Intel E6700 Mechanical Design Guidelines - Page 22

Processor Thermal/Mechanical Information

22

Thermal and Mechanical Design Guidelines

2.4

System Thermal Solution Considerations

2.4.1

Chassis Thermal Design Capabilities

The Intel reference thermal solutions and Intel Boxed Processor thermal solutions

assume that the chassis delivers a maximum T

A

at the inlet of the processor fan

heatsink. The following tables show the T

A

requirements for the reference solutions

and Intel Boxed Processor thermal solutions.

Table 2–1. Heatsink Inlet Temperature of Intel

®

Reference Thermal Solutions

Topic

ATX E18764-001

1

BTX Type II

Heatsink Inlet Temperature

40 °C

35.5 °C

NOTE:

1.

Intel reference designs (E18764-001) for ATX assume the use of the thermally

advantaged chassis (refer to

Thermally Advantaged Chassis (TAC) Design Guide

for

TAC thermal and mechanical requirements). The TAC 2.0 Design Guide defines a new

processor cooling solution inlet temperature target of 40 °C. The existing TAC 1.1

chassis can be compatible with TAC 2.0 guidelines.

Table 2–2. Heatsink Inlet Temperature of Intel

®

Boxed Processor Thermal Solutions

Topic

Boxed Processor for Intel

®

Core™2 Duo Processor

E8000, E7000 Series, Intel

®

Pentium

®

Dual-Core

Processor E6000, E5000 Series, and Intel

®

Celeron

®

Processor E3000 Series

Heatsink Inlet Temperature

40 °C

NOTE:

1.

Boxed Processor thermal solutions for ATX assume the use of the thermally advantaged

chassis (refer to

Thermally Advantaged Chassis (TAC) Design Guide

for TAC thermal

and mechanical requirements). The TAC 2.0 Design Guide defines a new processor

cooling solution inlet temperature target of 40 °C. The existing TAC 1.1 chassis can be

compatible with TAC 2.0 guidelines.

2.4.2

Improving Chassis Thermal Performance

The heat generated by components within the chassis must be removed to provide an

adequate operating environment for both the processor and other system

components. Moving air through the chassis brings in air from the external ambient

environment and transports the heat generated by the processor and other system

components out of the system. The number, size and relative position of fans and

vents determine the chassis thermal performance, and the resulting ambient

temperature around the processor. The size and type (passive or active) of the

thermal solution and the amount of system airflow can be traded off against each

other to meet specific system design constraints. Additional constraints are board

layout, spacing, component placement, acoustic requirements, and structural

considerations that limit the thermal solution size. For more information, refer to the

Performance ATX Desktop System Thermal Design Suggestions

or

Performance

microATX Desktop System Thermal Design Suggestions

or

Balanced Technology

Extended (BTX) System Design Guide

documents available on the

http://www.formfactors.org/

web site.

Section	Page
1 Introduction	9
1.1 Document Goals and Scope	9
1.1.1 Importance of Thermal Management	9
1.1.2 Document Goals	9
1.1.3 Document Scope	10
1.2 References	11
1.3 Definition of Terms	11
2 Processor Thermal/Mechanical Information	13
2.1 Mechanical Requirements	13
2.1.1 Processor Package	13
2.1.2 Heatsink Attach	15
2.1.2.1 General Guidelines	15
2.1.2.2 Heatsink Clip Load Requirement	15
2.1.2.3 Additional Guidelines	16
2.2 Thermal Requirements	16
2.2.1 Processor Case Temperature	16
2.2.2 Thermal Profile	17
2.2.3 Thermal Solution Design Requirements	17
2.2.4 TCONTROL	18
2.3 Heatsink Design Considerations	19
2.3.1 Heatsink Size	20
2.3.2 Heatsink Mass	20
2.3.3 Package IHS Flatness	21
2.3.4 Thermal Interface Material	21
2.4 System Thermal Solution Considerations	22
2.4.1 Chassis Thermal Design Capabilities	22
2.4.2 Improving Chassis Thermal Performance	22
2.4.3 Summary	23
2.5 System Integration Considerations	23
3 Thermal Metrology	25
3.1 Characterizing Cooling Performance Requirements	25
3.1.1 Example	26
3.2 Processor Thermal Solution Performance Assessment	27
3.3 Local Ambient Temperature Measurement Guidelines	27
3.4 Processor Case Temperature Measurement Guidelines	30
4 Thermal Management Logic and Thermal Monitor Feature	31
4.1 Processor Power Dissipation	31
4.2 Thermal Monitor Implementation	31
4.2.1 PROCHOT# Signal	32
4.2.2 Thermal Control Circuit	32
4.2.2.1 Thermal Monitor	32
4.2.3 Thermal Monitor 2	33
4.2.4 Operation and Configuration	34
4.2.5 On-Demand Mode	35
4.2.6 System Considerations	35
4.2.7 Operating System and Application Software Considerations	36
4.2.8 THERMTRIP# Signal	36
4.2.9 Cooling System Failure Warning	36
4.2.10 Digital Thermal Sensor	37
4.2.11 Platform Environmental Control Interface (PECI)	38
5 Balanced Technology Extended (BTX) Thermal/Mechanical Design Information	39
5.1 Overview of the BTX Reference Design	39
5.1.1 Target Heatsink Performance	39
5.1.2 Acoustics	40
5.1.3 Effective Fan Curve	41
5.1.4 Voltage Regulator Thermal Management	42
5.1.5 Altitude	43
5.1.6 Reference Heatsink Thermal Validation	43
5.2 Environmental Reliability Testing	43
5.2.1 Structural Reliability Testing	43
5.2.1.1 Random Vibration Test Procedure	43
5.2.1.2 Shock Test Procedure	44
5.2.2 Power Cycling	45
5.2.3 Recommended BIOS/CPU/Memory Test Procedures	46
5.3 Material and Recycling Requirements	46
5.4 Safety Requirements	47
5.5 Geometric Envelope for Intel® Reference BTX Thermal Module Assembly	47
5.6 Preload and TMA Stiffness	48
5.6.1 Structural Design Strategy	48
5.6.2 TMA Preload verse Stiffness	48
6 ATX Thermal/Mechanical Design Information	51
6.1 ATX Reference Design Requirements	51
6.2 Validation Results for Reference Design	53
6.2.1 Heatsink Performance	53
6.2.2 Acoustics	54
6.2.3 Altitude	54
6.2.4 Heatsink Thermal Validation	55
6.3 Environmental Reliability Testing	55
6.3.1 Structural Reliability Testing	55
6.3.1.1 Random Vibration Test Procedure	55
6.3.1.2 Shock Test Procedure	56
6.3.2 Power Cycling	57
6.3.3 Recommended BIOS/CPU/Memory Test Procedures	58
6.4 Material and Recycling Requirements	58
6.5 Safety Requirements	59
6.6 Geometric Envelope for Intel® Reference ATX Thermal Mechanical Design	59
6.7 Reference Attach Mechanism	60
6.7.1 Structural Design Strategy	60
6.7.2 Mechanical Interface to the Reference Attach Mechanism	61
7 Intel® Quiet System Technology (Intel® QST)	63
7.1 Intel® QST Algorithm	63
7.1.1 Output Weighting Matrix	64
7.1.2 Proportional-Integral-Derivative (PID)	64
7.2 Board and System Implementation of Intel® QST	66
7.3 Intel® QST Configuration and Tuning	68

Intel E6700 Mechanical Design Guidelines - Page 22

System Thermal Solution Considerations - core duo

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