Intel E6700 Mechanical Design Guidelines - Page 12

Introduction

12

Thermal and Mechanical Design Guidelines

Term

Description

Ψ

CS

Case-to-sink thermal characterization parameter. A measure of thermal

interface material performance using total package power. This is defined as:

(T

C

– T

S

) / Total Package Power.

Note:

Heat source must be specified for

Ψ

measurements.

Ψ

Sa

Sink-to-ambient thermal characterization parameter. A measure of heatsink

thermal performance using total package power. This is defined as: (T

S

– T

A

) /

Total Package Power.

Note:

Heat source must be specified for

Ψ

measurements.

TIM

Thermal Interface Material: The thermally conductive compound between the

heatsink and the processor case. This material fills the air gaps and voids, and

enhances the transfer of the heat from the processor case to the heatsink.

P

MAX

The maximum power dissipated by a semiconductor component.

TDP

Thermal Design Power: a power dissipation target based on worst-case

applications. Thermal solutions should be designed to dissipate the thermal

design power.

IHS

Integrated Heat Spreader: a thermally conductive lid integrated into a

processor package to improve heat transfer to a thermal solution through

heat spreading.

LGA775

Socket

The surface mount socket designed to accept the processors in the 775–Land

LGA package.

ACPI

Advanced Configuration and Power Interface.

Bypass

Bypass is the area between a passive heatsink and any object that can act to

form a duct. For this example, it can be expressed as a dimension away from

the outside dimension of the fins to the nearest surface.

Thermal

Monitor

A feature on the processor that attempts to keep the processor die

temperature within factory specifications.

TCC

Thermal Control Circuit: Thermal Monitor uses the TCC to reduce die

temperature by lowering the effective processor frequency when the die

temperature has exceeded its operating limits.

DTS

Digital Thermal Sensor: Processor die sensor temperature defined as an offset

from the onset of PROCHOT#.

FSC

Fan Speed Control: Thermal solution that includes a variable fan speed which

is driven by a PWM signal and uses the on-die thermal diode as a reference to

change the duty cycle of the PWM signal.

T

CONTROL

T

CONTROL

is the specification limit for use with the on-die thermal diode.

PWM

Pulse width modulation is a method of controlling a variable speed fan. The

enabled 4-wire fans use the PWM duty cycle % from the fan speed controller

to modulate the fan speed.

Health

Monitor

Component

Any standalone or integrated component that is capable of reading the

processor temperature and providing the PWM signal to the 4-pin fan header.

BTX

Balanced Technology Extended.

TMA

Thermal Module Assembly. The heatsink, fan and duct assembly for the BTX

thermal solution

Section	Page
1 Introduction	9
1.1 Document Goals and Scope	9
1.1.1 Importance of Thermal Management	9
1.1.2 Document Goals	9
1.1.3 Document Scope	10
1.2 References	11
1.3 Definition of Terms	11
2 Processor Thermal/Mechanical Information	13
2.1 Mechanical Requirements	13
2.1.1 Processor Package	13
2.1.2 Heatsink Attach	15
2.1.2.1 General Guidelines	15
2.1.2.2 Heatsink Clip Load Requirement	15
2.1.2.3 Additional Guidelines	16
2.2 Thermal Requirements	16
2.2.1 Processor Case Temperature	16
2.2.2 Thermal Profile	17
2.2.3 Thermal Solution Design Requirements	17
2.2.4 TCONTROL	18
2.3 Heatsink Design Considerations	19
2.3.1 Heatsink Size	20
2.3.2 Heatsink Mass	20
2.3.3 Package IHS Flatness	21
2.3.4 Thermal Interface Material	21
2.4 System Thermal Solution Considerations	22
2.4.1 Chassis Thermal Design Capabilities	22
2.4.2 Improving Chassis Thermal Performance	22
2.4.3 Summary	23
2.5 System Integration Considerations	23
3 Thermal Metrology	25
3.1 Characterizing Cooling Performance Requirements	25
3.1.1 Example	26
3.2 Processor Thermal Solution Performance Assessment	27
3.3 Local Ambient Temperature Measurement Guidelines	27
3.4 Processor Case Temperature Measurement Guidelines	30
4 Thermal Management Logic and Thermal Monitor Feature	31
4.1 Processor Power Dissipation	31
4.2 Thermal Monitor Implementation	31
4.2.1 PROCHOT# Signal	32
4.2.2 Thermal Control Circuit	32
4.2.2.1 Thermal Monitor	32
4.2.3 Thermal Monitor 2	33
4.2.4 Operation and Configuration	34
4.2.5 On-Demand Mode	35
4.2.6 System Considerations	35
4.2.7 Operating System and Application Software Considerations	36
4.2.8 THERMTRIP# Signal	36
4.2.9 Cooling System Failure Warning	36
4.2.10 Digital Thermal Sensor	37
4.2.11 Platform Environmental Control Interface (PECI)	38
5 Balanced Technology Extended (BTX) Thermal/Mechanical Design Information	39
5.1 Overview of the BTX Reference Design	39
5.1.1 Target Heatsink Performance	39
5.1.2 Acoustics	40
5.1.3 Effective Fan Curve	41
5.1.4 Voltage Regulator Thermal Management	42
5.1.5 Altitude	43
5.1.6 Reference Heatsink Thermal Validation	43
5.2 Environmental Reliability Testing	43
5.2.1 Structural Reliability Testing	43
5.2.1.1 Random Vibration Test Procedure	43
5.2.1.2 Shock Test Procedure	44
5.2.2 Power Cycling	45
5.2.3 Recommended BIOS/CPU/Memory Test Procedures	46
5.3 Material and Recycling Requirements	46
5.4 Safety Requirements	47
5.5 Geometric Envelope for Intel® Reference BTX Thermal Module Assembly	47
5.6 Preload and TMA Stiffness	48
5.6.1 Structural Design Strategy	48
5.6.2 TMA Preload verse Stiffness	48
6 ATX Thermal/Mechanical Design Information	51
6.1 ATX Reference Design Requirements	51
6.2 Validation Results for Reference Design	53
6.2.1 Heatsink Performance	53
6.2.2 Acoustics	54
6.2.3 Altitude	54
6.2.4 Heatsink Thermal Validation	55
6.3 Environmental Reliability Testing	55
6.3.1 Structural Reliability Testing	55
6.3.1.1 Random Vibration Test Procedure	55
6.3.1.2 Shock Test Procedure	56
6.3.2 Power Cycling	57
6.3.3 Recommended BIOS/CPU/Memory Test Procedures	58
6.4 Material and Recycling Requirements	58
6.5 Safety Requirements	59
6.6 Geometric Envelope for Intel® Reference ATX Thermal Mechanical Design	59
6.7 Reference Attach Mechanism	60
6.7.1 Structural Design Strategy	60
6.7.2 Mechanical Interface to the Reference Attach Mechanism	61
7 Intel® Quiet System Technology (Intel® QST)	63
7.1 Intel® QST Algorithm	63
7.1.1 Output Weighting Matrix	64
7.1.2 Proportional-Integral-Derivative (PID)	64
7.2 Board and System Implementation of Intel® QST	66
7.3 Intel® QST Configuration and Tuning	68

Intel E6700 Mechanical Design Guidelines - Page 12

Description - socket

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