Intel E6700 Mechanical Design Guidelines - Page 4

4.2.6 4.2.7 4.2.8 4.2.9 4.2.10 4.2.11 System Considerations 35 Operating System and Application Software Considerations 36 THERMTRIP# Signal 36 Cooling System Failure Warning 36 Digital Thermal Sensor 37 Platform Environmental Control Interface (PECI 38 5 Balanced Technology Extended (BTX) Thermal/Mechanical Design Information.........39 5.1 Overview of the BTX Reference Design 39 5.1.1 Target Heatsink Performance 39 5.1.2 Acoustics 40 5.1.3 Effective Fan Curve 41 5.1.4 Voltage Regulator Thermal Management 42 5.1.5 Altitude 43 5.1.6 Reference Heatsink Thermal Validation 43 5.2 Environmental Reliability Testing 43 5.2.1 Structural Reliability Testing 43 5.2.1.1 Random Vibration Test Procedure 43 5.2.1.2 Shock Test Procedure 44 5.2.2 Power Cycling 45 5.2.3 Recommended BIOS/CPU/Memory Test Procedures 46 5.3 Material and Recycling Requirements 46 5.4 Safety Requirements 47 5.5 Geometric Envelope for Intel® Reference BTX Thermal Module Assembly ......47 5.6 Preload and TMA Stiffness 48 5.6.1 Structural Design Strategy 48 5.6.2 TMA Preload verse Stiffness 48 6 ATX Thermal/Mechanical Design Information 51 6.1 ATX Reference Design Requirements 51 6.2 Validation Results for Reference Design 53 6.2.1 Heatsink Performance 53 6.2.2 Acoustics 54 6.2.3 Altitude 54 6.2.4 Heatsink Thermal Validation 55 6.3 Environmental Reliability Testing 55 6.3.1 Structural Reliability Testing 55 6.3.1.1 Random Vibration Test Procedure 55 6.3.1.2 Shock Test Procedure 56 6.3.2 Power Cycling 57 6.3.3 Recommended BIOS/CPU/Memory Test Procedures 58 6.4 Material and Recycling Requirements 58 6.5 Safety Requirements 59 6.6 Geometric Envelope for Intel® Reference ATX Thermal Mechanical Design.....59 6.7 Reference Attach Mechanism 60 6.7.1 Structural Design Strategy 60 6.7.2 Mechanical Interface to the Reference Attach Mechanism 61 7 Intel® Quiet System Technology (Intel® QST 63 7.1 Intel® QST Algorithm 63 7.1.1 Output Weighting Matrix 64 7.1.2 Proportional-Integral-Derivative (PID 64 7.2 Board and System Implementation of Intel® QST 66 4 Thermal and Mechanical Design Guidelines