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Appendix B, Heatsink Clip Load, Metrology

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Heatsink Clip Load Metrology Appendix B Heatsink Clip Load Metrology B.1 Overview This appendix describes a procedure for measuring the load applied by the heatsink/clip/fastener assembly on a processor package. This procedure is recommended to verify the preload is within the design target range for a design, and in different situations. For example: • Heatsink preload for the LGA775 socket • Quantify preload degradation under bake conditions. Note: This document reflects the current metrology used by Intel. Intel is continuously exploring new ways to improve metrology. B.2 Test Preparation B.2.1 Heatsink Preparation Three load cells are assembled into the base of the heatsink under test, in the area interfacing with the processor Integrated Heat Spreader (IHS), using load cells equivalent to those listed in Section B.2.2. To install the load cells, machine a pocket in the heatsink base, as shown in Figure 7-8 and Figure 7-9. The load cells should be distributed evenly, as close as possible to the pocket walls. Apply wax around the circumference of each load cell and the surface of the pocket around each cell to maintain the load cells in place during the heatsink installation on the processor and motherboard (Refer to Figure 7-9). The depth of the pocket depends on the height of the load cell used for the test. It is necessary that the load cells protrude out of the heatsink base. However, this protrusion should be kept minimal, as it will create additional load by artificially raising the heatsink base. The measurement offset depends on the whole assembly stiffness (that is, motherboard, clip, fastener, and so forth). For example, the reference design clip and fasteners assembly stiffness is around 380 N/mm [2180 lb/in]. In that case, a protrusion of 0.038 mm [0.0015"] will create an extra load of 15 N [3.3 lb]. Figure 7-10 shows an example using the reference design. Note: When optimizing the heatsink pocket depth, the variation of the load cell height should also be taken into account to make sure that all load cells protrude equally from the heatsink base. It may be useful to screen the load cells prior to installation to minimize variation. Thermal and Mechanical Design Guidelines 75

Section	Page
1 Introduction	9
1.1 Document Goals and Scope	9
1.1.1 Importance of Thermal Management	9
1.1.2 Document Goals	9
1.1.3 Document Scope	10
1.2 References	11
1.3 Definition of Terms	11
2 Processor Thermal/Mechanical Information	13
2.1 Mechanical Requirements	13
2.1.1 Processor Package	13
2.1.2 Heatsink Attach	15
2.1.2.1 General Guidelines	15
2.1.2.2 Heatsink Clip Load Requirement	15
2.1.2.3 Additional Guidelines	16
2.2 Thermal Requirements	16
2.2.1 Processor Case Temperature	16
2.2.2 Thermal Profile	17
2.2.3 Thermal Solution Design Requirements	17
2.2.4 TCONTROL	18
2.3 Heatsink Design Considerations	19
2.3.1 Heatsink Size	20
2.3.2 Heatsink Mass	20
2.3.3 Package IHS Flatness	21
2.3.4 Thermal Interface Material	21
2.4 System Thermal Solution Considerations	22
2.4.1 Chassis Thermal Design Capabilities	22
2.4.2 Improving Chassis Thermal Performance	22
2.4.3 Summary	23
2.5 System Integration Considerations	23
3 Thermal Metrology	25
3.1 Characterizing Cooling Performance Requirements	25
3.1.1 Example	26
3.2 Processor Thermal Solution Performance Assessment	27
3.3 Local Ambient Temperature Measurement Guidelines	27
3.4 Processor Case Temperature Measurement Guidelines	30
4 Thermal Management Logic and Thermal Monitor Feature	31
4.1 Processor Power Dissipation	31
4.2 Thermal Monitor Implementation	31
4.2.1 PROCHOT# Signal	32
4.2.2 Thermal Control Circuit	32
4.2.2.1 Thermal Monitor	32
4.2.3 Thermal Monitor 2	33
4.2.4 Operation and Configuration	34
4.2.5 On-Demand Mode	35
4.2.6 System Considerations	35
4.2.7 Operating System and Application Software Considerations	36
4.2.8 THERMTRIP# Signal	36
4.2.9 Cooling System Failure Warning	36
4.2.10 Digital Thermal Sensor	37
4.2.11 Platform Environmental Control Interface (PECI)	38
5 Balanced Technology Extended (BTX) Thermal/Mechanical Design Information	39
5.1 Overview of the BTX Reference Design	39
5.1.1 Target Heatsink Performance	39
5.1.2 Acoustics	40
5.1.3 Effective Fan Curve	41
5.1.4 Voltage Regulator Thermal Management	42
5.1.5 Altitude	43
5.1.6 Reference Heatsink Thermal Validation	43
5.2 Environmental Reliability Testing	43
5.2.1 Structural Reliability Testing	43
5.2.1.1 Random Vibration Test Procedure	43
5.2.1.2 Shock Test Procedure	44
5.2.2 Power Cycling	45
5.2.3 Recommended BIOS/CPU/Memory Test Procedures	46
5.3 Material and Recycling Requirements	46
5.4 Safety Requirements	47
5.5 Geometric Envelope for Intel® Reference BTX Thermal Module Assembly	47
5.6 Preload and TMA Stiffness	48
5.6.1 Structural Design Strategy	48
5.6.2 TMA Preload verse Stiffness	48
6 ATX Thermal/Mechanical Design Information	51
6.1 ATX Reference Design Requirements	51
6.2 Validation Results for Reference Design	53
6.2.1 Heatsink Performance	53
6.2.2 Acoustics	54
6.2.3 Altitude	54
6.2.4 Heatsink Thermal Validation	55
6.3 Environmental Reliability Testing	55
6.3.1 Structural Reliability Testing	55
6.3.1.1 Random Vibration Test Procedure	55
6.3.1.2 Shock Test Procedure	56
6.3.2 Power Cycling	57
6.3.3 Recommended BIOS/CPU/Memory Test Procedures	58
6.4 Material and Recycling Requirements	58
6.5 Safety Requirements	59
6.6 Geometric Envelope for Intel® Reference ATX Thermal Mechanical Design	59
6.7 Reference Attach Mechanism	60
6.7.1 Structural Design Strategy	60
6.7.2 Mechanical Interface to the Reference Attach Mechanism	61
7 Intel® Quiet System Technology (Intel® QST)	63
7.1 Intel® QST Algorithm	63
7.1.1 Output Weighting Matrix	64
7.1.2 Proportional-Integral-Derivative (PID)	64
7.2 Board and System Implementation of Intel® QST	66
7.3 Intel® QST Configuration and Tuning	68

