Intel E6700 Mechanical Design Guidelines - Page 71
A.3.2, Board Deflection Limits
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LGA775 Socket Heatsink Loading Figure 7-6. Board Deflection Definition d1 d'1 d2 d'2 A.3.2 Board Deflection Limits Deflection limits for the ATX/µATX form factor are: d_BOL - d_ref≥ 0.09 mm and d_EOL - d_ref ≥ 0.15 mm And d'_BOL - d'_ref≥ 0.09 mm and d_EOL' - d_ref' ≥ 0.15 mm NOTES: 1. The heatsink preload must remain within the static load limits defined in the processor datasheet at all times. 2. Board deflection should not exceed motherboard manufacturer specifications. Thermal and Mechanical Design Guidelines 71
LGA775 Socket Heatsink Loading
Thermal and Mechanical Design Guidelines
71
Figure 7-6. Board Deflection Definition
d1
d2
d’1
d’2
A.3.2
Board Deflection Limits
Deflection limits for the ATX/μATX form factor are:
d_BOL – d_ref
≥ 0.09 mm
and d_EOL – d_ref
≥ 0.15 mm
And
d’_BOL – d’_ref
≥ 0.09 mm
and d_EOL’ – d_ref’
≥ 0.15 mm
NOTES:
1.
The heatsink preload must remain within the static load limits defined in the processor
datasheet at all times.
2.
Board deflection should not exceed motherboard manufacturer specifications.