Intel BX80601920 Data Sheet - Page 93

Datasheet

93

Boxed Processor Specifications

8.4

Thermal Specifications

This section describes the cooling requirements of the fan heatsink solution used by the

boxed processor.

8.4.1

Boxed Processor Cooling Requirements

The boxed processor may be directly cooled with a fan heatsink. However, meeting the

processor's temperature specification is also a function of the thermal design of the

entire system, and ultimately the responsibility of the system integrator. The processor

temperature specification is found in

Chapter 6

of this document. The boxed processor

fan heatsink is able to keep the processor temperature within the specifications (see

Table 6-1

) in chassis that provide good thermal management. For the boxed processor

fan heatsink to operate properly, it is critical that the airflow provided to the fan

heatsink is unimpeded. Airflow of the fan heatsink is into the center and out of the

sides of the fan heatsink. Airspace is required around the fan to ensure that the airflow

through the fan heatsink is not blocked. Blocking the airflow to the fan heatsink

reduces the cooling efficiency and decreases fan life.

Figure 8-7

and

Figure 8-8

illustrate an acceptable airspace clearance for the fan heatsink. The air temperature

entering the fan should be kept below 40 ºC. Again, meeting the processor's

temperature specification is the responsibility of the system integrator.

Table 8-1.

Fan Heatsink Power and Signal Specifications

Description

Min

Typ

Max

Unit

Notes

+12 V: 12 volt fan power supply

10.8

12

13.2

V

-

IC:

- Peak steady-state fan current draw

- Average steady-state fan current draw

—

—

—

—

3.0

2.0

A

A

-

SENSE: SENSE frequency

—

2

—

pulses per fan

revolution

1

Notes:

1.

Baseboard should pull this pin up to 5V with a resistor.

CONTROL

21

25

28

kHz

2, 3

2.

Open drain type, pulse width modulated.

3.

Fan will have pull-up resistor for this signal to maximum of 5.25 V.

Figure 8-6.

Baseboard Power Header Placement Relative to Processor Socket

B

C

R110

[4.33]

Section	Page
Contents	3
Figures	4
Tables	5
Intel® Core™ i7-900 Desktop Processor Extreme Edition Series and Intel® Core™ i7-900 Desktop Processor Series Features	7
Revision History	8
1 Introduction	9
1.1 Terminology	10
1.2 References	11
2 Electrical Specifications	13
2.1 Intel® QPI Differential Signaling	13
2.2 Power and Ground Lands	13
2.3 Decoupling Guidelines	13
2.3.1 VCC, VTTA, VTTD, VDDQ Decoupling	14
2.4 Processor Clocking (BCLK_DP, BCLK_DN)	14
2.4.1 PLL Power Supply	14
2.5 Voltage Identification (VID)	14
2.6 Reserved or Unused Signals	17
2.7 Signal Groups	18
2.8 Test Access Port (TAP) Connection	19
2.9 Platform Environmental Control Interface (PECI) DC Specifications	20
2.9.1 DC Characteristics	20
2.9.2 Input Device Hysteresis	21
2.10 Absolute Maximum and Minimum Ratings	21
2.11 Processor DC Specifications	22
2.11.1 DC Voltage and Current Specification	23
2.11.2 VCC Overshoot Specification	29
2.11.3 Die Voltage Validation	30
3 Package Mechanical Specifications	31
3.1 Package Mechanical Drawing	31
3.2 Processor Component Keep-Out Zones	34
3.3 Package Loading Specifications	34
3.4 Package Handling Guidelines	34
3.5 Package Insertion Specifications	34
3.6 Processor Mass Specification	35
3.7 Processor Materials	35
3.8 Processor Markings	35
3.9 Processor Land Coordinates	36
4 Land Listing	37
5 Signal Descriptions	67
6 Thermal Specifications	71
6.1 Package Thermal Specifications	71
6.1.1 Thermal Specifications	71
6.1.2 Thermal Metrology	75
6.2 Processor Thermal Features	76
6.2.1 Processor Temperature	76
6.2.2 Adaptive Thermal Monitor	76
6.2.3 THERMTRIP# Signal	79
6.3 Platform Environment Control Interface (PECI)	79
6.3.1 Introduction	79
6.3.2 PECI Specifications	81
6.4 Storage Conditions Specifications	82
7 Features	83
7.1 Power-On Configuration (POC)	83
7.2 Clock Control and Low Power States	83
7.2.1 Thread and Core Power State Descriptions	84
7.2.2 Package Power State Descriptions	85
7.3 Sleep States	86
7.4 ACPI P-States (Intel® Turbo Boost Technology)	86
7.5 Enhanced Intel® SpeedStep® Technology	87
8 Boxed Processor Specifications	89
8.1 Introduction	89
8.2 Mechanical Specifications	90
8.2.1 Boxed Processor Cooling Solution Dimensions	90
8.2.2 Boxed Processor Fan Heatsink Weight	92
8.2.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly	92
8.3 Electrical Requirements	92
8.3.1 Fan Heatsink Power Supply	92
8.4 Thermal Specifications	93
8.4.1 Boxed Processor Cooling Requirements	93

Intel BX80601920 Data Sheet - Page 93

Thermal Specifications

Page 93 highlights