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Heatsink Clip Load Metrology

Thermal and Mechanical Design Guidelines

Appendix B

Heatsink Clip Load

Metrology

B.1

Overview

This appendix describes a procedure for measuring the load applied by the

heatsink/clip/fastener assembly on a processor package.

This procedure is recommended to verify the preload is within the design target range

for a design, and in different situations. For example:

•

Heatsink preload for the LGA775 socket

•

Quantify preload degradation under bake conditions.

Note:

This document reflects the current metrology used by Intel. Intel is continuously

exploring new ways to improve metrology.

B.2

Test Preparation

B.2.1

Heatsink Preparation

Three load cells are assembled into the base of the heatsink under test, in the area

interfacing with the processor Integrated Heat Spreader (IHS), using load cells

equivalent to those listed in Section B.2.2.

To install the load cells, machine a pocket in the heatsink base, as shown in

Figure 7-8 and Figure 7-9. The load cells should be distributed evenly, as close as

possible to the pocket walls. Apply wax around the circumference of each load cell and

the surface of the pocket around each cell to maintain the load cells in place during

the heatsink installation on the processor and motherboard (Refer to

Figure 7-9).

The depth of the pocket depends on the height of the load cell used for the test. It is

necessary that the load cells protrude out of the heatsink base. However, this

protrusion should be kept minimal, as it will create additional load by artificially raising

the heatsink base. The measurement offset depends on the whole assembly stiffness

(that is, motherboard, clip, fastener, and so forth). For example, the reference design

clip and fasteners assembly stiffness is around 380 N/mm [2180 lb/in]. In that case, a

protrusion of 0.038 mm [0.0015”] will create an extra load of 15 N [3.3 lb].

Figure 7-10 shows an example using the reference design.

Note:

When optimizing the heatsink pocket depth, the variation of the load cell height should

also be taken into account to make sure that all load cells protrude equally from the

heatsink base. It may be useful to screen the load cells prior to installation to

minimize variation.