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Intel E6700 Mechanical Design Guidelines - Page 8

Revision History - core 2 duo

UPC - 735858184618

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Revision History Revision Number 001 002 003 004 005 006 007 008 009 010 011 012 013 014 015 016 017 Description Revision • Initial release. • Added Intel® Core™2 Duo processor E8300 and E7200 • Added Intel® Core™2 Duo processor E8600 and E7300 • Added Intel® Pentium dual-core processor E5200 • Added Intel® Core™2 Duo processor E7400 • Added Intel® Pentium dual-core processor E5300 • Added Intel® Pentium dual-core processor E5400 • Added Intel® Core™2 Duo processor E7500 • Added Intel® Pentium dual-core processor E6300 • Added Intel® Core™2 Duo processor E7600 • Added Intel® Pentium dual-core processor E6500 • Intel® Celeron® processor E3x00 series • Added Intel® Pentium dual-core processor E6600 • Intel® Celeron® processor E3400 • Added Intel® Pentium dual-core processor E5500 • Added Intel® Pentium dual-core processor E6700 • Added Intel® Pentium dual-core processor E5700 • Added Intel® Pentium dual-core processor E6800 • Added Intel® Celeron® processor E3500 • Changed the processor numbering from Intel Celeron processor E3x00 series to Intel Celeron processor E3000 series. • Added Intel® Pentium dual-core processor E5800 January 2008 April 2008 August 2008 August 2008 October 2008 December 2008 January 2009 May 2009 June 2009 August 2009 August 2009 January 2010 April 2010 June 2010 August 2010 August 2010 November 2010 § 8 Thermal and Mechanical Design Guidelines

