Intel BX80601920 Data Sheet - Page 10

1.1 10 Introduction The processor is a multi-core processor built on the 45 nm process technology, that uses up to 130 W thermal design power (TDP). The processor features an Intel QPI point-to-point link capable of up to 6.4 GT/s, 8 MB Level 3 cache, and an integrated memory controller. The processor supports all the existing Streaming SIMD Extensions 2 (SSE2), Streaming SIMD Extensions 3 (SSE3) and Streaming SIMD Extensions 4 (SSE4). The processor supports several Advanced Technologies: Intel® 64 Technology (Intel® 64), Enhanced Intel SpeedStep® Technology, Intel® Virtualization Technology (Intel® VT), Intel® Turbo Boost Technology, and Intel® Hyper-Threading Technology. Terminology A '#' symbol after a signal name refers to an active low signal, indicating a signal is in the active state when driven to a low level. For example, when RESET# is low, a reset has been requested. Conversely, when VTTPWRGOOD is high, the VTT power rail is stable. '_N' and '_P' after a signal name refers to a differential pair. Commonly used terms are explained here for clarification: • Intel® Core™ i7-900 Desktop Processor Extreme Edition Series and Intel® Core™ i7-900 Desktop Processor Series - The entire product, including processor substrate and integrated heat spreader (IHS). • 1366-land LGA package - The Intel Core™ i7-900 desktop processor Extreme Edition series and Intel Core™ i7-900 desktop processor series are available in a Flip-Chip Land Grid Array (FC-LGA) package, consisting of the processor mounted on a land grid array substrate with an integrated heat spreader (IHS). • LGA1366 Socket - The processor (in the LGA 1366 package) mates with the system board through this surface mount, 1366-contact socket. • DDR3 - Double Data Rate 3 Synchronous Dynamic Random Access Memory (SDRAM) is the name of the new DDR memory standard that is being developed as the successor to DDR2 SRDRAM. • Intel® QuickPath Interconnect (Intel QPI)- Intel QPI is a cache-coherent, point-to-point link based electrical interconnect specification for Intel processors and chipsets. • Integrated Memory Controller - A memory controller that is integrated into the processor die. • Integrated Heat Spreader (IHS) - A component of the processor package used to enhance the thermal performance of the package. Component thermal solutions interface with the processor at the IHS surface. • Functional Operation - Refers to the normal operating conditions in which all processor specifications, including DC, AC, signal quality, mechanical, and thermal, are satisfied. • Enhanced Intel SpeedStep® Technology - Enhanced Intel SpeedStep Technology allows the operating system to reduce power consumption when performance is not needed. • Execute Disable Bit - Execute Disable allows memory to be marked as executable or non-executable, when combined with a supporting operating system. If code attempts to run in non-executable memory the processor raises an error to the operating system. This feature can prevent some classes of viruses or worms that exploit buffer overrun vulnerabilities and can thus help improve the overall Datasheet