Intel E6700 Mechanical Design Guidelines - Page 97
View Through Lens at Solder Station, Moving Solder back onto Thermocouple
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Case Temperature Reference Metrology 24. You may need to move the solder back toward the groove as the IHS begins to heat. Use a fine tip tweezers to push the solder into the end of the groove until a solder ball is built up (Figure 7-28 and Figure 7-29). Figure 7-28. View Through Lens at Solder Station Figure 7-29. Moving Solder back onto Thermocouple Bead Thermal and Mechanical Design Guidelines 97
Case Temperature Reference Metrology
Thermal and Mechanical Design Guidelines
97
24.
You may need to move the solder back toward the groove as the IHS begins to
heat. Use a fine tip tweezers to push the solder into the end of the groove until a
solder ball is built up (Figure 7-28 and Figure 7-29).
Figure 7-28. View Through Lens at Solder Station
Figure 7-29. Moving Solder back onto Thermocouple Bead