Home » Intel Manuals » Processors » Intel E6700 » Manual Viewer

Intel E6700 Mechanical Design Guidelines - Page 126

Table 7-6. BTX Reference Thermal Solution Providers

UPC - 735858184618

Add to My Manuals
Save this manual to your list of manuals

Page 126 highlights

Intel® Enabled Reference Solution Information Note: These vendors and devices are listed by Intel as a convenience to Intel's general customer base, but Intel does not make any representations or warranties whatsoever regarding quality, reliability, functionality, or compatibility of these devices. This list and/or these devices may be subject to change without notice. Table 7-6. BTX Reference Thermal Solution Providers Supplier Part Description Part Number Contact Phone Notes Mitac International Corp Support and Retention Module _ Michael Tsai 886-3-3289000 Ext.6545 1 AVC* (ASIA Vital Components Co., Ltd) Type I Thermal Module Fan Assembly 2004 DB09238B 120084 David Chao +886-222996930 Extension: 619 2 AVC* (ASIA Vital Components Co., Ltd) Type II Thermal Module Fan Assembly 2004 DB07038B 12UP001 David Chao +886-222996930 Extension: 619 3 TBD Type II Thermal Module Fan Assembly 65W 2006 TBD TBD TBD 4 CCI (Chaun-Choung Technology Corp.) Extrusion TBD Harry Lin Monica Chih 714-739-5797 +886-229952666 Extension 131 AVC (ASIA Vital Components Co., Ltd) Fan and Duct TBD David Chao +886-222996930 Extension: 619 NOTES: 1. Part numbers were not available at the time of release of this document. Contact the company for part number identification prior to the next revision of this document. 2. The user should note that for the 2004 Type I Intel reference Thermal Module Assembly: also meets 2005 Performance (130W) and Mainstream (84W) as well as the 2004 Performance (115W). 3. The user should note that for the 2004 Type II Intel reference Thermal Module Assembly: meets the requirements for 115W 2004 Performance 775_VR_CONFIG_04 and 95W 2005 Mainstream 775_VR_CONFIG_05. 4. The Type II TMA designed for 65W 2006 FMB has been optimized for acoustics and cost. It is not interchangeable with the 95W Type II reference design. Note: These vendors/devices are listed by Intel as a convenience to Intel's general customer base, but Intel does not make any representations or warranties whatsoever regarding quality, reliability, functionality, or compatibility of these devices. This list and/or these devices may be subject to change without notice. § 126 Thermal and Mechanical Design Guidelines

