Intel E6700 Mechanical Design Guidelines - Page 16

Processor Thermal/Mechanical Information

16

Thermal and Mechanical Design Guidelines

2.1.2.3

Additional Guidelines

In addition to the general guidelines given above, the heatsink attach mechanism for

the processor should be designed to the following guidelines:

•

Holds the heatsink in place under mechanical shock and vibration events and

applies force to the heatsink base to maintain desired pressure on the thermal

interface material. Note that the load applied by the heatsink attach mechanism

must comply with the package specifications described in the processor datasheet.

One of the key design parameters is the height of the top surface of the processor

IHS above the motherboard. The IHS height from the top of board is expected to

vary from 7.517 mm to 8.167 mm. This data is provided for information only, and

should be derived from:



The height of the socket seating plane above the motherboard after reflow, given

in the LGA775 Socket Mechanical Design Guide with its tolerances.



The height of the package, from the package seating plane to the top of the IHS,

and accounting for its nominal variation and tolerances that are given in the

corresponding processor datasheet.

•

Engages easily, and if possible, without the use of special tools

. In general, the

heatsink is assumed to be installed after the motherboard has been installed into

the chassis.

•

Minimizes contact with the motherboard surface during installation

and actuation

to avoid scratching the motherboard.

2.2

Thermal Requirements

Refer to the datasheet

for the processor thermal specifications. The majority of

processor power is dissipated through the IHS. There are no additional components

(such as BSRAMs) that generate heat on this package. The amount of power that can

be dissipated as heat through the processor package substrate and into the socket is

usually minimal.

The thermal limits for the processor are the Thermal Profile and T

CONTROL

. The Thermal

Profile defines the maximum case temperature as a function of power being

dissipated. T

CONTROL

is a specification used in conjunction with the temperature

reported by the digital thermal sensor and a fan speed control method. Designing to

these specifications allows optimization of thermal designs for processor performance

and acoustic noise reduction.

2.2.1

Processor Case Temperature

For the processor, the case temperature is defined as the temperature measured at

the geometric center of the package on the surface of the IHS. For illustration,

Figure 2-2 shows the measurement location for a 37.5 mm x 37.5 mm [1.474 in x

1.474 in] 775-Land LGA processor package with a 28.7 mm x 28.7 mm [1.13 in x

1.13 in] IHS top surface. Techniques for measuring the case temperature are detailed

in Section 3.4.

Section	Page
1 Introduction	9
1.1 Document Goals and Scope	9
1.1.1 Importance of Thermal Management	9
1.1.2 Document Goals	9
1.1.3 Document Scope	10
1.2 References	11
1.3 Definition of Terms	11
2 Processor Thermal/Mechanical Information	13
2.1 Mechanical Requirements	13
2.1.1 Processor Package	13
2.1.2 Heatsink Attach	15
2.1.2.1 General Guidelines	15
2.1.2.2 Heatsink Clip Load Requirement	15
2.1.2.3 Additional Guidelines	16
2.2 Thermal Requirements	16
2.2.1 Processor Case Temperature	16
2.2.2 Thermal Profile	17
2.2.3 Thermal Solution Design Requirements	17
2.2.4 TCONTROL	18
2.3 Heatsink Design Considerations	19
2.3.1 Heatsink Size	20
2.3.2 Heatsink Mass	20
2.3.3 Package IHS Flatness	21
2.3.4 Thermal Interface Material	21
2.4 System Thermal Solution Considerations	22
2.4.1 Chassis Thermal Design Capabilities	22
2.4.2 Improving Chassis Thermal Performance	22
2.4.3 Summary	23
2.5 System Integration Considerations	23
3 Thermal Metrology	25
3.1 Characterizing Cooling Performance Requirements	25
3.1.1 Example	26
3.2 Processor Thermal Solution Performance Assessment	27
3.3 Local Ambient Temperature Measurement Guidelines	27
3.4 Processor Case Temperature Measurement Guidelines	30
4 Thermal Management Logic and Thermal Monitor Feature	31
4.1 Processor Power Dissipation	31
4.2 Thermal Monitor Implementation	31
4.2.1 PROCHOT# Signal	32
4.2.2 Thermal Control Circuit	32
4.2.2.1 Thermal Monitor	32
4.2.3 Thermal Monitor 2	33
4.2.4 Operation and Configuration	34
4.2.5 On-Demand Mode	35
4.2.6 System Considerations	35
4.2.7 Operating System and Application Software Considerations	36
4.2.8 THERMTRIP# Signal	36
4.2.9 Cooling System Failure Warning	36
4.2.10 Digital Thermal Sensor	37
4.2.11 Platform Environmental Control Interface (PECI)	38
5 Balanced Technology Extended (BTX) Thermal/Mechanical Design Information	39
5.1 Overview of the BTX Reference Design	39
5.1.1 Target Heatsink Performance	39
5.1.2 Acoustics	40
5.1.3 Effective Fan Curve	41
5.1.4 Voltage Regulator Thermal Management	42
5.1.5 Altitude	43
5.1.6 Reference Heatsink Thermal Validation	43
5.2 Environmental Reliability Testing	43
5.2.1 Structural Reliability Testing	43
5.2.1.1 Random Vibration Test Procedure	43
5.2.1.2 Shock Test Procedure	44
5.2.2 Power Cycling	45
5.2.3 Recommended BIOS/CPU/Memory Test Procedures	46
5.3 Material and Recycling Requirements	46
5.4 Safety Requirements	47
5.5 Geometric Envelope for Intel® Reference BTX Thermal Module Assembly	47
5.6 Preload and TMA Stiffness	48
5.6.1 Structural Design Strategy	48
5.6.2 TMA Preload verse Stiffness	48
6 ATX Thermal/Mechanical Design Information	51
6.1 ATX Reference Design Requirements	51
6.2 Validation Results for Reference Design	53
6.2.1 Heatsink Performance	53
6.2.2 Acoustics	54
6.2.3 Altitude	54
6.2.4 Heatsink Thermal Validation	55
6.3 Environmental Reliability Testing	55
6.3.1 Structural Reliability Testing	55
6.3.1.1 Random Vibration Test Procedure	55
6.3.1.2 Shock Test Procedure	56
6.3.2 Power Cycling	57
6.3.3 Recommended BIOS/CPU/Memory Test Procedures	58
6.4 Material and Recycling Requirements	58
6.5 Safety Requirements	59
6.6 Geometric Envelope for Intel® Reference ATX Thermal Mechanical Design	59
6.7 Reference Attach Mechanism	60
6.7.1 Structural Design Strategy	60
6.7.2 Mechanical Interface to the Reference Attach Mechanism	61
7 Intel® Quiet System Technology (Intel® QST)	63
7.1 Intel® QST Algorithm	63
7.1.1 Output Weighting Matrix	64
7.1.2 Proportional-Integral-Derivative (PID)	64
7.2 Board and System Implementation of Intel® QST	66
7.3 Intel® QST Configuration and Tuning	68

Intel E6700 Mechanical Design Guidelines - Page 16

Thermal Requirements

Page 16 highlights