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Intel E6700 Mechanical Design Guidelines - Page 48

Preload and TMA Stiffness

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Balanced Technology Extended (BTX) Thermal/Mechanical Design Information 5.6 Preload and TMA Stiffness 5.6.1 Structural Design Strategy Structural design strategy for the Intel Type II TMA is to minimize upward board deflection during shock to help protect the LGA775 socket. BTX thermal solutions use the SRM and TMA that together resists local board curvature under the socket and minimize, board deflection (Figure 5-5). In addition, a moderate preload provides initial downward deflection. Figure 5-5. Upward Board Deflection During Shock Shock Load Less curvature in region between SRM and TMA 5.6.2 TMA Preload verse Stiffness The Thermal Module assembly is required to provide a static preload to ensure protection against fatigue failure of socket solder joint. The allowable preload range for BTX platforms is provided in Table 5-4, but the specific target value is a function of the Thermal Module effective stiffness. The solution space for the Thermal Module effective stiffness and applied preload combinations is shown by the shaded region of Figure 5-6. This solution space shows that the Thermal Module assembly must have an effective stiffness that is sufficiently large such that the minimum preload determined from the relationship requirement in Figure 5-6 does not exceed the maximum allowed preload shown in Table 5-4. Furthermore, if the Thermal Module effective stiffness is so large that the minimum preload determined from Figure 5-6 is below the minimum required value given in Table 5-4, then the Thermal Module should be re-designed to have a preload that lies within the range given in Table 5-4, allowing for preload tolerances. 48 Thermal and Mechanical Design Guidelines

Section	Page
1 Introduction	9
1.1 Document Goals and Scope	9
1.1.1 Importance of Thermal Management	9
1.1.2 Document Goals	9
1.1.3 Document Scope	10
1.2 References	11
1.3 Definition of Terms	11
2 Processor Thermal/Mechanical Information	13
2.1 Mechanical Requirements	13
2.1.1 Processor Package	13
2.1.2 Heatsink Attach	15
2.1.2.1 General Guidelines	15
2.1.2.2 Heatsink Clip Load Requirement	15
2.1.2.3 Additional Guidelines	16
2.2 Thermal Requirements	16
2.2.1 Processor Case Temperature	16
2.2.2 Thermal Profile	17
2.2.3 Thermal Solution Design Requirements	17
2.2.4 TCONTROL	18
2.3 Heatsink Design Considerations	19
2.3.1 Heatsink Size	20
2.3.2 Heatsink Mass	20
2.3.3 Package IHS Flatness	21
2.3.4 Thermal Interface Material	21
2.4 System Thermal Solution Considerations	22
2.4.1 Chassis Thermal Design Capabilities	22
2.4.2 Improving Chassis Thermal Performance	22
2.4.3 Summary	23
2.5 System Integration Considerations	23
3 Thermal Metrology	25
3.1 Characterizing Cooling Performance Requirements	25
3.1.1 Example	26
3.2 Processor Thermal Solution Performance Assessment	27
3.3 Local Ambient Temperature Measurement Guidelines	27
3.4 Processor Case Temperature Measurement Guidelines	30
4 Thermal Management Logic and Thermal Monitor Feature	31
4.1 Processor Power Dissipation	31
4.2 Thermal Monitor Implementation	31
4.2.1 PROCHOT# Signal	32
4.2.2 Thermal Control Circuit	32
4.2.2.1 Thermal Monitor	32
4.2.3 Thermal Monitor 2	33
4.2.4 Operation and Configuration	34
4.2.5 On-Demand Mode	35
4.2.6 System Considerations	35
4.2.7 Operating System and Application Software Considerations	36
4.2.8 THERMTRIP# Signal	36
4.2.9 Cooling System Failure Warning	36
4.2.10 Digital Thermal Sensor	37
4.2.11 Platform Environmental Control Interface (PECI)	38
5 Balanced Technology Extended (BTX) Thermal/Mechanical Design Information	39
5.1 Overview of the BTX Reference Design	39
5.1.1 Target Heatsink Performance	39
5.1.2 Acoustics	40
5.1.3 Effective Fan Curve	41
5.1.4 Voltage Regulator Thermal Management	42
5.1.5 Altitude	43
5.1.6 Reference Heatsink Thermal Validation	43
5.2 Environmental Reliability Testing	43
5.2.1 Structural Reliability Testing	43
5.2.1.1 Random Vibration Test Procedure	43
5.2.1.2 Shock Test Procedure	44
5.2.2 Power Cycling	45
5.2.3 Recommended BIOS/CPU/Memory Test Procedures	46
5.3 Material and Recycling Requirements	46
5.4 Safety Requirements	47
5.5 Geometric Envelope for Intel® Reference BTX Thermal Module Assembly	47
5.6 Preload and TMA Stiffness	48
5.6.1 Structural Design Strategy	48
5.6.2 TMA Preload verse Stiffness	48
6 ATX Thermal/Mechanical Design Information	51
6.1 ATX Reference Design Requirements	51
6.2 Validation Results for Reference Design	53
6.2.1 Heatsink Performance	53
6.2.2 Acoustics	54
6.2.3 Altitude	54
6.2.4 Heatsink Thermal Validation	55
6.3 Environmental Reliability Testing	55
6.3.1 Structural Reliability Testing	55
6.3.1.1 Random Vibration Test Procedure	55
6.3.1.2 Shock Test Procedure	56
6.3.2 Power Cycling	57
6.3.3 Recommended BIOS/CPU/Memory Test Procedures	58
6.4 Material and Recycling Requirements	58
6.5 Safety Requirements	59
6.6 Geometric Envelope for Intel® Reference ATX Thermal Mechanical Design	59
6.7 Reference Attach Mechanism	60
6.7.1 Structural Design Strategy	60
6.7.2 Mechanical Interface to the Reference Attach Mechanism	61
7 Intel® Quiet System Technology (Intel® QST)	63
7.1 Intel® QST Algorithm	63
7.1.1 Output Weighting Matrix	64
7.1.2 Proportional-Integral-Derivative (PID)	64
7.2 Board and System Implementation of Intel® QST	66
7.3 Intel® QST Configuration and Tuning	68

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Balanced Technology Extended (BTX) Thermal/Mechanical Design Information

Thermal and Mechanical Design Guidelines

5.6

Preload and TMA Stiffness

5.6.1

Structural Design Strategy

Structural design strategy for the Intel Type II TMA is to minimize upward board

deflection during shock to help protect the LGA775 socket.

BTX thermal solutions use the SRM and TMA that together resists local board

curvature under the socket and minimize, board deflection (Figure 5-5). In addition, a

moderate preload provides initial downward deflection.

Figure 5-5. Upward Board Deflection During Shock

5.6.2

TMA Preload verse Stiffness

The Thermal Module assembly is required to provide a static preload to ensure

protection against fatigue failure of socket solder joint. The allowable preload range

for BTX platforms is provided in Table 5–4, but the specific target value is a function

of the Thermal Module effective stiffness.

The solution space for the Thermal Module effective stiffness and applied preload

combinations is shown by the shaded region of Figure 5-6. This solution space shows

that the Thermal Module assembly must have an effective stiffness that is sufficiently

large such that the minimum preload determined from the relationship requirement in

Figure 5-6 does not exceed the maximum allowed preload shown in Table 5–4.

Furthermore, if the Thermal Module effective stiffness is so large that the minimum

preload determined from Figure 5-6 is below the minimum required value given in

Table 5–4, then the Thermal Module should be re-designed to have a preload that lies

within the range given in Table 5–4, allowing for preload tolerances.

Less curvature in region

between SRM and TMA

Shock Load