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Intel E6700 Mechanical Design Guidelines - Page 17

Thermal Profile, Thermal Solution Design Requirements - core 2 duo 3 2

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Processor Thermal/Mechanical Information Figure 2-2. Processor Case Temperature Measurement Location Measure TC at this point (geometric center of the package) 37.5 mm 37.5 mm 2.2.2 2.2.3 Thermal Profile The Thermal Profile defines the maximum case temperature as a function of processor power dissipation. Refer to the datasheet for the further information. Thermal Solution Design Requirements While the thermal profile provides flexibility for ATX /BTX thermal design based on its intended target thermal environment, thermal solutions that are intended to function in a multitude of systems and environments need to be designed for the worst-case thermal environment. The majority of ATX /BTX platforms are targeted to function in an environment that will have up to a 35 °C ambient temperature external to the system. For ATX platforms, an active air-cooled design, assumed be used in ATX Chassis, with a fan installed at the top of the heatsink equivalent to the reference design (see Chapter 6) should be designed to manage the processor TDP at an inlet temperature of 35 °C + 5°C = 40 °C. For BTX platforms, a front-to-back cooling design equivalent to Intel BTX TMA Type II reference design (see the Chapter 5) should be designed to manage the processor TDP at an inlet temperature of 35 °C + 0.5 °C = 35.5 °C. The slope of the thermal profile was established assuming a generational improvement in thermal solution performance of the Intel reference design. For an example of Intel Core™2 Duo processor E8000 series with 6 MB in ATX platform, its improvement is about 15% over the Intel reference design (E18764-001). This performance is expressed as the slope on the thermal profile and can be thought of as the thermal resistance of the heatsink attached to the processor, ΨCA (Refer to Section 3.1). The intercept on the thermal profile assumes a maximum ambient operating condition that is consistent with the available chassis solutions. Thermal and Mechanical Design Guidelines 17

