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Intel E6700 Mechanical Design Guidelines - Page 39

Balanced Technology Extended, BTX Thermal/Mechanical, Design Information

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Balanced Technology Extended (BTX) Thermal/Mechanical Design Information 5 Balanced Technology Extended (BTX) Thermal/Mechanical Design Information 5.1 Overview of the BTX Reference Design The reference thermal module assembly is a Type II BTX compliant design and is compliant with the reference BTX motherboard keep-out and height recommendations defined in Section 6.6. The solution comes as an integrated assembly. An isometric view of the assembly is provided in Figure 5-4. 5.1.1 Target Heatsink Performance Table 5-1 provides the target heatsink performance for the processor with the BTX boundary conditions. The results will be evaluated using the test procedure described in Section 5.2. The table also includes a TA assumption of 35.5 °C for the Intel reference thermal solution at the processor fan heatsink inlet discussed in Section 3.3. The analysis assumes a uniform 35 °C external ambient temperature to the chassis of across the fan inlet, resulting in a temperature rise, TR, of 0.5 °C. Meeting TA and ΨCA targets can maximize processor performance (refer to Sections 2.2, 2.4. and Chapter 4). Minimizing TR can lead to improved acoustics. Table 5-1. Balanced Technology Extended (BTX) Type II Reference TMA Performance Processor Thermal Requirements, Ψca (Mean + 3σ) Assum TAption Notes Intel Core™2 Duo processor E8000 series with 6 MB cache Intel Core™2 Duo processor E7000 series with 3 MB cache /Intel Pentium® dual-core processor E6000, E5000 series with 2 MB cache / Intel® Celeron® processor E3000 series with 1 MB cache 0.57 °C/W 0.594 °C/W 35.5 °C 1,2,3 35.5 °C 1,2,3 NOTES: 1. Performance targets (Ψ ca) as measured with a live processor at TDP. 2. The difference in Ψ ca between the Intel Core™2 Duo processor E8000 series with 6 MB cache, Intel Core™2 Duo processor E7000 series with 3 MB cache, Intel Pentium® dual-core processor E6000, E5000 series with 2 MB cache, and Intel® Celeron® processor E3000 series is due to a slight difference in the die size. 3. This data is pre-silicon data, and subject to change with the post silicon validate results. Thermal and Mechanical Design Guidelines 39

