Home » HP Manuals » Storage Devices » HP Surestore Disk Array FC60 » Manual Viewer

HP Surestore Disk Array FC60 HP SureStore E Disk Array FC60 - (English) Advanc - Page 176

Configuration Switches, Disk Enclosure (Tray) ID Switch

Get HP Surestore Disk Array FC60 PDF manuals and user guides

View all HP Surestore Disk Array FC60 manuals

Add to My Manuals
Save this manual to your list of manuals

Page 176 highlights

Configuration Switches This section describes the configuration switches on the controller enclosure and the disk enclosures. Configuration switch settings must be set to support the configuration (full-bus ore split-bus) being installed (as planned for from chapter 2, Topology and Array Planning). Controller enclosure and the disk enclosures configuration switches include: - Disk enclosure (Tray) ID switches - Disk enclosure DIP switches - Controller enclosure Fibre Channel host ID address switches Tips for Setting Configuration Switches • All switch settings should be the same on both BCC modules on the disk enclosures. • Disk enclosures must be power cycled before the new switch setting will take effect. • If a BCC is installed that has settings different than its peer, a buzzer will sound. The settings must be corrected to use the disk enclosure. Disk Enclosure (Tray) ID Switch The disk enclosure ID switch sets the Enclosure ID (or Tray ID). This value is used by FC60 diagnostic software and the controller to identify the disk enclosure for status monitoring operations. Each enclosure in the array must be set to a different Enclosure ID. To set the ID, set the rotary ID switches on the back of both BCC modules to the same number. See Figure 64. Typically, the disk enclosure closest to the controller enclosure is set to "0", the next one down to "1", and so on down the rack. See "Selecting Disks for a RAID 0/1 LUN" on page 243 for additional disk module addressing information.) Disk Enclosure DIP Switch A DIP switch located on the back of each BCC is used to set configuration options for BCC operation. See Figure 64. These DIP switches contain five switch segments. Switch segment 1 is used to select either split-bus or full-bus operation. See "Full-Bus/Split-Bus (Switch 1) Configuration" on page 178. The remaining four switch segments are not used for disk array operation and must always be set to "0." 176 Configuration Switches

