Intel E6700 Mechanical Design Guidelines - Page 6

Intel E6700 - Core 2 Duo Dual-Core Processor Manual

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Figures Figure 2-1. Package IHS Load Areas 13 Figure 2-2. Processor Case Temperature Measurement Location 17 Figure 2-3. Example Thermal Profile 18 Figure 3-1. Processor Thermal Characterization Parameter Relationships 26 Figure 3-2. Locations for Measuring Local Ambient Temperature, Active ATX Heatsink29 Figure 3-3. Locations for Measuring Local Ambient Temperature, Passive Heatsink ... 29 Figure 4-1. Thermal Monitor Control 33 Figure 4-2. Thermal Monitor 2 Frequency and Voltage Ordering 34 Figure 4-3. TCONTROL for Digital Thermal Sensor 37 Figure 5-1. Effective TMA Fan Curves with Reference Extrusion 42 Figure 5-2. Random Vibration PSD 44 Figure 5-3. Shock Acceleration Curve 44 Figure 5-4. Intel® Type II TMA 65W Reference Design 47 Figure 5-5. Upward Board Deflection During Shock 48 Figure 5-6. Minimum Required Processor Preload to Thermal Module Assembly Stiffness ...49 Figure 5-7. Thermal Module Attach Pointes and Duct-to-SRM Interface Features.......50 Figure 6-1. E18764-001 Reference Design - Exploded View 52 Figure 6-2. Bottom View of Copper Core Applied by TC-1996 Grease 52 Figure 6-3. Random Vibration PSD 56 Figure 6-4. Shock Acceleration Curve 56 Figure 6-5. Upward Board Deflection during Shock 60 Figure 6-6. Reference Clip/Heatsink Assembly 61 Figure 6-7. Critical Parameters for Interfacing to Reference Clip 62 Figure 6-8. Critical Core Dimension 62 Figure 7-1. Intel® QST Overview 64 Figure 7-2. PID Controller Fundamentals 65 Figure 7-3. Intel® QST Platform Requirements 66 Figure 7-4. Example Acoustic Fan Speed Control Implementation 67 Figure 7-5. Digital Thermal Sensor and Thermistor 68 Figure 7-6. Board Deflection Definition 71 Figure 7-7. Example-Defining Heatsink Preload Meeting Board Deflection Limit ....... 73 Figure 7-8. Load Cell Installation in Machined Heatsink Base Pocket - Bottom View ..76 Figure 7-9. Load Cell Installation in Machined Heatsink Base Pocket - Side View ......77 Figure 7-10. Preload Test Configuration 77 Figure 7-11. Omega Thermocouple 84 Figure 7-12. 775-LAND LGA Package Reference Groove Drawing at 6 o'clock Exit .....86 Figure 7-13. 775-LAND LGA Package Reference Groove Drawing at 3 o'clock Exit (Old Drawing 87 Figure 7-14. IHS Groove at 6 o'clock Exit on the 775-LAND LGA Package 88 Figure 7-15. IHS Groove at 6 o'clock Exit Orientation Relative to the LGA775 Socket 88 Figure 7-16. Inspection of Insulation on Thermocouple 89 Figure 7-17. Bending the Tip of the Thermocouple 90 Figure 7-18. Securing Thermocouple Wires with Kapton* Tape Prior to Attach..........90 Figure 7-19. Thermocouple Bead Placement 91 Figure 7-20. Position Bead on the Groove Step 92 Figure 7-21. Detailed Thermocouple Bead Placement 92 Figure 7-22. Third Tape Installation 93 Figure 7-23. Measuring Resistance between Thermocouple and IHS 93 Figure 7-24. Applying Flux to the Thermocouple Bead 94 Figure 7-25. Cutting Solder 94 Figure 7-26. Positioning Solder on IHS 95 6 Thermal and Mechanical Design Guidelines