Section	Page
1 Introduction	9
1.1 Document Goals and Scope	9
1.1.1 Importance of Thermal Management	9
1.1.2 Document Goals	9
1.1.3 Document Scope	10
1.2 References	11
1.3 Definition of Terms	11
2 Processor Thermal/Mechanical Information	13
2.1 Mechanical Requirements	13
2.1.1 Processor Package	13
2.1.2 Heatsink Attach	15
2.1.2.1 General Guidelines	15
2.1.2.2 Heatsink Clip Load Requirement	15
2.1.2.3 Additional Guidelines	16
2.2 Thermal Requirements	16
2.2.1 Processor Case Temperature	16
2.2.2 Thermal Profile	17
2.2.3 Thermal Solution Design Requirements	17
2.2.4 TCONTROL	18
2.3 Heatsink Design Considerations	19
2.3.1 Heatsink Size	20
2.3.2 Heatsink Mass	20
2.3.3 Package IHS Flatness	21
2.3.4 Thermal Interface Material	21
2.4 System Thermal Solution Considerations	22
2.4.1 Chassis Thermal Design Capabilities	22
2.4.2 Improving Chassis Thermal Performance	22
2.4.3 Summary	23
2.5 System Integration Considerations	23
3 Thermal Metrology	25
3.1 Characterizing Cooling Performance Requirements	25
3.1.1 Example	26
3.2 Processor Thermal Solution Performance Assessment	27
3.3 Local Ambient Temperature Measurement Guidelines	27
3.4 Processor Case Temperature Measurement Guidelines	30
4 Thermal Management Logic and Thermal Monitor Feature	31
4.1 Processor Power Dissipation	31
4.2 Thermal Monitor Implementation	31
4.2.1 PROCHOT# Signal	32
4.2.2 Thermal Control Circuit	32
4.2.2.1 Thermal Monitor	32
4.2.3 Thermal Monitor 2	33
4.2.4 Operation and Configuration	34
4.2.5 On-Demand Mode	35
4.2.6 System Considerations	35
4.2.7 Operating System and Application Software Considerations	36
4.2.8 THERMTRIP# Signal	36
4.2.9 Cooling System Failure Warning	36
4.2.10 Digital Thermal Sensor	37
4.2.11 Platform Environmental Control Interface (PECI)	38
5 Balanced Technology Extended (BTX) Thermal/Mechanical Design Information	39
5.1 Overview of the BTX Reference Design	39
5.1.1 Target Heatsink Performance	39
5.1.2 Acoustics	40
5.1.3 Effective Fan Curve	41
5.1.4 Voltage Regulator Thermal Management	42
5.1.5 Altitude	43
5.1.6 Reference Heatsink Thermal Validation	43
5.2 Environmental Reliability Testing	43
5.2.1 Structural Reliability Testing	43
5.2.1.1 Random Vibration Test Procedure	43
5.2.1.2 Shock Test Procedure	44
5.2.2 Power Cycling	45
5.2.3 Recommended BIOS/CPU/Memory Test Procedures	46
5.3 Material and Recycling Requirements	46
5.4 Safety Requirements	47
5.5 Geometric Envelope for Intel® Reference BTX Thermal Module Assembly	47
5.6 Preload and TMA Stiffness	48
5.6.1 Structural Design Strategy	48
5.6.2 TMA Preload verse Stiffness	48
6 ATX Thermal/Mechanical Design Information	51
6.1 ATX Reference Design Requirements	51
6.2 Validation Results for Reference Design	53
6.2.1 Heatsink Performance	53
6.2.2 Acoustics	54
6.2.3 Altitude	54
6.2.4 Heatsink Thermal Validation	55
6.3 Environmental Reliability Testing	55
6.3.1 Structural Reliability Testing	55
6.3.1.1 Random Vibration Test Procedure	55
6.3.1.2 Shock Test Procedure	56
6.3.2 Power Cycling	57
6.3.3 Recommended BIOS/CPU/Memory Test Procedures	58
6.4 Material and Recycling Requirements	58
6.5 Safety Requirements	59
6.6 Geometric Envelope for Intel® Reference ATX Thermal Mechanical Design	59
6.7 Reference Attach Mechanism	60
6.7.1 Structural Design Strategy	60
6.7.2 Mechanical Interface to the Reference Attach Mechanism	61
7 Intel® Quiet System Technology (Intel® QST)	63
7.1 Intel® QST Algorithm	63
7.1.1 Output Weighting Matrix	64
7.1.2 Proportional-Integral-Derivative (PID)	64
7.2 Board and System Implementation of Intel® QST	66
7.3 Intel® QST Configuration and Tuning	68

Match case Limit results 1 per page

Balanced Technology Extended (BTX) Thermal/Mechanical Design Information

Thermal and Mechanical Design Guidelines

Balanced Technology Extended

(BTX) Thermal/Mechanical

Design Information

5.1

Overview of the BTX Reference Design

The reference thermal module assembly is a Type II BTX compliant design and is

compliant with the reference BTX motherboard keep-out and height recommendations

defined in Section 6.6.

The solution comes as an integrated assembly. An isometric view of the assembly is

provided in Figure 5-4.

5.1.1

Target Heatsink Performance

Table 5–1 provides the target heatsink performance for the processor with the BTX

boundary conditions. The results will be evaluated using the test procedure described

in Section 5.2.

The table also includes a T

assumption of 35.5 °C for the Intel reference thermal

solution at the processor fan heatsink inlet discussed in Section 3.3. The analysis

assumes a uniform 35 °C external ambient temperature to the chassis of across the

fan inlet, resulting in a temperature rise, T

, of 0.5 °C. Meeting T

and

targets can

maximize processor performance (refer to Sections 2.2, 2.4. and Chapter 4).

Minimizing T

can lead to improved acoustics.

Table 5–1. Balanced Technology Extended (BTX) Type II Reference TMA Performance

Processor

Thermal

Requirements,

(Mean + 3

)

Assumption

Notes

Intel Core™2 Duo processor E8000

series with 6 MB cache

0.57

C/W

35.5

1,2,3

Intel Core™2 Duo processor E7000

series with 3 MB cache /Intel Pentium

dual-core processor

E6000,

E5000 series

with 2 MB cache /

Intel

Celeron

processor E3000 series with 1 MB cache

0.594

C/W

35.5

1,2,3

NOTES:

Performance targets (

ca) as measured with a live processor at TDP.

The difference in

ca between the Intel Core™2 Duo processor E8000 series with

6 MB cache, Intel Core™2 Duo processor E7000 series with 3 MB cache, Intel Pentium

dual-core processor E6000, E5000 series with 2 MB cache, and Intel

Celeron

processor E3000 series is due to a slight difference in the die size.

This data is pre-silicon data, and subject to change with the post silicon validate

results.