Intel E6700 Mechanical Design Guidelines - Page 99
Thermocouple placed into groove, Removing Excess Solder
UPC - 735858184618
View all Intel E6700 manuals
Add to My Manuals
Save this manual to your list of manuals |
Page 99 highlights
Case Temperature Reference Metrology Figure 7-31. Thermocouple placed into groove 29. Using a blade carefully shave the excess solder above the IHS surface. Only shave in one direction until solder is flush with the groove surface (Figure 7-32). Figure 7-32. Removing Excess Solder Note: Take usual precautions when using open blades 30. Clean the surface of the IHS with Alcohol and use compressed air to remove any remaining contaminants. Thermal and Mechanical Design Guidelines 99
Case Temperature Reference Metrology
Thermal and Mechanical Design Guidelines
99
Figure 7-31. Thermocouple placed into groove
29.
Using a blade carefully shave the excess solder above the IHS surface. Only shave
in one direction until solder is flush with the groove surface (Figure 7-32).
Figure 7-32. Removing Excess Solder
Note:
Take usual precautions when using open blades
30.
Clean the surface of the IHS with Alcohol and use compressed air to remove any
remaining contaminants.