Intel E6700 Mechanical Design Guidelines - Page 100
Filling Groove with Adhesive, Application of Accelerant
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Case Temperature Reference Metrology 31. Fill the rest of the groove with Loctite* 498 Adhesive. Verify under the microscope that the thermocouple wire is below the surface along the entire length of the IHS groove (Figure 7-33). Figure 7-33. Filling Groove with Adhesive 32. To speed up the curing process apply Loctite* Accelerator on top of the Adhesive and let it set for a couple of minutes (Figure 7-34). Figure 7-34. Application of Accelerant 100 Thermal and Mechanical Design Guidelines
Case Temperature Reference Metrology
100
Thermal and Mechanical Design Guidelines
31.
Fill the rest of the groove with Loctite* 498 Adhesive. Verify under the microscope
that the thermocouple wire is below the surface along the entire length of the IHS
groove (Figure 7-33).
Figure 7-33. Filling Groove with Adhesive
32.
To speed up the curing process apply Loctite* Accelerator on top of the Adhesive
and let it set for a couple of minutes (Figure 7-34).
Figure 7-34. Application of Accelerant