Intel BX80601920 Data Sheet - Page 31

Package Mechanical Specifications 3 Package Mechanical Specifications The processor is packaged in a Flip-Chip Land Grid Array package that interfaces with the motherboard using an LGA1366 socket. The package consists of a processor mounted on a substrate land-carrier. An integrated heat spreader (IHS) is attached to the package substrate and core and serves as the mating surface for processor thermal solutions, such as a heatsink. Figure 3-1 shows a sketch of the processor package components and how they are assembled together. Refer to the appropriate processor Thermal and Mechanical Design Guidelines (see Section 1.2) for complete details on the LGA1366 socket. The package components shown in Figure 3-1 include the following: • Integrated Heat Spreader (IHS) • Thermal Interface Material (TIM) • Processor core (die) • Package substrate • Capacitors Figure 3-1. Processor Package Assembly Sketch IHS Die TIM 3.1 Substrate Capacitors LGA1366 Socket System Board Note: 1. Socket and motherboard are included for reference and are not part of the processor package. Package Mechanical Drawing The package mechanical drawings are shown in Figure 3-2 and Figure 3-3. The drawings include dimensions necessary to design a thermal solution for the processor. These dimensions include: • Package reference with tolerances (total height, length, width, etc.) • IHS parallelism and tilt • Land dimensions • Top-side and back-side component keep-out dimensions • Reference datums • All drawing dimensions are in mm. • Guidelines on potential IHS flatness variation with socket load plate actuation and installation of the cooling solution is available in the appropriate processor Thermal and Mechanical Design Guidelines (see Section 1.2). Datasheet 31