Intel E6700 Mechanical Design Guidelines - Page 13
Processor Thermal/Mechanical, Information
UPC - 735858184618
View all Intel E6700 manuals
Add to My Manuals
Save this manual to your list of manuals |
Page 13 highlights
Processor Thermal/Mechanical Information 2 Processor Thermal/Mechanical Information 2.1 Mechanical Requirements 2.1.1 Processor Package The processors covered in the document are packaged in a 775-Land LGA package that interfaces with the motherboard using a LGA775 socket. Refer to the datasheet for detailed mechanical specifications. The processor connects to the motherboard through a land grid array (LGA) surface mount socket. The socket contains 775 contacts arrayed about a cavity in the center of the socket with solder balls for surface mounting to the motherboard. The socket is named LGA775 socket. A description of the socket can be found in the LGA775 Socket Mechanical Design Guide. The package includes an integrated heat spreader (IHS) that is shown in Figure 2-1 for illustration only. Refer to the processor datasheet for further information. In case of conflict, the package dimensions in the processor datasheet supersedes dimensions provided in this document. Figure 2-1. Package IHS Load Areas Thermal and Mechanical Design Guidelines 13