Section	Page
1 Introduction	9
1.1 Document Goals and Scope	9
1.1.1 Importance of Thermal Management	9
1.1.2 Document Goals	9
1.1.3 Document Scope	10
1.2 References	11
1.3 Definition of Terms	11
2 Processor Thermal/Mechanical Information	13
2.1 Mechanical Requirements	13
2.1.1 Processor Package	13
2.1.2 Heatsink Attach	15
2.1.2.1 General Guidelines	15
2.1.2.2 Heatsink Clip Load Requirement	15
2.1.2.3 Additional Guidelines	16
2.2 Thermal Requirements	16
2.2.1 Processor Case Temperature	16
2.2.2 Thermal Profile	17
2.2.3 Thermal Solution Design Requirements	17
2.2.4 TCONTROL	18
2.3 Heatsink Design Considerations	19
2.3.1 Heatsink Size	20
2.3.2 Heatsink Mass	20
2.3.3 Package IHS Flatness	21
2.3.4 Thermal Interface Material	21
2.4 System Thermal Solution Considerations	22
2.4.1 Chassis Thermal Design Capabilities	22
2.4.2 Improving Chassis Thermal Performance	22
2.4.3 Summary	23
2.5 System Integration Considerations	23
3 Thermal Metrology	25
3.1 Characterizing Cooling Performance Requirements	25
3.1.1 Example	26
3.2 Processor Thermal Solution Performance Assessment	27
3.3 Local Ambient Temperature Measurement Guidelines	27
3.4 Processor Case Temperature Measurement Guidelines	30
4 Thermal Management Logic and Thermal Monitor Feature	31
4.1 Processor Power Dissipation	31
4.2 Thermal Monitor Implementation	31
4.2.1 PROCHOT# Signal	32
4.2.2 Thermal Control Circuit	32
4.2.2.1 Thermal Monitor	32
4.2.3 Thermal Monitor 2	33
4.2.4 Operation and Configuration	34
4.2.5 On-Demand Mode	35
4.2.6 System Considerations	35
4.2.7 Operating System and Application Software Considerations	36
4.2.8 THERMTRIP# Signal	36
4.2.9 Cooling System Failure Warning	36
4.2.10 Digital Thermal Sensor	37
4.2.11 Platform Environmental Control Interface (PECI)	38
5 Balanced Technology Extended (BTX) Thermal/Mechanical Design Information	39
5.1 Overview of the BTX Reference Design	39
5.1.1 Target Heatsink Performance	39
5.1.2 Acoustics	40
5.1.3 Effective Fan Curve	41
5.1.4 Voltage Regulator Thermal Management	42
5.1.5 Altitude	43
5.1.6 Reference Heatsink Thermal Validation	43
5.2 Environmental Reliability Testing	43
5.2.1 Structural Reliability Testing	43
5.2.1.1 Random Vibration Test Procedure	43
5.2.1.2 Shock Test Procedure	44
5.2.2 Power Cycling	45
5.2.3 Recommended BIOS/CPU/Memory Test Procedures	46
5.3 Material and Recycling Requirements	46
5.4 Safety Requirements	47
5.5 Geometric Envelope for Intel® Reference BTX Thermal Module Assembly	47
5.6 Preload and TMA Stiffness	48
5.6.1 Structural Design Strategy	48
5.6.2 TMA Preload verse Stiffness	48
6 ATX Thermal/Mechanical Design Information	51
6.1 ATX Reference Design Requirements	51
6.2 Validation Results for Reference Design	53
6.2.1 Heatsink Performance	53
6.2.2 Acoustics	54
6.2.3 Altitude	54
6.2.4 Heatsink Thermal Validation	55
6.3 Environmental Reliability Testing	55
6.3.1 Structural Reliability Testing	55
6.3.1.1 Random Vibration Test Procedure	55
6.3.1.2 Shock Test Procedure	56
6.3.2 Power Cycling	57
6.3.3 Recommended BIOS/CPU/Memory Test Procedures	58
6.4 Material and Recycling Requirements	58
6.5 Safety Requirements	59
6.6 Geometric Envelope for Intel® Reference ATX Thermal Mechanical Design	59
6.7 Reference Attach Mechanism	60
6.7.1 Structural Design Strategy	60
6.7.2 Mechanical Interface to the Reference Attach Mechanism	61
7 Intel® Quiet System Technology (Intel® QST)	63
7.1 Intel® QST Algorithm	63
7.1.1 Output Weighting Matrix	64
7.1.2 Proportional-Integral-Derivative (PID)	64
7.2 Board and System Implementation of Intel® QST	66
7.3 Intel® QST Configuration and Tuning	68

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Thermal and Mechanical Design Guidelines

Revision History

Revision

Number

Description

Revision

001

•

Initial release.

January 2008

002

•

Added Intel

Core™2 Duo processor E8300 and E7200

April 2008

003

•

Added Intel

Core™2 Duo processor E8600 and E7300

August 2008

004

•

Added Intel

Pentium dual-core processor E5200

August 2008

005

•

Added Intel

Core™2 Duo processor E7400

October 2008

006

•

Added Intel

Pentium dual-core processor E5300

December 2008

007

•

Added Intel

Pentium dual-core processor E5400

•

Added Intel

Core™2 Duo processor E7500

January 2009

008

•

Added Intel

Pentium dual-core processor E6300

May 2009

009

•

Added Intel

Core™2 Duo processor E7600

June 2009

010

•

Added Intel

Pentium dual-core processor E6500

August 2009

011

•

Intel

Celeron

processor E3x00 series

August 2009

012

•

Added Intel

Pentium dual-core processor E6600

•

Intel

Celeron

processor E3400

January 2010

013

•

Added Intel

Pentium dual-core processor E5500

April 2010

014

•

Added Intel

Pentium dual-core processor E6700

June 2010

015

•

Added Intel

Pentium dual-core processor E5700

August 2010

016

•

Added Intel

Pentium dual-core processor E6800

•

Added Intel

Celeron

processor E3500

•

Changed the processor numbering from Intel Celeron processor E3x00

series to Intel Celeron processor E3000 series.

August 2010

017

•

Added Intel

Pentium dual-core processor E5800

November 2010