Intel E6700 Mechanical Design Guidelines - Page 91
Thermocouple Bead Placement
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Case Temperature Reference Metrology 9. Lift the wire at the middle of groove with tweezers and bend the front of wire to place the thermocouple in the groove ensuring the tip is in contact with the end and bottom of the groove in the IHS (Figure 7-19-A and B). Figure 7-19. Thermocouple Bead Placement (A) (B) 10. Place the package under the microscope to continue with process. It is also recommended to use a fixture (like processor tray or a plate) to help holding the unit in place for the rest of the attach process. Thermal and Mechanical Design Guidelines 91
Case Temperature Reference Metrology
Thermal and Mechanical Design Guidelines
91
9.
Lift the wire at the middle of groove with tweezers and bend the front of wire to
place the thermocouple in the groove ensuring the tip is in contact with the end
and bottom of the groove in the IHS (Figure 7-19-A and B).
Figure 7-19. Thermocouple Bead Placement
(A)
(B)
10.
Place the package under the microscope to continue with process. It is also
recommended to use a fixture (like processor tray or a plate) to help holding the
unit in place for the rest of the attach process.