Intel E6700 Mechanical Design Guidelines - Page 42
Voltage Regulator Thermal Management
UPC - 735858184618
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Balanced Technology Extended (BTX) Thermal/Mechanical Design Information Figure 5-1. Effective TMA Fan Curves with Reference Extrusion dP (in. H2O) 0.400 0.350 0.300 0.250 0.200 0.150 0.100 0.050 0.000 0.0 Reference TMA @ 5300 RPM Reference TMA @ 2500 RPM Reference TMA @ 1200 RPM 5.0 10.0 15.0 20.0 25.0 30.0 35.0 Airflow (cfm ) 5.1.4 Voltage Regulator Thermal Management The BTX TMA is integral to the cooling of the processor voltage regulator (VR). The reference design TMA will include a flow partitioning device to ensure an appropriate airflow balance between the TMA and the VR. In validation the need for this component will be evaluated. The BTX thermal management strategy relies on the Thermal Module to provide effective cooling for the voltage regulator (VR) chipset and system memory components on the motherboard. The Thermal Module is required to have features that allow for airflow to bypass the heatsink and flow over the VR region on both the primary and secondary sides of the board. The following requirements apply to VR cooling. Table 5-3. VR Airflow Requirements Item Target Minimum VR bypass airflow for 775_VR_CONFIG_06 processors 2.4 CFM NOTES: 1. This is the recommended airflow rate that should be delivered to the VR when the VR power is at a maximum in order to support the 775_VR_CONFIG_06 processors at TDP power dissipation and the chassis external environment temperature is at 35 ºC. Less airflow is necessary when the VR power is not at a maximum or if the external ambient temperature is less than 35 ºC. 2. This recommended airflow rate is based on the requirements for the Intel 965 Express Chipset Family. 42 Thermal and Mechanical Design Guidelines