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Intel E6700 Mechanical Design Guidelines - Page 110

ATX/μATX Motherboard Keep-out Footprint Definition and Height Restrictions for Enabling

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Mechanical Drawings Figure 7-40. ATX/µATX Motherboard Keep-out Footprint Definition and Height Restrictions for Enabling Components - Sheet 1 ZONE REV REVISION HISTORY DESCRIPTION DATE APPROVED ( 95.00 ) BOARD PRIMARY SIDE ( 72.00 ) D ( 37.50 ) SOCKET BALL 1 ( 1.93 ) ( 1.09 ) SOCKET BALLS D ( 1.17 ) ( 16.965 ) 47.50 45.26 44.00 40.00 36.78 36.49 27.00 23.47 5.90 0.00 2 7.30 23.47 27.81 36.78 40.00 45.26 47.50 39.01 36.00 33.00 32.51 27.51 ( 16.87 ) 27.51 32.51 36.00 39.01 47.50 45.26 39.01 36.78 31.96 31.51 28.00 C 21.00 20.00 SOCKET VOL OUTLINE 13.00 7.05 2.20 2 0.00 6.15 ( 16.00 ) SEE DETAIL A 24.51 ( 20.00 ) 36.00 36.78 41.00 45.26 47.50 SOCKET BALL 1 ( 19.13 ) PACKAGE BOUNDARY A NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2 GEOMETRIC CENTER OF CPU PACKAGE / SOCKET HOUSING CAVITY. 3. BOARD COMPONENET KEEP-INS AND MECHANICAL COMPONENET KEEP-OUTS TO BE UTILIZED WITH SUFFICIENT ALLOWANCES FOR PLACEMENT AND SIZE TOLERANCES, ASSEMBLY PROCESS ACCESS, AND DYNAMIC EXCURSIONS. 4. ASSUME SYMMETRY FOR UNDIMENSIONED CORNERS AND EDGES. 8 7 6 ( 1.17 ) (0.965 ) 36.00 31.51 PIN 1 PACKAGE LANDS 23.00 19.32 15.50 ( 95.00 ) ( 2.80 ) (0.570 ) PACKAGE BOUNDARY C ( 1.09 ) SOCKET HOUSING CAVITY ( 17.44 ) DETAIL A ( 37.50 ) ( 72.00 ) LEGEND SOCKET/THERMO/MECHANICAL COMPONENT KEEP-INS 15.50 19.32 10.0 MM MAX COMPONENT HEIGHT 23.00 2.5 MM MAX COMPONENT HEIGHT B 31.51 6.0 MM MAX COMPONENT HEIGHT 36.00 25.0 MM MAX COMPONENT HEIGHT 39.01 1.8 MM MAX COMPONENT HEIGHT 4X 6.00 BOARD ROUTING KEEP-OUT 4X 4.03 UNLESS OTHERWISE SPECIFIED INTERPRET DIMENSIONS AND TOLERANCES IN ACCORDANCE WITH ASME Y14.5M-1994 DIMENSIONS ARE IN MILLIMETERS DESIGNED BY DATE CHECKED BY DATE DEPARTMENT R 2200 MISSION COLLEGE BLVD. CORP. P.O. BOX 58119 A SANTA CLARA, CA 95052-8119 TITLE THIRD ANGLE PROJECTION APPROVED BY DATE LGA775 microATX APPROVED BY DATE MATERIAL: N/A FINISH: N/A COMPONENT KEEP-INS SIZE CAGE CODE DRAWING NUMBER REV D C40819 3 SCALE: NONE DONOT SCALE DRAWING SHEET 1 OF 3 5 4 3 2 1 110 Thermal and Mechanical Design Guidelines

