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Intel E6700 Mechanical Design Guidelines - Page 18

Example Thermal Profile - pentium

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Processor Thermal/Mechanical Information The thermal profiles for the Intel Core™2 Duo processor E8000 series with 6 MB cache, Intel Core™2 Duo processor E7000 series with 3 MB cache, and Intel Pentium dual-core processor E6000 and E5000 series with 2 MB cache, and Intel Celeron processor E3000 series with 1 MB cache are defined such that there is a single thermal solution for all of the 775_VR_CONFIG_06 processors. To determine compliance to the thermal profile, a measurement of the actual processor power dissipation is required. The measured power is plotted on the Thermal Profile to determine the maximum case temperature. Using the example in Figure 2-3 for a processor dissipating 50 W the maximum case temperature is 58 °C. See the datasheet for the thermal profile. Figure 2-3. Example Thermal Profile 70 Case Temperature (°C) 60 50 Thermal Profile TDP 40 0 10 20 30 40 50 60 70 Power (W) 2.2.4 TCONTROL TCONTROL defines the maximum operating temperature for the digital thermal sensor when the thermal solution fan speed is being controlled by the digital thermal sensor. The TCONTROL parameter defines a very specific processor operating region where fan speed can be reduced. This allows the system integrator a method to reduce the acoustic noise of the processor cooling solution, while maintaining compliance to the processor thermal specification. Note: The TCONTROL value for the processor is relative to the Thermal Control Circuit (TCC) activation set point which will be seen as 0 using the digital thermal sensor. As a result the TCONTROL value will always be a negative number. See Chapter 4 for the discussion the thermal management logic and features and Chapter 7 on Intel Quiet System Technology (Intel QST). The value of TCONTROL is driven by a number of factors. One of the most significant of these is the processor idle power. As a result a processor with a high (closer to 0) TCONTROL will dissipate more power than a part with lower value (farther from 0, such as larger negative number) of TCONTROL when running the same application. 18 Thermal and Mechanical Design Guidelines

