Intel BX80601920 Data Sheet - Page 95

Datasheet

95

Boxed Processor Specifications

8.4.2

Variable Speed Fan

If the boxed processor fan heatsink 4-pin connector is connected to a 3-pin

motherboard header it will operate as follows:

The boxed processor fan will operate at different speeds over a short range of

internal chassis temperatures. This allows the processor fan to operate at a lower

speed and noise level, while internal chassis temperatures are low. If internal

chassis temperature increases beyond a lower set point, the fan speed will rise

linearly with the internal temperature until the higher set point is reached. At that

point, the fan speed is at its maximum. As fan speed increases, so does fan noise

levels. Systems should be designed to provide adequate air around the boxed

processor fan heatsink that remains cooler then lower set point. These set points,

represented in

Figure 8-9

and

Table 8-2

, can vary by a few degrees from fan

heatsink to fan heatsink. The internal chassis temperature should be kept below

40 ºC. Meeting the processor temperature specification (see

Chapter 6

) is the

responsibility of the system integrator.

The motherboard must supply a constant +12 V to the processor's power header to

ensure proper operation of the variable speed fan for the boxed processor. Refer to

Table 8-1

for the specific requirements.

Figure 8-9.

Boxed Processor Fan Heatsink Set Points

Table 8-2.

Fan Heatsink Power and Signal Specifications

Boxed Processor Fan

Heatsink Set Point

(

°

C)

Boxed Processor Fan Speed

Notes

X



30

When the internal chassis temperature is below or equal to this set point,

the fan operates at its lowest speed. Recommended maximum internal

chassis temperature for nominal operating environment.

1

Notes:

1.

Set point variance is approximately ± 1



C from fan heatsink to fan heatsink.

Z



40

When the internal chassis temperature is above or equal to this set point,

the fan operates at its highest speed. Recommended maximum internal

chassis temperature for worst-case operating environment.

-

Lowest Noise Level

Internal Chassis Temperature (Degrees C)

X

Z

Increasing Fan

Speed & Noise

Higher Set Point

Highest Noise Level

Section	Page
Contents	3
Figures	4
Tables	5
Intel® Core™ i7-900 Desktop Processor Extreme Edition Series and Intel® Core™ i7-900 Desktop Processor Series Features	7
Revision History	8
1 Introduction	9
1.1 Terminology	10
1.2 References	11
2 Electrical Specifications	13
2.1 Intel® QPI Differential Signaling	13
2.2 Power and Ground Lands	13
2.3 Decoupling Guidelines	13
2.3.1 VCC, VTTA, VTTD, VDDQ Decoupling	14
2.4 Processor Clocking (BCLK_DP, BCLK_DN)	14
2.4.1 PLL Power Supply	14
2.5 Voltage Identification (VID)	14
2.6 Reserved or Unused Signals	17
2.7 Signal Groups	18
2.8 Test Access Port (TAP) Connection	19
2.9 Platform Environmental Control Interface (PECI) DC Specifications	20
2.9.1 DC Characteristics	20
2.9.2 Input Device Hysteresis	21
2.10 Absolute Maximum and Minimum Ratings	21
2.11 Processor DC Specifications	22
2.11.1 DC Voltage and Current Specification	23
2.11.2 VCC Overshoot Specification	29
2.11.3 Die Voltage Validation	30
3 Package Mechanical Specifications	31
3.1 Package Mechanical Drawing	31
3.2 Processor Component Keep-Out Zones	34
3.3 Package Loading Specifications	34
3.4 Package Handling Guidelines	34
3.5 Package Insertion Specifications	34
3.6 Processor Mass Specification	35
3.7 Processor Materials	35
3.8 Processor Markings	35
3.9 Processor Land Coordinates	36
4 Land Listing	37
5 Signal Descriptions	67
6 Thermal Specifications	71
6.1 Package Thermal Specifications	71
6.1.1 Thermal Specifications	71
6.1.2 Thermal Metrology	75
6.2 Processor Thermal Features	76
6.2.1 Processor Temperature	76
6.2.2 Adaptive Thermal Monitor	76
6.2.3 THERMTRIP# Signal	79
6.3 Platform Environment Control Interface (PECI)	79
6.3.1 Introduction	79
6.3.2 PECI Specifications	81
6.4 Storage Conditions Specifications	82
7 Features	83
7.1 Power-On Configuration (POC)	83
7.2 Clock Control and Low Power States	83
7.2.1 Thread and Core Power State Descriptions	84
7.2.2 Package Power State Descriptions	85
7.3 Sleep States	86
7.4 ACPI P-States (Intel® Turbo Boost Technology)	86
7.5 Enhanced Intel® SpeedStep® Technology	87
8 Boxed Processor Specifications	89
8.1 Introduction	89
8.2 Mechanical Specifications	90
8.2.1 Boxed Processor Cooling Solution Dimensions	90
8.2.2 Boxed Processor Fan Heatsink Weight	92
8.2.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly	92
8.3 Electrical Requirements	92
8.3.1 Fan Heatsink Power Supply	92
8.4 Thermal Specifications	93
8.4.1 Boxed Processor Cooling Requirements	93

Intel BX80601920 Data Sheet - Page 95

Variable Speed Fan

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