Section	Page
1 Introduction	9
1.1 Document Goals and Scope	9
1.1.1 Importance of Thermal Management	9
1.1.2 Document Goals	9
1.1.3 Document Scope	10
1.2 References	11
1.3 Definition of Terms	11
2 Processor Thermal/Mechanical Information	13
2.1 Mechanical Requirements	13
2.1.1 Processor Package	13
2.1.2 Heatsink Attach	15
2.1.2.1 General Guidelines	15
2.1.2.2 Heatsink Clip Load Requirement	15
2.1.2.3 Additional Guidelines	16
2.2 Thermal Requirements	16
2.2.1 Processor Case Temperature	16
2.2.2 Thermal Profile	17
2.2.3 Thermal Solution Design Requirements	17
2.2.4 TCONTROL	18
2.3 Heatsink Design Considerations	19
2.3.1 Heatsink Size	20
2.3.2 Heatsink Mass	20
2.3.3 Package IHS Flatness	21
2.3.4 Thermal Interface Material	21
2.4 System Thermal Solution Considerations	22
2.4.1 Chassis Thermal Design Capabilities	22
2.4.2 Improving Chassis Thermal Performance	22
2.4.3 Summary	23
2.5 System Integration Considerations	23
3 Thermal Metrology	25
3.1 Characterizing Cooling Performance Requirements	25
3.1.1 Example	26
3.2 Processor Thermal Solution Performance Assessment	27
3.3 Local Ambient Temperature Measurement Guidelines	27
3.4 Processor Case Temperature Measurement Guidelines	30
4 Thermal Management Logic and Thermal Monitor Feature	31
4.1 Processor Power Dissipation	31
4.2 Thermal Monitor Implementation	31
4.2.1 PROCHOT# Signal	32
4.2.2 Thermal Control Circuit	32
4.2.2.1 Thermal Monitor	32
4.2.3 Thermal Monitor 2	33
4.2.4 Operation and Configuration	34
4.2.5 On-Demand Mode	35
4.2.6 System Considerations	35
4.2.7 Operating System and Application Software Considerations	36
4.2.8 THERMTRIP# Signal	36
4.2.9 Cooling System Failure Warning	36
4.2.10 Digital Thermal Sensor	37
4.2.11 Platform Environmental Control Interface (PECI)	38
5 Balanced Technology Extended (BTX) Thermal/Mechanical Design Information	39
5.1 Overview of the BTX Reference Design	39
5.1.1 Target Heatsink Performance	39
5.1.2 Acoustics	40
5.1.3 Effective Fan Curve	41
5.1.4 Voltage Regulator Thermal Management	42
5.1.5 Altitude	43
5.1.6 Reference Heatsink Thermal Validation	43
5.2 Environmental Reliability Testing	43
5.2.1 Structural Reliability Testing	43
5.2.1.1 Random Vibration Test Procedure	43
5.2.1.2 Shock Test Procedure	44
5.2.2 Power Cycling	45
5.2.3 Recommended BIOS/CPU/Memory Test Procedures	46
5.3 Material and Recycling Requirements	46
5.4 Safety Requirements	47
5.5 Geometric Envelope for Intel® Reference BTX Thermal Module Assembly	47
5.6 Preload and TMA Stiffness	48
5.6.1 Structural Design Strategy	48
5.6.2 TMA Preload verse Stiffness	48
6 ATX Thermal/Mechanical Design Information	51
6.1 ATX Reference Design Requirements	51
6.2 Validation Results for Reference Design	53
6.2.1 Heatsink Performance	53
6.2.2 Acoustics	54
6.2.3 Altitude	54
6.2.4 Heatsink Thermal Validation	55
6.3 Environmental Reliability Testing	55
6.3.1 Structural Reliability Testing	55
6.3.1.1 Random Vibration Test Procedure	55
6.3.1.2 Shock Test Procedure	56
6.3.2 Power Cycling	57
6.3.3 Recommended BIOS/CPU/Memory Test Procedures	58
6.4 Material and Recycling Requirements	58
6.5 Safety Requirements	59
6.6 Geometric Envelope for Intel® Reference ATX Thermal Mechanical Design	59
6.7 Reference Attach Mechanism	60
6.7.1 Structural Design Strategy	60
6.7.2 Mechanical Interface to the Reference Attach Mechanism	61
7 Intel® Quiet System Technology (Intel® QST)	63
7.1 Intel® QST Algorithm	63
7.1.1 Output Weighting Matrix	64
7.1.2 Proportional-Integral-Derivative (PID)	64
7.2 Board and System Implementation of Intel® QST	66
7.3 Intel® QST Configuration and Tuning	68

Match case Limit results 1 per page

Intel® Enabled Reference Solution Information

126

Thermal and Mechanical Design Guidelines

Note:

These vendors and devices are listed by Intel as a convenience to Intel's general

customer base, but Intel does not make any representations or warranties whatsoever

regarding quality, reliability, functionality, or compatibility of these devices. This list

and/or these devices may be subject to change without notice.

Table 7–6. BTX Reference Thermal Solution Providers

Supplier

Part Description

Part

Number

Contact

Phone

Notes

Mitac International

Corp

Support and

Retention Module

Michael Tsai

886-3-328-

9000 Ext.6545

AVC*

(ASIA Vital

Components Co., Ltd)

Type I Thermal

Module Fan

Assembly

2004

DB09238B

120084

David Chao

+886-2-

22996930

Extension: 619

AVC*

(ASIA Vital

Components Co., Ltd)

Type II Thermal

Module Fan

Assembly

2004

DB07038B

12UP001

David Chao

+886-2-

22996930

Extension: 619

TBD

Type II Thermal

Module Fan

Assembly

65W 2006

TBD

CCI

(Chaun-Choung

Technology Corp.)

Extrusion

TBD

Harry Lin

Monica Chih

714-739-5797

+886-2-

29952666

Extension 131

AVC

(ASIA Vital

Components Co., Ltd)

Fan and Duct

TBD

David Chao

+886-2-

22996930

Extension: 619

NOTES:

Part numbers were not available at the time of release of this document. Contact the

company for part number identification prior to the next revision of this document.

The user should note that for the 2004 Type I Intel reference Thermal Module

Assembly: also meets 2005 Performance (130W) and Mainstream (84W) as well as the

2004 Performance (115W).

The user should note that for the 2004 Type II Intel reference Thermal Module

Assembly: meets the requirements for 115W 2004 Performance 775_VR_CONFIG_04

and 95W 2005 Mainstream 775_VR_CONFIG_05.

The Type II TMA designed for 65W 2006 FMB has been optimized for acoustics and

cost. It is not interchangeable with the 95W Type II reference design.

Note:

These vendors/devices are listed by Intel as a convenience to Intel's general customer

base, but Intel does not make any representations or warranties whatsoever regarding

quality, reliability, functionality, or compatibility of these devices. This list and/or

these devices may be subject to change without notice.