Intel BX80601920 Data Sheet - Page 35
Processor Mass Specification, Processor Materials, Processor Markings
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Package Mechanical Specifications 3.6 Processor Mass Specification The typical mass of the processor is 35g. This mass [weight] includes all the components that are included in the package. 3.7 Processor Materials Table 3-3 lists some of the package components and associated materials. Table 3-3. Processor Materials Component Integrated Heat Spreader (IHS) Substrate Substrate Lands Material Nickel Plated Copper Fiber Reinforced Resin Gold Plated Copper 3.8 Processor Markings Figure 3-4 shows the top-side markings on the processor. This diagram is to aid in the identification of the processor. Figure 3-4. Processor Top-side Markings INTEL M ©'07 PROC# BRAND SLxxx [COO] SPEED/CACHE/INTC/FMB [FPO] e4 S/N Datasheet 35
Datasheet
35
Package Mechanical Specifications
3.6
Processor Mass Specification
The typical mass of the processor is 35g. This mass [weight] includes all the
components that are included in the package.
3.7
Processor Materials
Table 3-3
lists some of the package components and associated materials.
3.8
Processor Markings
Figure 3-4
shows the top-side markings on the processor. This diagram is to aid in the
identification of the processor.
Table 3-3.
Processor Materials
Component
Material
Integrated Heat Spreader (IHS)
Nickel Plated Copper
Substrate
Fiber Reinforced Resin
Substrate Lands
Gold Plated Copper
Figure 3-4.
Processor Top-side Markings
S/N
INTEL
©'07 PROC#
BRAND
SLxxx [COO]
SPEED/CACHE/INTC/FMB
[FPO]
M
e
4