifications, including DC, AC, FSB, signal quality, mechanical and thermal are satisfied. • Storage Conditions - Refers to a non-operational state. The processor may be installed in a platform, in a tray, or loose. Processors may be sealed in packaging or exposed to free air. Under these conditions, processor lands should not be connected to any supply voltages, have any I/Os biased or receive any clocks. Upon exposure to "free air" (that is, unsealed packaging or a device removed from packaging material) the processor must be handled in accordance with moisture sensitivity labeling (MSL) as indicated on the packaging material. • Priority Agent - The priority agent is the host bridge to the processor and is typically known as the chipset. • Symmetric Agent - A symmetric agent is a processor which shares the same I/O subsystem and memory array, and runs the same operating system as another processor in a system. Systems using symmetric agents are known as Symmetric Multiprocessing (SMP) systems. • Integrated Heat Spreader (IHS) - A component of the processor package used to enhance the thermal performance of the package. Component thermal solutions interface with the processor at the IHS surface. • Thermal Design Power - Processor thermal solutions should be designed to meet this target. It is the highest expected sustainable power while running known power intensive real applications. TDP is not the maximum power that the processor can dissipate. • Intel® 64 Architecture - Instruction set architecture and programming environment of Intel's 64-bit processors, which are a superset of and compatible with IA-32. This 64-bit instruction set architecture was formerly known as IA-32 with EM64T or Intel® EM64T. • Enhanced Intel SpeedStep® Technology - Technology that provides power management capabilities to servers and workstations. • Platform Environment Control Interface (PECI) - A proprietary one-wire bus interface that provides a communication channel between Intel processor and chipset components to external thermal monitoring devices, for use in fan speed control. PECI communicates readings from the processor's Digital Thermal Sensor (DTS). The replaces the thermal diode available in previous processors. • Intel® Virtualization Technology (Intel® VT) - Processor virtualization which when used in conjunction with Virtual Machine Monitor software enables multiple, robust independent software environments inside a single platform. • VRM (Voltage Regulator Module) - DC-DC converter built onto a module that interfaces with a card edge socket and supplies the correct voltage and current to the processor based on the logic state of the processor VID bits. • EVRD (Enterprise Voltage Regulator Down) - DC-DC converter integrated onto the system board that provides the correct voltage and current to the processor based on the logic state of the processor VID bits. 12 Quad-Core Intel® Xeon® Processor 5300 Series Datasheet