Intel BX80601920 Data Sheet - Page 3

Contents 1 Introduction ...9 1.1 Terminology ...10 1.2 References ...11 2 Electrical Specifications 13 2.1 Intel® QPI Differential Signaling 13 2.2 Power and Ground Lands 13 2.3 Decoupling Guidelines 13 2.3.1 VCC, VTTA, VTTD, VDDQ Decoupling 14 2.4 Processor Clocking (BCLK_DP, BCLK_DN 14 2.4.1 PLL Power Supply 14 2.5 Voltage Identification (VID 14 2.6 Reserved or Unused Signals 17 2.7 Signal Groups 18 2.8 Test Access Port (TAP) Connection 19 2.9 Platform Environmental Control Interface (PECI) DC Specifications 20 2.9.1 DC Characteristics 20 2.9.2 Input Device Hysteresis 21 2.10 Absolute Maximum and Minimum Ratings 21 2.11 Processor DC Specifications 22 2.11.1 DC Voltage and Current Specification 23 2.11.2 VCC Overshoot Specification 29 2.11.3 Die Voltage Validation 30 3 Package Mechanical Specifications 31 3.1 Package Mechanical Drawing 31 3.2 Processor Component Keep-Out Zones 34 3.3 Package Loading Specifications 34 3.4 Package Handling Guidelines 34 3.5 Package Insertion Specifications 34 3.6 Processor Mass Specification 35 3.7 Processor Materials 35 3.8 Processor Markings 35 3.9 Processor Land Coordinates 36 4 Land Listing...37 5 Signal Descriptions 67 6 Thermal Specifications 71 6.1 Package Thermal Specifications 71 6.1.1 Thermal Specifications 71 6.1.2 Thermal Metrology 75 6.2 Processor Thermal Features 76 6.2.1 Processor Temperature 76 6.2.2 Adaptive Thermal Monitor 76 6.2.3 THERMTRIP# Signal 79 6.3 Platform Environment Control Interface (PECI 79 6.3.1 Introduction 79 6.3.2 PECI Specifications 81 6.4 Storage Conditions Specifications 82 Datasheet 3