Intel E6700 Mechanical Design Guidelines - Page 45
Power Cycling - cpu z
UPC - 735858184618
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Balanced Technology Extended (BTX) Thermal/Mechanical Design Information 5.2.1.2.1 Recommended Test Sequence Each test sequence should start with components (that is, motherboard, heatsink assembly, and so forth) that have never been previously submitted to any reliability testing. The test sequence should always start with a visual inspection after assembly, and BIOS/CPU/Memory test (refer to Section 6.3.3). Prior to the mechanical shock & vibration test, the units under test should be preconditioned for 72 hours at 45º C. The purpose is to account for load relaxation during burn-in stage. The stress test should be followed by a visual inspection and then BIOS/CPU/Memory test. 5.2.1.2.2 Post-Test Pass Criteria The post-test pass criteria are: 1. No significant physical damage to the heatsink attach mechanism (including such items as clip and motherboard fasteners). 2. Heatsink must remain attached to the motherboard. 3. Heatsink remains seated and its bottom remains mated flatly against IHS surface. No visible gap between the heatsink base and processor IHS. No visible tilt of the heatsink with respect to its attach mechanism. 4. No signs of physical damage on motherboard surface due to impact of heatsink or heatsink attach mechanism. 5. No visible physical damage to the processor package. 6. Successful BIOS/Processor/memory test of post-test samples. 7. Thermal compliance testing to demonstrate that the case temperature specification can be met. 5.2.2 Power Cycling Thermal performance degradation due to TIM degradation is evaluated using power cycling testing. The test is defined by 7500 cycles for the case temperature from room temperature (~23º C) to the maximum case temperature defined by the thermal profile at TDP. A Thermal Test Vehicle is used for this test. Thermal and Mechanical Design Guidelines 45