Section	Page
1 Product Description	17
Product Description	18
Operating System Support	20
Management Tools	20
Features	20
High Availability	21
Scalable Storage Capacity	21
LED Status Monitoring	22
EMS Hardware Event Monitoring (HP-UX Only)	22
Disk Enclosure Components	23
Operation Features	25
Disk Enclosure SC10 Modules	27
Array Controller Enclosure Components	34
Front Cover	37
Controller Modules	38
Controller Fan Modules	40
Power Supply Modules	42
Power Supply Fan Module	43
Battery Backup Unit	45
Disk Array High Availability Features	47
RAID Technology	47
Disk Mirroring	47
Data Parity	48
Data Striping	49
RAID Levels	50
RAID Level Comparisons	57
Global Hot Spare Disks	61
Primary and Alternate I/O Paths	64
Capacity Management Features	65
LUNs	65
Disk Groups	65
Disk Array Caching	66
Dynamic Capacity Expansion	67
2 Topology and Array Planning	69
Overview	70
Array Design Considerations	71
Array Hardware Configuration	71
RAID, LUNs, and Global Hot Spares	72
High Availability	72
Performance	73
Storage Capacity	75
Expanding Storage Capacity	75
Recommended Disk Array Configurations	77
Configuration Considerations	77
One Disk Enclosure Configuration	78
Two Disk Enclosure Configurations	80
Three Disk Enclosure Configurations	84
Four Disk Enclosure Configurations	88
Five Disk Enclosure Configurations	92
Six Disk Enclosure Configurations	96
Total Disk Array Capacity	100
For high-availability, one disk per SCSI channel is used as a global hot spare.	101
Topologies for HP-UX	102
Basic Topology	103
Single-System Distance Topology	110
High Availability Topology	115
High Availability, Distance, and Capacity Topology	120
Campus Topology	125
Performance Topology with Switches	129
Topologies for Windows NT and Windows 2000	131
Non-High Availability Topologies	133
High Availability Topologies	137
3 Installation	143
Overview	144
Host System Requirements	145
HP-UX	145
Windows NT and Windows 2000	146
Site Requirements	147
Environmental Requirements	147
Electrical Requirements	147
Power Distribution Units (PDU/PDRU)	150
Installing PDUs	152
Recommended UPS Models	152
Installing the Disk Array FC60	155
Installing the Disk Enclosures	160
Step 1: Collect Required Tools	160
Step 2: Unpack the Product	160
Step 3: Install Mounting Rails	162
Step 4: Install the Disk Enclosure	162
Step 5: Install Disks and Fillers	166
Moving a Disk Enclosure from One Disk Array to Another	168
Installing the Controller	170
Step 1: Gather Required Tools	170
Step 2: Unpack the Product	170
Step 3: Install Mounting Rails	173
Step 4: Install the Controller Enclosure	173
Configuration Switches	176
Disk Enclosure (Tray) ID Switch	176
Disk Enclosure DIP Switch	176
Fibre Channel Host ID Address Setting	179
Attaching Power Cords	183
Attaching SCSI Cables and Configuring the Disk Enclosure Switches	187
Full-Bus Cabling and Switch Configuration	188
Split-Bus Switch and Cabling Configurations	191
Connecting the Fibre Channel Cables	196
Applying Power to the Disk Array	198
Verifying Disk Array Connection	206
On Windows NT and Windows 2000	206
On HP-UX	206
Interpreting Hardware Paths	208
Installing the Disk Array FC60 Software (HP-UX Only)	213
System Requirements	213
Verifying the Operating System	214
Installing the Disk Array FC60 Software	214
Downgrading the Disk Array Firmware for HP-UX 11.11 Hosts	215
Configuring the Disk Array	216
HP-UX	216
Windows NT and Windows 2000	220
Using the Disk Array FC60 as a Boot Device (HP-UX Only)	222
Solving Common Installation Problems	223
Adding Disk Enclosures to Increase Capacity	224
General Rules for Adding Disk Enclosures to the Disk Array	224
Step 1. Plan the Expanded Configuration	225
Step 2. Backup All Disk Array Data	226
Step 3. Prepare the Disk Array for Shut Down	226
Step 4. Add the New Disk Enclosures	227
Step 5. Completing the Expansion	230
Capacity Expansion Example	232
4 Managing the Disk Array on HP-UX	237
Tools for Managing the Disk Array FC60	238
System Administration Manager (SAM)	238
Array Manager 60	238
STM	238
Installing the Array Manager 60 Software	240
AM60Srvr Daemon	241
Running Array Manager 60	241
Managing Disk Array Capacity	242
Configuring LUNs	242
Selecting Disks for a LUN	243
Assigning LUN Ownership	247
Selecting a RAID Level	247
Global Hot Spares	248
Setting Stripe Segment Size	249
Evaluating Performance Impact	250
Adding Capacity to the Disk Array	254
Adding More Disk Modules	254
Adding Additional Disk Enclosures	256
Replacing Disk Modules with Higher Capacity Modules	256
Upgrading Controller Cache to 512 Mbytes	258
Managing the Disk Array Using SAM	260
Checking Disk Array Status	261
Assigning an Alias to the Disk Array	264
Locating Disk Modules	265
Binding a LUN	267
Unbinding a LUN	271
Replacing a LUN	271
Adding a Global Hot Spare	273
Removing a Global Hot Spare	275
Managing the Disk Array Using Array Manager 60	276
Command Syntax Conventions	279
Array Manager 60 man pages	279
Quick Help	279
Selecting a Disk Array and Its Components	280
Preparing to Manage the Disk Array	281
Checking Disk Array Status	282
Managing LUNs	289
Managing Global Hot Spares	295
Managing Disk Array Configuration	297
Managing the Universal Transport Mechanism (UTM)	298
Managing Cache Parameters	299
Performing Disk Array Maintenance	304
Managing Disk Array Logs	307
Upgrading Disk Firmware	313
Managing the Disk Array Using STM	314
Checking Disk Array Status Information	314
Binding a LUN	314
Unbinding a LUN	315
Adding a Global Hot Spare	315
Removing a Global Hot Spare	315
Locating Disk Modules	316
Status Conditions and Sense Code Information	317
LUN Status Conditions	317
Disk Status Conditions	319
Component Status Conditions	321
FRU Codes	322
SCSI Sense Codes	327
5 HP-UX Diagnostic Tools	345
Overview	346
Support Tools Manager	347
STM User Interfaces	347
STM Tools	351
Using the STM Information Tool	352
Interpreting the Information Tool Information Log	354
Interpreting the Information Tool Activity Log	354
Using the STM Expert Tool	355
6 Troubleshooting	359
Introduction	360
About Field Replaceable Units (FRUs)	361
HP-UX Troubleshooting Tools	362
Windows NT and Windows 2000 Troubleshooting Tools	362
EMS Hardware Event Monitoring (HP-UX Only)	362
Disk Array Installation/Troubleshooting Checklist	365
Power-Up Troubleshooting	366
Controller Enclosure Troubleshooting	367
Introduction	367
Controller Enclosure LEDs	368
Master Troubleshooting Table	370
SureStore E Disk System SC10 Troubleshooting	376
Disk Enclosure LEDs	376
Losing LUN 0	376
Interpreting Component Status Values (HP-UX Only)	379
Isolating Causes	380
7 Removal and Replacement	383
Overview	384
Disk Enclosure Modules	386
Disk Module or Filler Module	386
Disk Enclosure Fan Module	392
Disk Enclosure Power Supply Module	394
Controller Enclosure Modules	396
Front Cover Removal/Replacement	397
Controller Fan Module	398
Battery Backup Unit (BBU) Removal/Replacement	400
Power Supply Fan Module Removal/Replacement	403
Power Supply Module Removal/Replacement	405
SCSI Cables	407
8 Reference / Legal / Regulatory	409
System Requirements	410
Host Systems	410
Supported Operating Systems	410
Fibre Channel Host Adapters	411
Models and Options	412
A5277A/AZ Controller Enclosure Models and Options	412
A5294A/AZ Disk Enclosure SC10 Models and Options	414
Disk Array FC60 Upgrade and Add-On Products	416
PDU/PDRU Products	417
Replaceable Parts	418
A5277A/AZ Controller Enclosure Specifications	420
Dimensions:	420
Weight:	420
AC Power:	421
Heat Output:	421
Environmental Specifications	422
Acoustics	423
A5294A/AZ Disk Enclosure Specifications	424
Dimensions:	424
Weight:	424
AC Power:	425
DC Power Output:	425
Heat Output:	425
Environmental Specifications	426
Acoustics	427
Warranty and License Information	428
Hewlett-Packard Hardware Limited Warranty	428
Software Product Limited Warranty	429
Limitation of Warranty	429
Hewlett-Packard Software License Terms	431
Regulatory Compliance	434
Safety Certifications:	434
EMC Compliance	434
FCC Statements (USA Only)	435
IEC Statement (Worldwide)	435
CSA Statement (For Canada Only)	435
VCCI Statement (Japan)	436
Harmonics Conformance (Japan)	436
Class A Warning Statement (Taiwan)	436
Spécification ATI Classe A (France Seulement)	437
Product Noise Declaration (For Germany Only)	437
Geräuschemission (For Germany Only)	438

