Intel BX80601920 Data Sheet - Page 4

Intel BX80601920 - Core i7 2.66 GHz Processor Manual

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7 Features ...83 7.1 Power-On Configuration (POC 83 7.2 Clock Control and Low Power States 83 7.2.1 Thread and Core Power State Descriptions 84 7.2.2 Package Power State Descriptions 85 7.3 Sleep States ...86 7.4 ACPI P-States (Intel® Turbo Boost Technology 86 7.5 Enhanced Intel® SpeedStep® Technology 87 8 Boxed Processor Specifications 89 8.1 Introduction ...89 8.2 Mechanical Specifications 90 8.2.1 Boxed Processor Cooling Solution Dimensions 90 8.2.2 Boxed Processor Fan Heatsink Weight 92 8.2.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly .....92 8.3 Electrical Requirements 92 8.3.1 Fan Heatsink Power Supply 92 8.4 Thermal Specifications 93 8.4.1 Boxed Processor Cooling Requirements 93 8.4.2 Variable Speed Fan 95 Figures 1-1 High-Level View of Processor Interfaces 9 2-1 Active ODT for a Differential Link Example 13 2-2 Input Device Hysteresis 21 2-3 VCC Static and Transient Tolerance Load Lines 25 2-4 VTT Static and Transient Tolerance Load Line 27 2-5 VCC Overshoot Example Waveform 30 3-1 Processor Package Assembly Sketch 31 3-2 Processor Package Drawing (Sheet 1 of 2 32 3-3 Processor Package Drawing (Sheet 2 of 2 33 3-4 Processor Top-side Markings 35 3-5 Processor Land Coordinates and Quadrants (Bottom View 36 6-1 Processor Thermal Profile 73 6-2 Thermal Test Vehicle (TTV) Case Temperature (TCASE) Measurement Location ..........75 6-3 Frequency and Voltage Ordering 77 7-1 Power States...84 8-1 Mechanical Representation of the Boxed Processor 89 8-2 Space Requirements for the Boxed Processor (side view 90 8-3 Space Requirements for the Boxed Processor (top view 91 8-4 Space Requirements for the Boxed Processor (overall view 91 8-5 Boxed Processor Fan Heatsink Power Cable Connector Description 92 8-6 Baseboard Power Header Placement Relative to Processor Socket 93 8-7 Boxed Processor Fan Heatsink Airspace Keepout Requirements (top view 94 8-8 Boxed Processor Fan Heatsink Airspace Keepout Requirements (side view 94 8-9 Boxed Processor Fan Heatsink Set Points 95 4 Datasheet

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4
Datasheet
7
Features
..................................................................................................................
83
7.1
Power-On Configuration (POC)
.............................................................................
83
7.2
Clock Control and Low Power States
.....................................................................
83
7.2.1
Thread and Core Power State Descriptions
.................................................
84
7.2.2
Package Power State Descriptions
.............................................................
85
7.3
Sleep States
.....................................................................................................
86
7.4
ACPI P-States (Intel
®
Turbo Boost Technology)
.....................................................
86
7.5
Enhanced Intel
®
SpeedStep
®
Technology
.............................................................
87
8
Boxed Processor Specifications
................................................................................
89
8.1
Introduction
......................................................................................................
89
8.2
Mechanical Specifications
....................................................................................
90
8.2.1
Boxed Processor Cooling Solution Dimensions
.............................................
90
8.2.2
Boxed Processor Fan Heatsink Weight
.......................................................
92
8.2.3
Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly
.....
92
8.3
Electrical Requirements
......................................................................................
92
8.3.1
Fan Heatsink Power Supply
......................................................................
92
8.4
Thermal Specifications
........................................................................................
93
8.4.1
Boxed Processor Cooling Requirements
......................................................
93
8.4.2
Variable Speed Fan
.................................................................................
95
Figures
1-1
High-Level View of Processor Interfaces
.................................................................
9
2-1
Active ODT for a Differential Link Example
............................................................
13
2-2
Input Device Hysteresis
......................................................................................
21
2-3
VCC Static and Transient Tolerance Load Lines
......................................................
25
2-4
VTT Static and Transient Tolerance Load Line
........................................................
27
2-5
VCC Overshoot Example Waveform
......................................................................
30
3-1
Processor Package Assembly Sketch
.....................................................................
31
3-2
Processor Package Drawing (Sheet 1 of 2)
............................................................
32
3-3
Processor Package Drawing (Sheet 2 of 2)
............................................................
33
3-4
Processor Top-side Markings
...............................................................................
35
3-5
Processor Land Coordinates and Quadrants (Bottom View)
......................................
36
6-1
Processor Thermal Profile
....................................................................................
73
6-2
Thermal Test Vehicle (TTV) Case Temperature (TCASE) Measurement Location
..........
75
6-3
Frequency and Voltage Ordering
..........................................................................
77
7-1
Power States
.....................................................................................................
84
8-1
Mechanical Representation of the Boxed Processor
.................................................
89
8-2
Space Requirements for the Boxed Processor (side view)
........................................
90
8-3
Space Requirements for the Boxed Processor (top view)
.........................................
91
8-4
Space Requirements for the Boxed Processor (overall view)
....................................
91
8-5
Boxed Processor Fan Heatsink Power Cable Connector Description
............................
92
8-6
Baseboard Power Header Placement Relative to Processor Socket
.............................
93
8-7
Boxed Processor Fan Heatsink Airspace Keepout Requirements (top view)
.................
94
8-8
Boxed Processor Fan Heatsink Airspace Keepout Requirements (side view)
................
94
8-9
Boxed Processor Fan Heatsink Set Points
..............................................................
95