Intel BX80601920 Data Sheet - Page 34

Package Mechanical Specifications 3.2 Processor Component Keep-Out Zones The processor may contain components on the substrate that define component keepout zone requirements. A thermal and mechanical solution design must not intrude into the required keep-out zones. Decoupling capacitors are typically mounted to either the top-side or land-side of the package substrate. See Figure 3-2 and Figure 3-3 for keepout zones. The location and quantity of package capacitors may change due to manufacturing efficiencies but will remain within the component keep-in. 3.3 Package Loading Specifications . Table 3-1. Table 3-1 provides dynamic and static load specifications for the processor package. These mechanical maximum load limits should not be exceeded during heatsink assembly, shipping conditions, or standard use condition. Also, any mechanical system or component testing should not exceed the maximum limits. The processor package substrate should not be used as a mechanical reference or load-bearing surface for thermal and mechanical solution. Processor Loading Specifications Parameter Static Compressive Load Dynamic Compressive Load Maximum 934 N [210 lbf] 1834 N [410 lbf] [max static compressive + dynamic load] Notes 1, 2, 3 1, 3, 4 Notes: 1. These specifications apply to uniform compressive loading in a direction normal to the processor IHS. 2. This is the minimum and maximum static force that can be applied by the heatsink and retention solution to maintain the heatsink and processor interface. 3. These specifications are based on limited testing for design characterization. Loading limits are for the package only and do not include the limits of the processor socket. 4. Dynamic loading is defined as an 11 ms duration average load superimposed on the static load requirement. 3.4 Package Handling Guidelines Table 3-2 includes a list of guidelines on package handling in terms of recommended maximum loading on the processor IHS relative to a fixed substrate. These package handling loads may be experienced during heatsink removal. Table 3-2. Package Handling Guidelines Parameter Shear Tensile Torque Maximum Recommended 70 lbs 25 lbs 35 in.lbs Notes - - - 3.5 Package Insertion Specifications The processor can be inserted into and removed from an LGA1366 socket 15 times. The socket should meet the LGA1366 requirements detailed in the appropriate processor Thermal and Mechanical Design Guidelines (see Section 1.2) 34 Datasheet