Match case Limit results 1 per page

176

Configuration Switches

This section describes the configuration switches on the controller enclosure and the disk

enclosures. Configuration switch settings must be set to support the configuration (full-bus

ore split-bus) being installed (as planned for from chapter 2, Topology and Array Planning).

Controller enclosure and the disk enclosures configuration switches include:

–

Disk enclosure (Tray) ID switches

–

Disk enclosure DIP switches

–

Controller enclosure Fibre Channel host ID address switches

Tips for Setting Configuration Switches

•

All switch settings should be the same on both BCC modules on the disk enclosures.

•

Disk enclosures must be power cycled before the new switch setting will take effect.

•

If a BCC is installed that has settings different than its peer, a buzzer will sound. The

settings must be corrected to use the disk enclosure.

Disk Enclosure (Tray) ID Switch

The disk enclosure ID switch sets the Enclosure ID (or Tray ID). This value is used by FC60

diagnostic software and the controller to identify the disk enclosure for status monitoring

operations. Each enclosure in the array must be set to a different Enclosure ID. To set the

ID, set the rotary ID switches on the back of both BCC modules to the same number. See

Figure 64

. Typically, the disk enclosure closest to the controller enclosure is set to “0”, the

next one down to “1”, and so on down the rack. See

"Selecting Disks for a RAID 0/1 LUN"

on page 243

for additional disk module addressing information.)

Disk Enclosure DIP Switch

A DIP switch located on the back of each BCC is used to set configuration options for BCC

operation. See

Figure 64

. These DIP switches contain five switch segments. Switch

segment 1 is used to select either split-bus or full-bus operation. See

"Full-Bus/Split-Bus

(Switch 1) Configuration" on page 178

. The remaining four switch segments are not used

for disk array operation and must always be set to “0.”