Section	Page
1 Introduction	9
1.1 Document Goals and Scope	9
1.1.1 Importance of Thermal Management	9
1.1.2 Document Goals	9
1.1.3 Document Scope	10
1.2 References	11
1.3 Definition of Terms	11
2 Processor Thermal/Mechanical Information	13
2.1 Mechanical Requirements	13
2.1.1 Processor Package	13
2.1.2 Heatsink Attach	15
2.1.2.1 General Guidelines	15
2.1.2.2 Heatsink Clip Load Requirement	15
2.1.2.3 Additional Guidelines	16
2.2 Thermal Requirements	16
2.2.1 Processor Case Temperature	16
2.2.2 Thermal Profile	17
2.2.3 Thermal Solution Design Requirements	17
2.2.4 TCONTROL	18
2.3 Heatsink Design Considerations	19
2.3.1 Heatsink Size	20
2.3.2 Heatsink Mass	20
2.3.3 Package IHS Flatness	21
2.3.4 Thermal Interface Material	21
2.4 System Thermal Solution Considerations	22
2.4.1 Chassis Thermal Design Capabilities	22
2.4.2 Improving Chassis Thermal Performance	22
2.4.3 Summary	23
2.5 System Integration Considerations	23
3 Thermal Metrology	25
3.1 Characterizing Cooling Performance Requirements	25
3.1.1 Example	26
3.2 Processor Thermal Solution Performance Assessment	27
3.3 Local Ambient Temperature Measurement Guidelines	27
3.4 Processor Case Temperature Measurement Guidelines	30
4 Thermal Management Logic and Thermal Monitor Feature	31
4.1 Processor Power Dissipation	31
4.2 Thermal Monitor Implementation	31
4.2.1 PROCHOT# Signal	32
4.2.2 Thermal Control Circuit	32
4.2.2.1 Thermal Monitor	32
4.2.3 Thermal Monitor 2	33
4.2.4 Operation and Configuration	34
4.2.5 On-Demand Mode	35
4.2.6 System Considerations	35
4.2.7 Operating System and Application Software Considerations	36
4.2.8 THERMTRIP# Signal	36
4.2.9 Cooling System Failure Warning	36
4.2.10 Digital Thermal Sensor	37
4.2.11 Platform Environmental Control Interface (PECI)	38
5 Balanced Technology Extended (BTX) Thermal/Mechanical Design Information	39
5.1 Overview of the BTX Reference Design	39
5.1.1 Target Heatsink Performance	39
5.1.2 Acoustics	40
5.1.3 Effective Fan Curve	41
5.1.4 Voltage Regulator Thermal Management	42
5.1.5 Altitude	43
5.1.6 Reference Heatsink Thermal Validation	43
5.2 Environmental Reliability Testing	43
5.2.1 Structural Reliability Testing	43
5.2.1.1 Random Vibration Test Procedure	43
5.2.1.2 Shock Test Procedure	44
5.2.2 Power Cycling	45
5.2.3 Recommended BIOS/CPU/Memory Test Procedures	46
5.3 Material and Recycling Requirements	46
5.4 Safety Requirements	47
5.5 Geometric Envelope for Intel® Reference BTX Thermal Module Assembly	47
5.6 Preload and TMA Stiffness	48
5.6.1 Structural Design Strategy	48
5.6.2 TMA Preload verse Stiffness	48
6 ATX Thermal/Mechanical Design Information	51
6.1 ATX Reference Design Requirements	51
6.2 Validation Results for Reference Design	53
6.2.1 Heatsink Performance	53
6.2.2 Acoustics	54
6.2.3 Altitude	54
6.2.4 Heatsink Thermal Validation	55
6.3 Environmental Reliability Testing	55
6.3.1 Structural Reliability Testing	55
6.3.1.1 Random Vibration Test Procedure	55
6.3.1.2 Shock Test Procedure	56
6.3.2 Power Cycling	57
6.3.3 Recommended BIOS/CPU/Memory Test Procedures	58
6.4 Material and Recycling Requirements	58
6.5 Safety Requirements	59
6.6 Geometric Envelope for Intel® Reference ATX Thermal Mechanical Design	59
6.7 Reference Attach Mechanism	60
6.7.1 Structural Design Strategy	60
6.7.2 Mechanical Interface to the Reference Attach Mechanism	61
7 Intel® Quiet System Technology (Intel® QST)	63
7.1 Intel® QST Algorithm	63
7.1.1 Output Weighting Matrix	64
7.1.2 Proportional-Integral-Derivative (PID)	64
7.2 Board and System Implementation of Intel® QST	66
7.3 Intel® QST Configuration and Tuning	68

