Intel BB5520UR Product Specification - Page 142

Design and Environmental Specifications Intel® Server Boards S5520HC, S5500HCV, and S5520HCT TPS 9. Design and Environmental Specifications 9.1 Intel® Server Boards S5520HC, S5500HCV, and S5520HCT Design Specifications Operation of the Intel® Server Boards S5520HC and/or S5500HCV at conditions beyond those shown in the following table may cause permanent damage to the system. Exposure to absolute maximum rating conditions for extended periods may affect system reliability. Table 71. Server Board Design Specifications Operating Temperature Non-Operating Temperature DC Voltage Shock (Unpackaged) Shock (Packaged) < 20 pounds 20 to < 40 pounds 40 to < 80 pounds 80 to < 100 pounds 100 to < 120 pounds 120 pounds Vibration (Unpackaged) 0º C to 55º C 1 (32º F to 131º F) -40º C to 70º C (-40º F to 158º F) ± 5% of all nominal voltages Trapezoidal, 50 G, 170 inches/sec 36 inches 30 inches 24 inches 18 inches 12 inches 9 inches 5 Hz to 500 Hz 3.13 g RMS random Note: 1 Chassis design must provide proper airflow to avoid exceeding the processor maximum case temperature. Disclaimer Note: Intel Corporation server boards contain a number of high-density VLSI and power delivery components that need adequate airflow to cool. Intel ensures through its own chassis development and testing that when Intel® server building blocks are used together, the fully integrated system will meet the intended thermal requirements of these components. It is the responsibility of the system integrator who chooses not to use Intel® developed server building blocks to consult vendor datasheets and operating parameters to determine the amount of airflow required for their specific application and environmental conditions. Intel Corporation cannot be held responsible, if components fail or the server board does not operate correctly when used outside any of its published operating or non-operating limits. 9.2 MTBF The following is the calculated Mean Time Between Failures (MTBF) 30° C (ambient air). These values are derived using a historical failure rate and multiplied by factors for application, electrical and/or thermal stress and for device maturity. You should view MTBF estimates as "reference numbers" only. • Calculation Model: Telcordia Issue 1, method I case 3 • Operating Temperature: Server in 30° C ambient air • Operating Environment: Ground Benign, Controlled 128 Revision 1.8 Intel order number E39529-013