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6
Thermal and Mechanical Design Guidelines
Figures
Figure 2-1. Package IHS Load Areas
...................................................................
13
Figure 2-2. Processor Case Temperature Measurement Location
.............................
17
Figure 2-3. Example Thermal Profile
....................................................................
18
Figure 3-1. Processor Thermal Characterization Parameter Relationships
.................
26
Figure 3-2. Locations for Measuring Local Ambient Temperature, Active ATX Heatsink29
Figure 3-3. Locations for Measuring Local Ambient Temperature, Passive Heatsink ... 29
Figure 4-1. Thermal Monitor Control
....................................................................
33
Figure 4-2. Thermal Monitor 2 Frequency and Voltage Ordering
..............................
34
Figure 4-3. T
CONTROL
for Digital Thermal Sensor
.....................................................
37
Figure 5-1. Effective TMA Fan Curves with Reference Extrusion
..............................
42
Figure 5-2. Random Vibration PSD
......................................................................
44
Figure 5-3. Shock Acceleration Curve
..................................................................
44
Figure 5-4. Intel
®
Type II TMA 65W Reference Design
...........................................
47
Figure 5-5. Upward Board Deflection During Shock
...............................................
48
Figure 5-6. Minimum Required Processor Preload to Thermal Module Assembly
Stiffness
....................................................................................................
49
Figure 5-7. Thermal Module Attach Pointes and Duct-to-SRM Interface Features
.......
50
Figure 6-1. E18764-001 Reference Design – Exploded View
...................................
52
Figure 6-2. Bottom View of Copper Core Applied by TC-1996 Grease
.......................
52
Figure 6-3. Random Vibration PSD
......................................................................
56
Figure 6-4. Shock Acceleration Curve
..................................................................
56
Figure 6-5. Upward Board Deflection during Shock
................................................
60
Figure 6-6. Reference Clip/Heatsink Assembly
......................................................
61
Figure 6-7. Critical Parameters for Interfacing to Reference Clip
.............................
62
Figure 6-8. Critical Core Dimension
.....................................................................
62
Figure 7-1. Intel
®
QST Overview
........................................................................
64
Figure 7-2. PID Controller Fundamentals
.............................................................
65
Figure 7-3. Intel
®
QST Platform Requirements
.....................................................
66
Figure 7-4. Example Acoustic Fan Speed Control Implementation
...........................
67
Figure 7-5. Digital Thermal Sensor and Thermistor
...............................................
68
Figure 7-6. Board Deflection Definition
................................................................
71
Figure 7-7. Example—Defining Heatsink Preload Meeting Board Deflection Limit
.......
73
Figure 7-8. Load Cell Installation in Machined Heatsink Base Pocket – Bottom View .. 76
Figure 7-9. Load Cell Installation in Machined Heatsink Base Pocket – Side View
......
77
Figure 7-10. Preload Test Configuration
...............................................................
77
Figure 7-11. Omega Thermocouple
.....................................................................
84
Figure 7-12. 775-LAND LGA Package Reference Groove Drawing at 6 o’clock Exit
.....
86
Figure 7-13. 775-LAND LGA Package Reference Groove Drawing at 3 o’clock Exit (Old
Drawing)
...................................................................................................
87
Figure 7-14. IHS Groove at 6 o’clock Exit on the 775-LAND LGA Package
................
88
Figure 7-15. IHS Groove at 6 o’clock Exit Orientation Relative to the LGA775 Socket 88
Figure 7-16. Inspection of Insulation on Thermocouple
..........................................
89
Figure 7-17. Bending the Tip of the Thermocouple
................................................
90
Figure 7-18. Securing Thermocouple Wires with Kapton* Tape Prior to Attach
..........
90
Figure 7-19. Thermocouple Bead Placement
.........................................................
91
Figure 7-20. Position Bead on the Groove Step
.....................................................
92
Figure 7-21. Detailed Thermocouple Bead Placement
............................................
92
Figure 7-22. Third Tape Installation
....................................................................
93
Figure 7-23. Measuring Resistance between Thermocouple and IHS
........................
93
Figure 7-24. Applying Flux to the Thermocouple Bead
...........................................
94
Figure 7-25. Cutting Solder
................................................................................
94
Figure 7-26. Positioning Solder on IHS
................................................................
95