Match case Limit results 1 per page

Mechanical Drawings

110

Thermal and Mechanical Design Guidelines

Figure 7-40. ATX/μATX Motherboard Keep-out Footprint Definition and Height Restrictions for Enabling Components - Sheet 1

47.50

0.00

39.01

21.00

20.00

28.00

36.78

41.00

36.00

31.51

23.00

15.50

23.00

31.51

36.78

45.26

31.96

45.26

19.32

47.50

45.26

36.49

27.00

36.78

23.47

36.78

45.26

40.00

27.81

32.51

27.51

32.51

27.51

47.50

4.03

36.00

24.51

6.15

5.90

7.30

7.05

13.00

2.20

33.00

44.00

40.00

39.01

36.00

(

)

17.44

PIN 1

(

)

16.965

(

)

1.17

(

)

1.09

(

)

1.93

(

)

2.80

(

)

1.09

(

)

1.17

6.00

(

)

37.50

(

)

37.50

(

)

95.00

(

)

72.00

(

)

95.00

(

)

72.00

(

)

0.965

(

)

0.570

(

)

16.00

(

)

16.87

(

)

20.00

(

)

19.13

LEGEND

SOCKET/THERMO/MECHANICAL COMPONENT KEEP-INS

10.0 MM MAX COMPONENT HEIGHT

2.5 MM MAX COMPONENT HEIGHT

6.0 MM MAX COMPONENT HEIGHT

25.0 MM MAX COMPONENT HEIGHT

1.8 MM MAX COMPONENT HEIGHT

BOARD ROUTING KEEP-OUT

SHEET 1 OF

DO NOT SCALE DRAWING

SCALE: NONE

C40819

REV

DRAWING NUMBER

CAGE CODE

SIZE

LGA775 microATX

COMPONENT KEEP-INS

TITLE

2200 MISSION COLLEGE BLVD.

P.O. BOX 58119

SANTA CLARA, CA 95052-8119

CORP.

DEPARTMENT

N/A

FINISH:

N/A

MATERIAL:

DATE

APPROVED BY

DATE

APPROVED BY

DATE

CHECKED BY

DATE

UNLESS OTHERWISE SPECIFIED

INTERPRET DIMENSIONS AND TOLERANCES

IN ACCORDANCE WITH ASME Y14.5M-1994

DIMENSIONS ARE IN MILLIMETERS

THIRD ANGLE PROJECTION

REVISION HISTORY

ZONE

REV

DESCRIPTION

DATE

APPROVED

NOTES:

1. DIMENSIONS ARE IN MILLIMETERS.

GEOMETRIC CENTER OF CPU PACKAGE / SOCKET HOUSING CAVITY.

3. BOARD COMPONENET KEEP-INS AND MECHANICAL COMPONENET KEEP-OUTS

TO BE UTILIZED WITH SUFFICIENT ALLOWANCES FOR PLACEMENT AND SIZE TOLERANCES,

ASSEMBLY PROCESS ACCESS, AND DYNAMIC EXCURSIONS.

4. ASSUME SYMMETRY FOR UNDIMENSIONED CORNERS AND EDGES.

DETAIL A

BOARD PRIMARY SIDE

PACKAGE

BOUNDARY

SOCKET BALL 1

SOCKET VOL

OUTLINE

SEE DETAIL

SOCKET BALLS

PACKAGE LANDS

SOCKET BALL 1

SOCKET HOUSING

CAVITY

PACKAGE BOUNDARY

PIN 1