Section	Page
1 Introduction	9
1.1 Document Goals and Scope	9
1.1.1 Importance of Thermal Management	9
1.1.2 Document Goals	9
1.1.3 Document Scope	10
1.2 References	11
1.3 Definition of Terms	11
2 Processor Thermal/Mechanical Information	13
2.1 Mechanical Requirements	13
2.1.1 Processor Package	13
2.1.2 Heatsink Attach	15
2.1.2.1 General Guidelines	15
2.1.2.2 Heatsink Clip Load Requirement	15
2.1.2.3 Additional Guidelines	16
2.2 Thermal Requirements	16
2.2.1 Processor Case Temperature	16
2.2.2 Thermal Profile	17
2.2.3 Thermal Solution Design Requirements	17
2.2.4 TCONTROL	18
2.3 Heatsink Design Considerations	19
2.3.1 Heatsink Size	20
2.3.2 Heatsink Mass	20
2.3.3 Package IHS Flatness	21
2.3.4 Thermal Interface Material	21
2.4 System Thermal Solution Considerations	22
2.4.1 Chassis Thermal Design Capabilities	22
2.4.2 Improving Chassis Thermal Performance	22
2.4.3 Summary	23
2.5 System Integration Considerations	23
3 Thermal Metrology	25
3.1 Characterizing Cooling Performance Requirements	25
3.1.1 Example	26
3.2 Processor Thermal Solution Performance Assessment	27
3.3 Local Ambient Temperature Measurement Guidelines	27
3.4 Processor Case Temperature Measurement Guidelines	30
4 Thermal Management Logic and Thermal Monitor Feature	31
4.1 Processor Power Dissipation	31
4.2 Thermal Monitor Implementation	31
4.2.1 PROCHOT# Signal	32
4.2.2 Thermal Control Circuit	32
4.2.2.1 Thermal Monitor	32
4.2.3 Thermal Monitor 2	33
4.2.4 Operation and Configuration	34
4.2.5 On-Demand Mode	35
4.2.6 System Considerations	35
4.2.7 Operating System and Application Software Considerations	36
4.2.8 THERMTRIP# Signal	36
4.2.9 Cooling System Failure Warning	36
4.2.10 Digital Thermal Sensor	37
4.2.11 Platform Environmental Control Interface (PECI)	38
5 Balanced Technology Extended (BTX) Thermal/Mechanical Design Information	39
5.1 Overview of the BTX Reference Design	39
5.1.1 Target Heatsink Performance	39
5.1.2 Acoustics	40
5.1.3 Effective Fan Curve	41
5.1.4 Voltage Regulator Thermal Management	42
5.1.5 Altitude	43
5.1.6 Reference Heatsink Thermal Validation	43
5.2 Environmental Reliability Testing	43
5.2.1 Structural Reliability Testing	43
5.2.1.1 Random Vibration Test Procedure	43
5.2.1.2 Shock Test Procedure	44
5.2.2 Power Cycling	45
5.2.3 Recommended BIOS/CPU/Memory Test Procedures	46
5.3 Material and Recycling Requirements	46
5.4 Safety Requirements	47
5.5 Geometric Envelope for Intel® Reference BTX Thermal Module Assembly	47
5.6 Preload and TMA Stiffness	48
5.6.1 Structural Design Strategy	48
5.6.2 TMA Preload verse Stiffness	48
6 ATX Thermal/Mechanical Design Information	51
6.1 ATX Reference Design Requirements	51
6.2 Validation Results for Reference Design	53
6.2.1 Heatsink Performance	53
6.2.2 Acoustics	54
6.2.3 Altitude	54
6.2.4 Heatsink Thermal Validation	55
6.3 Environmental Reliability Testing	55
6.3.1 Structural Reliability Testing	55
6.3.1.1 Random Vibration Test Procedure	55
6.3.1.2 Shock Test Procedure	56
6.3.2 Power Cycling	57
6.3.3 Recommended BIOS/CPU/Memory Test Procedures	58
6.4 Material and Recycling Requirements	58
6.5 Safety Requirements	59
6.6 Geometric Envelope for Intel® Reference ATX Thermal Mechanical Design	59
6.7 Reference Attach Mechanism	60
6.7.1 Structural Design Strategy	60
6.7.2 Mechanical Interface to the Reference Attach Mechanism	61
7 Intel® Quiet System Technology (Intel® QST)	63
7.1 Intel® QST Algorithm	63
7.1.1 Output Weighting Matrix	64
7.1.2 Proportional-Integral-Derivative (PID)	64
7.2 Board and System Implementation of Intel® QST	66
7.3 Intel® QST Configuration and Tuning	68

Match case Limit results 1 per page

Processor Thermal/Mechanical Information

Thermal and Mechanical Design Guidelines

Figure 2-2. Processor Case Temperature Measurement Location

37.5 mm

Measure T

at this point

(geometric center of the package)

37.5 mm

Measure T

at this point

(geometric center of the package)

37.5 mm

2.2.2

Thermal Profile

The Thermal Profile defines the maximum case temperature as a function of processor

power dissipation. Refer to the datasheet for the further information.

2.2.3

Thermal Solution Design Requirements

While the thermal profile provides flexibility for ATX /BTX thermal design based on its

intended target thermal environment, thermal solutions that are intended to function

in a multitude of systems and environments need to be designed for the worst-case

thermal environment. The majority of ATX /BTX platforms are targeted to function in

an environment that will have up to a 35 °C ambient temperature external to the

system.

For ATX platforms, an active air-cooled design, assumed be used in ATX Chassis, with

a fan installed at the top of the heatsink equivalent to the reference design (see

Chapter 6) should be designed to manage the processor TDP at an inlet temperature

of 35 °C + 5°C = 40 °C.

For BTX platforms, a front-to-back cooling design equivalent to Intel BTX TMA Type II

reference design (see the Chapter 5) should be designed to manage the processor

TDP at an inlet temperature of 35 °C + 0.5 °C = 35.5 °C.

The slope of the thermal profile was established assuming a generational improvement

in thermal solution performance of the Intel reference design. For an example of Intel

Core™2 Duo processor E8000 series with 6 MB in ATX platform, its improvement is

about 15% over the Intel reference design (E18764-001). This performance is

expressed as the slope on the thermal profile and can be thought of as the thermal

resistance of the heatsink attached to the processor,

(Refer to Section 3.1). The

intercept on the thermal profile assumes a maximum ambient operating condition that

is consistent with the available chassis solutions.