Section	Page
1 Introduction	9
1.1 Document Goals and Scope	9
1.1.1 Importance of Thermal Management	9
1.1.2 Document Goals	9
1.1.3 Document Scope	10
1.2 References	11
1.3 Definition of Terms	11
2 Processor Thermal/Mechanical Information	13
2.1 Mechanical Requirements	13
2.1.1 Processor Package	13
2.1.2 Heatsink Attach	15
2.1.2.1 General Guidelines	15
2.1.2.2 Heatsink Clip Load Requirement	15
2.1.2.3 Additional Guidelines	16
2.2 Thermal Requirements	16
2.2.1 Processor Case Temperature	16
2.2.2 Thermal Profile	17
2.2.3 Thermal Solution Design Requirements	17
2.2.4 TCONTROL	18
2.3 Heatsink Design Considerations	19
2.3.1 Heatsink Size	20
2.3.2 Heatsink Mass	20
2.3.3 Package IHS Flatness	21
2.3.4 Thermal Interface Material	21
2.4 System Thermal Solution Considerations	22
2.4.1 Chassis Thermal Design Capabilities	22
2.4.2 Improving Chassis Thermal Performance	22
2.4.3 Summary	23
2.5 System Integration Considerations	23
3 Thermal Metrology	25
3.1 Characterizing Cooling Performance Requirements	25
3.1.1 Example	26
3.2 Processor Thermal Solution Performance Assessment	27
3.3 Local Ambient Temperature Measurement Guidelines	27
3.4 Processor Case Temperature Measurement Guidelines	30
4 Thermal Management Logic and Thermal Monitor Feature	31
4.1 Processor Power Dissipation	31
4.2 Thermal Monitor Implementation	31
4.2.1 PROCHOT# Signal	32
4.2.2 Thermal Control Circuit	32
4.2.2.1 Thermal Monitor	32
4.2.3 Thermal Monitor 2	33
4.2.4 Operation and Configuration	34
4.2.5 On-Demand Mode	35
4.2.6 System Considerations	35
4.2.7 Operating System and Application Software Considerations	36
4.2.8 THERMTRIP# Signal	36
4.2.9 Cooling System Failure Warning	36
4.2.10 Digital Thermal Sensor	37
4.2.11 Platform Environmental Control Interface (PECI)	38
5 Balanced Technology Extended (BTX) Thermal/Mechanical Design Information	39
5.1 Overview of the BTX Reference Design	39
5.1.1 Target Heatsink Performance	39
5.1.2 Acoustics	40
5.1.3 Effective Fan Curve	41
5.1.4 Voltage Regulator Thermal Management	42
5.1.5 Altitude	43
5.1.6 Reference Heatsink Thermal Validation	43
5.2 Environmental Reliability Testing	43
5.2.1 Structural Reliability Testing	43
5.2.1.1 Random Vibration Test Procedure	43
5.2.1.2 Shock Test Procedure	44
5.2.2 Power Cycling	45
5.2.3 Recommended BIOS/CPU/Memory Test Procedures	46
5.3 Material and Recycling Requirements	46
5.4 Safety Requirements	47
5.5 Geometric Envelope for Intel® Reference BTX Thermal Module Assembly	47
5.6 Preload and TMA Stiffness	48
5.6.1 Structural Design Strategy	48
5.6.2 TMA Preload verse Stiffness	48
6 ATX Thermal/Mechanical Design Information	51
6.1 ATX Reference Design Requirements	51
6.2 Validation Results for Reference Design	53
6.2.1 Heatsink Performance	53
6.2.2 Acoustics	54
6.2.3 Altitude	54
6.2.4 Heatsink Thermal Validation	55
6.3 Environmental Reliability Testing	55
6.3.1 Structural Reliability Testing	55
6.3.1.1 Random Vibration Test Procedure	55
6.3.1.2 Shock Test Procedure	56
6.3.2 Power Cycling	57
6.3.3 Recommended BIOS/CPU/Memory Test Procedures	58
6.4 Material and Recycling Requirements	58
6.5 Safety Requirements	59
6.6 Geometric Envelope for Intel® Reference ATX Thermal Mechanical Design	59
6.7 Reference Attach Mechanism	60
6.7.1 Structural Design Strategy	60
6.7.2 Mechanical Interface to the Reference Attach Mechanism	61
7 Intel® Quiet System Technology (Intel® QST)	63
7.1 Intel® QST Algorithm	63
7.1.1 Output Weighting Matrix	64
7.1.2 Proportional-Integral-Derivative (PID)	64
7.2 Board and System Implementation of Intel® QST	66
7.3 Intel® QST Configuration and Tuning	68

Match case Limit results 1 per page

Processor Thermal/Mechanical Information

Thermal and Mechanical Design Guidelines

The thermal profiles for the Intel Core™2 Duo processor E8000 series with 6 MB

cache, Intel Core™2 Duo processor E7000 series with 3 MB cache, and Intel Pentium

dual-core processor E6000 and E5000 series with 2 MB cache, and Intel Celeron

processor E3000 series with 1 MB cache are defined such that there is a single

thermal solution for all of the 775_VR_CONFIG_06 processors.

To determine compliance to the thermal profile, a measurement of the actual

processor power dissipation is required. The measured power is plotted on the

Thermal Profile to determine the maximum case temperature. Using the example in

Figure 2-3 for a processor dissipating 50 W the maximum case temperature is 58 °C.

See the datasheet for the thermal profile.

Figure 2-3. Example Thermal Profile

2.2.4

CONTROL

defines the maximum operating temperature for the digital thermal sensor

when the thermal solution fan speed is being controlled by the digital thermal sensor.

The T

CONTROL

parameter defines a very specific processor operating region where fan

speed can be reduced. This allows the system integrator a method to reduce the

acoustic noise of the processor cooling solution, while maintaining compliance to the

processor thermal specification.

Note:

The T

CONTROL

value for the processor is relative to the Thermal Control Circuit (TCC)

activation set point which will be seen as 0 using the digital thermal sensor. As a

result the T

CONTROL

value will always be a negative number. See Chapter 4 for the

discussion the thermal management logic and features and Chapter 7 on

Intel Quiet

System Technology (Intel QST)

The value of T

CONTROL

is driven by a number of factors. One of the most significant of

these is the processor idle power. As a result a processor with a high (closer to 0)

CONTROL

will dissipate more power than a part with lower value (farther from 0, such

as larger negative number) of T

CONTROL

when running the same application.

Power (W)

Case Temperature

(°C)

Thermal Profile

TDP